JP2582256Y2 - Composite semiconductor device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite semiconductor device of the type in which an insulating case is filled with a resin and electronic components and the like are sealed with a resin.

[0002]

2. Description of the Related Art The structure of a composite semiconductor device of this type is schematically shown in a perspective view of FIG. 5 and a schematic sectional view of FIG. In these figures, the composite semiconductor device 1 has a metal radiator plate 2, and a circuit board 3 is fixed on the radiator plate 2 by soldering.
The circuit board 3 is made of an insulator, mainly a ceramic plate, and a metal layer is formed on the entire lower surface thereof so that it can be soldered to the heat sink 2. Circuit board 3
A conductive pattern layer (not shown) made of metal is formed on the upper surface of the circuit board. Electronic components such as semiconductor chips are mounted and fixed on the conductive pattern layer. A main terminal 4 and a signal terminal 5 for leading out are fixed by soldering.

An insulating case 6 having openings at both ends is fixed to the outer peripheral edge of the heat sink 2. The inside of the insulating case 6 is filled with a silicone rubber-based gel coating agent 7 to such an extent that a semiconductor chip and other electronic components are buried. After the thermosetting resin such as the epoxy resin 8 is filled on the gel coating agent 7, the lid 9 through which the main terminal 4 and the signal terminal 5 are inserted is arranged so as to close the opening end of the insulating case 6. Is fixed by an epoxy resin 8. The inside of the upper end opening of the insulating case 6 is provided with a concave
Is provided, and the epoxy resin 8 enters the concave portion 10 so as to function to prevent the resin 8 from coming off. Main terminal 4 led out from lid 9
Is bent at a substantially right angle on the upper surface of the lid 9 to complete the composite semiconductor device 1 as shown in FIG.

[0004]

By the way, when the composite semiconductor device having the structure shown in FIGS. 5 and 6 is actually operated by passing a current, the semiconductor chip and other electronic components mounted and fixed on the circuit board 3 are operated. Is released to the outside through the radiator plate 2. However, when an overload operation exceeding the rating is performed, the calorific value increases accordingly. In such a case, the swelling amount of the gel-like coating agent 7 increases, and increases by about 10%, and the volume exceeds the allowable amount. As a result, stress is applied to the electronic components buried in the gel coating agent 7, and in the worst case, the electronic components such as semiconductor chips are destroyed. Further, the fixing portion between the heat radiating plate 2 and the insulating case 6 may come off due to the expansion of the gel coating agent 7. Further, there is a problem to be solved such that the epoxy resin 8 is pushed upward and the epoxy resin 8 protrudes from the upper end of the insulating case 6 and may impair the product appearance.

[0005]

The purpose of the present invention is to solve the above-mentioned problem, and the gel-like coating agent 7 expands due to heat generated from electronic components such as semiconductor chips mounted and fixed on a circuit board. It is an object of the present invention to provide a composite semiconductor device which does not destroy the electronic component and does not impair the appearance of the product due to the protrusion of the epoxy resin.

[0006]

In the composite semiconductor device of the present invention, a circuit board is fixed on an upper surface of a heat sink, and electronic components, main terminals for external derivation and signal terminals are mounted on the circuit board. One end of an insulating case having both ends opened is fixed to the outer periphery of the heat sink, the other end opening is covered with a lid through which the main terminal and the signal terminal penetrate, and the bottom part inside the insulating case covers the electronic component. In the composite semiconductor device in which the gel-like coating agent is filled ,
Position that closes the upper opening when the main terminal is bent over the lid
A through-hole for escaping the gel-like coating agent is provided at the position, the gel-like coating agent is filled up to the lower portion of the through-hole, and a thermosetting resin is provided on the upper portion of the gel-like coating agent except for the through-hole portion. It is characterized by being filled and cured.

[0007]

In the composite semiconductor device of the present invention, a through-hole is provided in a part of the lid, and the lower end thereof is opened to the upper surface of the gel-like coating agent. Even when expanded, the increased volume can be absorbed by the through holes. For this reason, stress due to expansion is not applied to the electronic component, and there is no risk of destruction or the like, and reliability is improved. Also, since it will not push up the epoxy resin filled on the gel coating agent,
It does not impair the product appearance.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to FIGS. In the figure, since the composite semiconductor device 1 has the same configuration as the conventional one except for the configuration of the lid 9, the same portions are denoted by the same reference numerals and the detailed description thereof will be omitted. Therefore, in the following, the lid 9
Its features will be described focusing on the configuration. The lid 9 has a plurality of
In the figure, three terminal pedestals 91 are arranged at predetermined intervals, and adjacent terminal pedestals 91 are connected to each other by a frame 92. Thus, an opening 93 surrounded by the terminal pedestal 91 and the frame 92 is formed in the lid 9. The terminal base 91 is provided with a main terminal lead-out hole 94 and a bottomed nut storage hole 95, respectively.

Between the main terminal lead-out hole 94 and the bottomed nut storage hole 95, there is provided a through-hole 96 for escaping the gel-like coating agent, which penetrates the terminal base 91. This location
The upper opening of the through-hole 96 is formed by bending the main terminal 4.
Therefore, it will be closed.

[0010] The lid 9 having the above-described structure is attached to the insulating case 6.
After that, the gel-like coating agent 7 is injected from the space 93 of the lid 9. As shown in FIG. 1, the injection amount of the coating agent 7 is determined by the cylindrical portion 99 formed on the lower surface of the lid 9.
Up to the lower end. Next, the epoxy resin 8 is injected onto the gel coating agent 7. The injection amount of the epoxy resin 8 is from the lower end of the cylindrical body 99 to the same plane as the upper end opening of the insulating case 6. Here, it should be noted that the epoxy resin 8 does not enter the through-hole 96 for escape of the gel-like coating agent. After the epoxy resin 8 is cured by heating, the bottomed nut storage hole 95 is formed.
The main terminal 4 is bent substantially at right angles to prevent deviation of the nut. Since the through-hole 96 is closed by bending the main terminal 4, the appearance of the finished product is not impaired by the exposure of the through-hole 96. Further, as another embodiment, the bottomed nut storage hole 95 can be used as the through hole 96. In this case, a hole that penetrates the lid 9 may be provided at the bottom of the nut storage hole 95, and a cylinder (not shown) similar to the cylinder 99 may be provided as necessary.

[0011]

As described above, in the composite semiconductor device of the present invention, the upper surface of the gel-like coating agent filled in the insulating case communicates with the outside through the through-hole for escape of the gel-like coating agent. Even if the gel-like coating agent expands due to heat generated by the mounted components on the circuit board, the gel-type coating agent can escape through the through-holes without applying stress to electronic components such as semiconductor chips. Therefore, peeling of the heat radiating plate, detachment of the epoxy resin, and the like are eliminated, so that the reliability is improved and the appearance of the product is not spoiled.

[Brief description of the drawings]

FIG. 1 is a composite semiconductor device showing an embodiment of the present invention; FIG.
FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 2 is a plan view of the composite semiconductor device.

FIG. 3 is a plan view of a lid used for the composite semiconductor device.

FIG. 4 is a sectional view taken along line AA of FIG. 3;

FIG. 5 is a schematic cross-sectional view of a conventional composite semiconductor device.

FIG. 6 is a perspective view of the conventional composite semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Composite semiconductor device 2 Heat sink 3 Circuit board 4 Main terminal 5 Signal terminal 6 Insulating case 7 Gel coating agent 8 Epoxy resin 9 Lid 91 Terminal pedestal part 92 Frame part 93 Empty part 94 Main terminal lead-out hole 95 Bottom nut Housing hole 96 Through hole for escape of gel-like coating agent 97, 98 Projection portion 99 Cylindrical portion 100 Through hole for signal terminal lead-out

Claims (1)

(57) [Scope of request for utility model registration] 1. A circuit board is fixed to an upper surface of a heat radiating plate, and electronic components, a main terminal for external lead-out and a signal terminal are mounted on the circuit board, and one end of an insulating case having both ends opened around the heat radiating plate. Is fixed, the other end opening is covered with a lid penetrating the main terminal and the signal terminal, and the bottom inside the insulating case is filled with a gel-like coating agent to cover the electronic component. , Provided on a part of the lid, and the main terminal is disposed on the lid.
Gel coat at the position to close the upper opening when folded
A through hole for releasing the agent is provided, a gel-like coating agent is filled up to a lower portion of the through-hole, and an upper portion of the gel-like coating agent is filled and cured with the thermosetting resin except for the through-hole portion. Composite semiconductor device.