JPH0611356U - Composite semiconductor device - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent electronic parts from being destroyed even when the gel coating agent expands, and to prevent the appearance of the product from being damaged by the protrusion of the epoxy resin. [Structure] A through hole 96 for escaping the gel-like coating agent is provided in a part of the lid body 9, and a lower end of the through-hole 96 is opened on an upper surface of the gel-like coating agent 7. As a result, even if the gel coating agent 7 expands due to the heat generated from the electronic component, the increased volume can be absorbed by the through holes. For this reason, stress due to expansion is not applied to the electronic component, there is no fear of breakage, and reliability is improved. Further, since the epoxy resin filled on the gel coating agent is not pushed up, the appearance of the product is not spoiled.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a composite semiconductor device of a type in which an insulating case is filled with resin to seal an electronic component or the like with resin.

[0002]

[Prior art]

 An outline of the structure of this type of composite semiconductor device is shown in a perspective view of FIG. 5 and a schematic sectional view of FIG. In these figures, the composite semiconductor device 1 has a heat sink 2 made of metal, and a circuit board 3 is soldered and fixed onto the heat sink 2. The circuit board 3 is made of an insulating material, mainly a ceramic plate, and a metal layer is formed on the entire lower surface thereof so that it can be soldered to the heat dissipation plate 2. A conductor pattern layer (not shown) made of metal is formed on the upper surface of the circuit board 3, and electronic components such as semiconductor chips are mounted and fixed on the conductor pattern layer. The main terminals 4 and the signal terminals 5 for being led to the outside are fixed by soldering.

An insulating case 6 having openings at both ends is fixed to the outer peripheral edge of the heat dissipation plate 2. The inside of the insulating case 6 is filled with a silicone rubber-based gel-like coating agent 7 to the extent that semiconductor chips and other electronic components are buried. After the thermosetting resin such as the epoxy resin 8 is filled on the gel-like coating agent 7, the lid 9 in which the main terminal 4 and the signal terminal 5 are inserted is arranged so as to close the opening end of the insulating case 6. And is fixed by the epoxy resin 8. A recess 10 is provided inside the upper opening of the insulating case 6 if necessary, and the epoxy resin 8 enters the recess 10 to prevent the resin 8 from slipping upward. I am letting you. The main terminal 4 led out from the lid 9 is bent at a substantially right angle on the upper surface of the lid 9 to complete the composite semiconductor device 1 as shown in FIG.

[0004]

[Problems to be solved by the device]

 By the way, when the composite semiconductor device having the structure shown in FIG. 5 and FIG. 6 is actually operated by applying an electric current, the heat generated from the semiconductor chip mounted on the circuit board 3 and the other electronic components is radiated. It is released to the outside via 2. However, when overloaded operation exceeds the rated value, the amount of heat generated increases accordingly. In such a case, the amount of expansion of the gel-like coating agent 7 becomes large, increasing by about 10%, and the volume exceeds the allowable amount. As a result, stress is applied to the electronic components buried in the gel-like coating agent 7, and in the worst case, electronic components such as semiconductor chips are destroyed. Further, the fixed part between the heat sink 2 and the insulating case 6 may be peeled off due to the expansion of the gel coating agent 7. In addition, there is a problem to be solved such that the epoxy resin 8 is pushed upward and the epoxy resin 8 protrudes from the upper end of the insulating case 6 to impair the appearance of the product.

[0005]

[The purpose of the device]

 The present invention has been made in order to solve the above problems. Even if the gel coating agent 7 expands due to heat generated from electronic components such as semiconductor chips mounted and fixed on a circuit board, It is an object of the present invention to provide a composite semiconductor device that does not damage parts and does not spoil the appearance of the product due to the protrusion of epoxy resin.

[0006]

[Means for solving problems]

 In the composite semiconductor device of the present invention, a circuit board is fixed on the upper surface of the heat dissipation plate, electronic parts, main terminals for external lead-out and signal terminals are mounted on the circuit board, and both end openings are formed on the outer circumference of the heat dissipation plate. One end of the insulating case is fixed, the opening of the other end is covered with a lid that penetrates the main terminals and signal terminals, and the inner bottom of the insulating case is filled with a gel coating agent to cover electronic components. In the composite semiconductor device described above, a through hole for escaping the gel-like coating agent is provided in a part of the lid, and the gel-like coating agent is filled up to the lower part of the through-hole. It is characterized in that a thermosetting resin is filled and cured on the upper part of the coating agent.

[0007]

[Action]

 In the composite semiconductor device of the present invention, the through hole is provided in a part of the lid body, and the lower end of the through hole is opened on the upper surface of the gel-like coating material. Even when expanded, the increased volume can be absorbed by the through holes. For this reason, the stress due to expansion is not applied to the electronic component, there is no fear of breakage, and the reliability is improved. Further, since the epoxy resin filled on the gel coating agent is not pushed up, the appearance of the product is not spoiled.

[0008]

【Example】

 Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. In the figure, the composite semiconductor device 1 has the same structure as the conventional structure except for the structure of the lid body 9. Therefore, the same parts are denoted by the same reference numerals and detailed description thereof will be omitted. Therefore, the features of the lid 9 will be mainly described below. In the lid 9, a plurality of, in the figure, three terminal pedestals 91 are arranged at predetermined intervals, and adjacent terminal pedestals 91 are connected to each other by a frame 92. As a result, the lid 9 is formed with an opening 93 surrounded by the terminal pedestal 91 and the frame 92. The terminal pedestal portion 91 is provided with a main terminal lead-out hole 94 and a bottomed nut storage hole 95, respectively.

Between the main terminal lead-out hole 94 and the bottomed nut accommodating hole 95, a through hole 96 for escaping the gel coating agent that penetrates the terminal pedestal 91 is provided. On the lower surface of the lid 9 provided with the through hole 96, a cylindrical body portion 99 protruding downward is provided. Protrusions 97 and 98 are provided outward from the terminal pedestals 91 at both ends of the lid 9, respectively, and one of the protrusions 97 is formed with a through hole 100 for leading out the signal terminal 5.

After the lid 9 having the above-described structure is covered on the open end of the insulating case 6, the gel coating agent 7 is injected from the space 93 of the lid 9. The injection amount of the coating agent 7 is up to the lower end portion of the cylindrical body portion 99 formed on the lower surface of the lid body 9 as shown in FIG. Then, the epoxy resin 8 is injected onto the gel-like coating agent 7. The amount of epoxy resin 8 injected is from the lower end of the cylindrical body 99 to the same plane as the upper opening of the insulating case 6. Here, it should be noted that the epoxy resin 8 does not enter the through holes 96 for escaping the gel coating agent. After the epoxy resin 8 is hardened by heating, a nut (not shown) is housed in the bottomed nut housing hole 95, and the main terminal 4 is bent at a substantially right angle to prevent the nut from deviating. Since the through hole 96 is closed by bending the main terminal 4, the appearance of the finished product is not damaged by the exposure of the through hole 96. Further, as another embodiment, it is possible to use the bottomed nut storage hole 95 as the through hole 96. In this case, a hole penetrating the lid body 9 may be provided in the bottom portion of the nut storage hole 95, and if necessary, a tubular body portion (not shown) similar to the tubular body portion 99 may be provided.

[0011]

[Effect of device]

 As described above, in the composite semiconductor device of the present invention, the upper surface of the gel-like coating agent filled in the insulating case is communicated with the outside through the through-hole for escape of the gel-like coating agent. Even if the gel-like coating agent expands due to the heat generation of the mounted component, the through hole can escape without applying stress to the electronic component such as a semiconductor chip. Therefore, the peeling of the heat sink, the removal of the epoxy resin, etc. are eliminated, and the reliability is improved, and the appearance of the product is not damaged.

[Brief description of drawings]

FIG. 1 is a view showing a composite semiconductor device according to an embodiment of the present invention.
It is sectional drawing which follows the AA line in FIG.

FIG. 2 is a plan view of the composite semiconductor device.

FIG. 3 is a plan view of a lid body used in the composite semiconductor device.

4 is a sectional view taken along the line AA of FIG.

FIG. 5 is a schematic sectional view of a conventional composite semiconductor device.

FIG. 6 is a perspective view of the conventional composite semiconductor device.

[Explanation of symbols]

 1 Composite Semiconductor Device 2 Heat Sink 3 Circuit Board 4 Main Terminal 5 Signal Terminal 6 Insulation Case 7 Gel-like Coating Agent 8 Epoxy Resin 9 Lid 91 Terminal Block 92 Frame 93 Space Main Hole 94 Main Terminal Outlet Nut Storage hole 96 Through hole for escape of gel-like coating agent 97, 98 Projection portion 99 Cylindrical body portion 100 Through hole for leading out signal terminal

Claims (1)

[Scope of utility model registration request] 1. A circuit board is fixed to the upper surface of the heat sink, and an electronic component, a main terminal for external lead-out and a signal terminal are mounted on the circuit board, and an insulating case having openings at both ends is provided on the outer circumference of the heat sink. A composite semiconductor device in which one end is fixed, an opening at the other end is covered with a lid that penetrates a main terminal and a signal terminal, and a gel-like coating agent is filled in a bottom portion inside an insulating case so as to cover an electronic component. In, a part of the lid body is provided with a through hole for escape of the gel-like coating agent, the gel-like coating agent is filled up to the lower part of the through-hole, and the through-hole portion is removed, and the upper part of the gel-like coating agent is provided. , A composite semiconductor device in which a thermosetting resin is filled and cured.