JP4604860B2 - Electronic equipment and lighting equipment - Google Patents

Description

The present invention relates to an electronic device having excellent waterproof performance and a lighting fixture that includes a lighting device made of the electronic device and lights a discharge lamp.

  In a lighting fixture installed outdoors or in a high humidity environment, a lighting device for lighting a discharge lamp included in the fixture may be exposed to high humidity. The lighting device for this application is required to be waterproof.

  An inverter lighting device is an electronic device in which a plurality of electrical components and a wire connector are mounted on a circuit board. Conventionally, a technique for waterproofing an inverter lighting device using a waterproof case is known (see, for example, Patent Document 1).

The waterproof case used in this technology is formed of a cylindrical storage case and a side plate and stores the inverter lighting device. The side plates hermetically seal the opening portions at both ends of the cylindrical storage case made of an integrally molded product that has no seam in cross section.
Japanese Patent Laying-Open No. 2003-7212 (paragraphs 0004, 0005, 0008-0019, FIGS. 1 to 14, 17, and 19)

  In the technique of Patent Document 1, the inverter lighting device itself is assembled with a case that forms an outline thereof, and this lighting device is accommodated in a waterproof case. For this reason, the waterproof case which makes the outline of the whole lighting device is large. At the same time, in addition to the labor for assembling the inverter lighting device, the labor for housing the device in the cylindrical case and the labor for assembling the waterproof case are required. Therefore, the number of assembling steps for the lighting device is large. Therefore, as described above, in addition to an increase in cost due to the use of a large waterproof case itself, a large cost is required for assembly. Further, since the inverter lighting device generates heat, it is necessary to dissipate heat. However, the technique of Patent Document 1 does not describe heat dissipation.

An object of this invention is to provide a lightweight electronic device and lighting fixture while having waterproof performance and heat dissipation performance.

Electronic device of the invention according to claim 1, wherein the circuit connected primarily one surface is mounted on the component mounting surface and the circuit board and the substrate comprises a plurality of electrical components constituting the electronic circuit Rutotomoni, in the electronic circuit A circuit module further comprising: an input and output wire connector mounted on the substrate; and a connector cap that fits over the connectors and that allows the insulation-coated wires connected to the wire connector to pass through in a watertight manner ; component cover layer having an irregular surface to which recess recessed toward the component mounting surface covers the component mounting surface is formed, and has a rear cover layer covering the back surface of the circuit board, the entire said circuit board and waterproof resin material in which it is embedded the electric component; equipped with, to the outside from the resin member wherein the wire connector and the connector cap through said component cover layer Together has been issued, it is characterized in that the circuit board side portion of the connector cap in contact with the component mounting surface is embedded in the resin material.

  In the present invention and the following invention, one or more recesses on the uneven surface of the resin material can be provided. It is preferable to provide the recesses corresponding to the region where the arrangement density of the electrical components of the circuit module is low and the region where the electrical components such as the chip components are gathered. The recess may be provided continuously on the side wall of the resin material.

  In the present invention and the following invention, a synthetic resin such as a silicon resin, a urethane resin, an epoxy resin, an unsaturated polyester resin, or the like can be used as the resin material. Use of a urethane resin is preferable in that the material cost is low. When silicon resin, unsaturated polyester resin, or the like is used, higher heat dissipation can be obtained. In the present invention and the following invention, an electrical component such as a chip component may be surface-mounted on the back surface of the circuit board.

According to the first aspect of the present invention, the circuit board and electric parts of the circuit module are embedded in a waterproof resin material. For this reason, the circuit board and electric parts of the circuit module can be waterproofed by the resin material so as to withstand a high humidity environment. In addition, a waterproof case is not required for waterproofing the circuit module. Furthermore, since the concave portion is provided in the component cover layer of the resin material, the amount of the resin material used is reduced and the electronic device can be reduced in weight. Moreover, the heat of the electrical components that generate heat when the electronic device is used is transferred to the resin material and released from the surface of the resin material. The area for this heat dissipation can be increased by the recess of the component cover layer. Moreover, an electronic circuit and an electric wire can be electrically connected by inserting and connecting an electric wire to an electric wire connector. At the same time, waterproofing at the connection portion can be secured by the connector cap.

Electronic device of the invention according to claim 2, wherein the circuit connected primarily one surface is mounted on the component mounting surface and the circuit board and the substrate comprises a plurality of electrical components constituting the electronic circuit Rutotomoni, in the electronic circuit A circuit module further comprising: an input and output wire connector mounted on the substrate; and a connector cap that fits over the connectors and that allows the insulation-coated wires connected to the wire connector to pass through in a watertight manner A component cover layer that has a concave and convex surface that covers the component mounting surface and is recessed toward the component mounting surface, and a back cover layer that covers the back surface of the circuit board, and the entire circuit board and gold housing the assembly has a hole-shaped portion for exposing the connector cap; of the waterproof assembly and including a waterproof resin material electrical components are embedded, the Made in the outer case; equipped with the with the wire connector and the connector cap is projected to the outside from the resin material through the component cover layer, the circuit of the connector cap in contact with the component mounting surface A substrate-side portion is embedded in the resin material .

In the invention of claim 2, the circuit board and the electrical component of the circuit module are embedded in a waterproof resin material. For this reason, the circuit board and electric parts of the circuit module can be waterproofed by the resin material so as to withstand a high humidity environment. In addition, a waterproof case is not required for waterproofing the circuit module. Furthermore, since the concave portion is provided in the component cover layer of the resin material, the amount of the resin material used is reduced and the electronic device can be reduced in weight. Moreover, the heat of the electrical components that generate heat when the electronic device is used is transferred to the resin material and released from the surface of the resin material. The area for this heat dissipation can be increased by the recess of the component cover layer. Moreover, in the invention of claim 2, the waterproof assembly including the circuit module and the resin material is accommodated in the metal outer case. For this reason, the heat of the resin material can be transmitted to the outer case through the contact between the outer case and the resin material, and can be discharged from the outer case. Moreover, an electronic circuit and an electric wire can be electrically connected by inserting and connecting an electric wire to an electric wire connector. At the same time, waterproofing at the connection portion can be secured by the connector cap.

A lighting fixture of the invention according to claim 3 is formed by a chassis; a lamp socket attached to the chassis; a discharge lamp removably supported by the socket; and an electronic device according to claim 1 or 2. And a lighting device for lighting the discharge lamp attached to the chassis by bringing a back cover layer into contact with the chassis.

  In the present invention, the lighting device may be one that turns on the discharge lamp in a normal state or turns on in an emergency such as a power failure.

According to the present invention, since the lighting device comprising the electronic device according to claim 1 or 2 is provided, it is possible to provide a lighting fixture having a waterproof performance and a heat dissipation performance and a lightweight lighting device.

According to the invention which concerns on Claim 1 and 2, while having waterproof performance and heat dissipation performance, a lightweight electronic device can be provided.

According to the invention which concerns on Claim 3 , it has waterproof performance and heat dissipation performance, and can provide the lighting fixture provided with the lightweight lighting device.

  A first embodiment of the present invention will be described with reference to FIGS.

  The luminaire denoted by reference numeral 1 in FIG. 1 is used with a favorable waterproof property as an outdoor lamp, a tunnel lamp installed in a tunnel, an eaves lamp of a station building, or the like. The luminaire 1 includes a chassis 2, a lamp socket 3, a discharge lamp such as a straight tube fluorescent lamp 4, and a waterproof electronic device such as a waterproof lighting device 5. The lighting device 5 functions as an electronic ballast for lighting the fluorescent lamp 4.

  The chassis 2 illustrated in FIG. 1 is made of metal and has a rectangular parallelepiped shape. The lamp sockets 3 protrude downward, for example, at both ends in the longitudinal direction of the chassis 2. The fluorescent lamp 4 is detachably supported by the lamp socket 3. A lighting device 5 for lighting the fluorescent lamp 4 is built in the chassis 2.

  As shown in FIGS. 2 to 5, the lighting device 5 includes an outer case 11 and a waterproof assembly 31. The waterproof assembly 31 includes a circuit module 21 and a resin material 55.

  The outer case 11 has an accommodation base 12 and a cover 15 connected thereto. This outer case 11 does not require waterproofing. As shown in FIG. 4, the housing base 12 and the cover 15 are connected by, for example, hooking a bent piece 12 c of the housing base 12 to a receiving portion 15 d of the cover 15. The receiving part 15d consists of a concave notch.

  The housing base 12 and the cover 15 can be made of synthetic resin, but are preferably made of a metal, for example, an aluminum alloy excellent in heat dissipation, in order to obtain heat dissipation performance to the outside. It can replace with this and the accommodation base 12 and the cover 15 can also be made from ferrous metal with a low material cost.

  As shown in FIGS. 2 to 4, the storage base 12 includes a base wall 12 a and side walls 12 b that are bent at right angles from both edges in the width direction. The overall length of the housing base 12 is longer than the circuit board 22 described later. Fixed portions 13 are formed at both longitudinal ends of the base wall 12a. The fixing portion 13 is formed by a hole or a notch. The lighting device 5 is attached to the chassis 2 by bringing the base wall 12 a into contact with the chassis 2 by a fixing part such as a screw passing through these fixing parts 13. The housing base 12 functions as a heat transfer surface to the chassis 2.

  As shown in FIGS. 2 to 5, the cover 15 includes, for example, a cover main wall 15a, a side wall 15b, and an end wall 15c. The cover main wall 15 a has portions bent obliquely on both sides in the width direction of the cover 15. The side wall 15b is bent from these portions. The end walls 15c are bent at right angles from both longitudinal ends of the cover main wall 15a. The end wall 15c is provided so as to close both ends in the longitudinal direction of the recumbent shape formed by the cover main wall 15a and the side wall 15b. The end wall 15c has a V-shaped notch 15e. The notch 15e functions as a relief that suppresses interference between the head of the tool and the end wall 15c, and the tool is used when passing a fixing component such as a screw through the fixing portion 13.

  The cover 15 is formed shorter than the housing base 12 to the extent that the fixing portion 13 is exposed. The side wall 15 b of the cover 15 is in contact with the inner surface of the side wall 12 b of the housing base 12. The accommodation base 12 and the cover 15 can conduct heat through the side walls 12b and 15b in contact with each other.

  A hole 16 is formed at one end of the cover 15 in the longitudinal direction. A hole 17 is opened at the other longitudinal end of the cover 15. These hole-shaped parts 16 and 17 are quadrangular. One hole 16 is provided to expose a connector cap 43 on the input side, which will be described later. The other hole-like portion 17 is provided to expose an output-side connector cap 44 described later.

  The circuit module 21 for lighting the fluorescent lamp 4 includes an electrically insulating circuit board 22, a lighting circuit 23 (see FIG. 8), an input wire connector 24, and an output wire connector 25.

  The circuit board 22 is electrically insulating and has a long rectangular shape that fits within the cover 15. One surface forming the surface of the circuit board 22 is used as a component mounting surface 22a. The other surface forming the back surface of the circuit board 22 is used as a soldering surface 22b, for example. A circuit pattern is printed on the soldering surface 22b. The soldering surface 22b is covered with an insulating resist layer (not shown).

  The circuit board 22 has, for example, a plurality of cutouts 22c as resin material passing portions over the front and back surfaces. These notches 22c are respectively provided on both side edges of the circuit board 22 as shown in FIGS. These notches 22c avoid circuit patterns. The resin material passing portion may be provided anywhere as long as the circuit pattern is not cut off. Further, the resin material passage portion can be formed by a hole located between both side edges of the circuit board 22 and can be used in combination with the hole and the notch.

  The lighting circuit 23 is a combination of a circuit pattern and a plurality of electrical components 26 (see FIGS. 5 and 9 and the like) connected to the circuit pattern, and includes an inverter circuit unit, for example. Examples of the electrical component 26 include a semiconductor such as a power transistor, a resistor, a capacitor, a coil, a transformer, a diode, and other various chip components.

  Reference numeral 26a in FIG. 9 denotes a power transistor which is one of the electrical components 26, which is accompanied by heat generation. Reference numeral 27 denotes a heat sink thermally connected to the power transistor 26a. The heat radiating plate 27 is erected along one side edge of the circuit board 22 so as to be perpendicular to the component mounting surface 22 a and slightly protrudes outside the side edge of the circuit board 22.

  The lighting circuit 23 is formed over both front and back surfaces of the intermediate portion excluding both longitudinal ends of the circuit board 22. Most of the electrical components constituting the lighting circuit 23 are mounted on the component mounting surface 22a. The electrical component 26 includes a plurality of electrical components mounted on the circuit board 22 by flow soldering in addition to the surface mounting components such as chip components. An electrical component to be subjected to flow soldering has a pin-like terminal 29 that penetrates the circuit board 22. The electrical component to be flow soldered is mounted on the circuit board 22 by passing the circuit board 22 through the flow solder layer and soldering the terminals 29 to each land of the circuit pattern.

  As shown in FIG. 9, the input (high voltage side) electric wire connector 24 is soldered to one end of the circuit board 22 in the longitudinal direction. The output (low voltage side) electric wire connector 25 is soldered to the other longitudinal end of the circuit board 22. These electric wire connectors 24 and 25 also have pin-like terminals 30. The electric wire connectors 24 and 25 together with the electric parts having the terminals 29 are mounted on the circuit board 22 by flow soldering. A core wire of a power supply-side insulation-coated electric wire (not shown) is inserted and connected to the electric wire connector 24. A core wire of an insulation coated electric wire (not shown) for wiring in the instrument is inserted and connected to the electric wire connector 25.

  Reference numeral 35 in FIGS. 5 and 9 indicates a component cap. The component cap 35 is formed of an electrical insulator such as hard synthetic resin or synthetic rubber. The component cap 35 is covered with a part of the electrical components, and is provided so that the resin material 55 does not contact the electrical components. The electrical component isolated from the resin material 55 by the component cap 35 is an electrical component that is not preferably embedded in contact with the resin material 55. An example of this type of electrical component is an electrolytic capacitor 26b. The electrical component 26 covered with the component cap 35 may or may not contact the inner surface of the component cap 35.

  The opening surface of the component cap 35 is in contact with the component mounting surface 22 a of the circuit board 22. It is preferable to fix the component cap 35 to the component mounting surface 22a with an adhesive (not shown). Thereby, it is possible to obtain a sealing function that prevents the component cap 35 from being held on the circuit board 22 and prevents the uncured resin material from entering the component cap 35.

  Reference numerals 43 and 44 denote connector caps. These connector caps 43 and 44 can be made of synthetic resin or rubber. An example of the synthetic rubber for forming the connector caps 43 and 44 is ethylene propylene rubber (EPDM). One connector cap 43 is tightly fitted to the input wire connector 24 by its elastic deformation. The other connector cap 44 is tightly fitted to the output wire connector 25 due to its elastic deformation.

  The open end faces 43 a and 44 a of the connector caps 43 and 44 are in contact with the component mounting surface 22 a of the circuit board 22. The connector caps 43 and 44 are preferably fixed to the component mounting surface 22a with an adhesive (not shown). Accordingly, the gap between the connector caps 43 and 44 and the circuit board 22 can be sealed to prevent the uncured resin material from entering the connector caps 43 and 44. The outer peripheral surfaces of the connector caps 43 and 44 have a stepped portion 45 as shown in FIGS. The step portion 45 is formed close to the open end faces 43a and 44a.

  As shown in FIGS. 5 and 9, the connector caps 43 and 44 each have a plurality of electric wire insertion portions 46 into which the terminal portions of the insulated coated electric wires for power supply or in-instrument wiring are inserted. The electric wire insertion part 46 has a thin part with a small hole. A plurality of annular protrusions (not shown) are provided on the inner surface of the wire insertion portion 46.

  The core wire and the terminal part exposed at the terminal part of the electric wire can be inserted into the electric wire insertion part 46 by pushing the thin part. With this insertion, the outer periphery of the wire terminal portion is brought into close contact with each annular protrusion, thereby achieving watertightness. The core wire of the electric wire end portion inserted into the electric wire insertion portion 46 is inserted into the electric wire connector 24 or 25. The inserted core wire is inserted into a terminal (not shown) built in the electric wire connectors 24 and 25 to be electrically and mechanically connected. The terminals are connected to the circuit pattern.

  The resin material 55 is made of a synthetic resin having electrical insulation and waterproofness. In this embodiment, a urethane resin mixed with a filler (not shown) is used. The filler is made of an inorganic material such as aluminum oxide. The mixing of the filler is preferable for improving the heat dissipation of the resin material 55. The resin material 55 embeds the circuit board 22 and the electrical component 26 of the circuit module 21.

  As shown in FIGS. 3 and 5, the resin material 55 has a component cover layer 55a and a back cover layer 55b, and the component cover layer 55a and the back cover layer 55b are integrally continuous. The component cover layer 55 a covers the component mounting surface 22 a of the circuit board 22. The back cover layer 55 b covers the soldering surface 22 b that forms the back surface of the circuit board 22.

  As shown in FIGS. 5 and 7, the component cover layer 55 a is formed with recesses 48 to 52. The concave portions 48 to 52 are gathered, for example, in the central portion in the longitudinal direction of the component cover layer 55a. These recesses 48 to 52 are recessed toward the component mounting surface 22a. The recesses 48 to 52 are provided corresponding to a region where the arrangement density of the electrical components 26 of the circuit module 21 is low and a region where electrical components such as chip components are gathered.

  Therefore, the component cover layer 55a is bumpy, and this bumpy shape depends on the arrangement and height of the electric component 26. The concave / convex surface 31c (see FIG. 7) of the component cover layer 55a is preferably formed in a convex and concave shape formed by the electrical components 26 mounted on the component mounting surface 22a. Thereby, it is possible to further reduce the amount of the resin material 55 used. As shown in FIG. 7, the heat radiating plate 27 is flush with the side surface of the component cover layer 55a.

  The terminals 29 and 30 are embedded in the back cover layer 55b. The surface of the back cover layer 55b is preferably a flat surface. However, this surface can be formed according to the shape of the member it contacts. Further, the back cover layer 55b may have a groove-like or hole-like dent opened on the surface thereof.

  Next, a method for manufacturing the waterproof assembly 31 will be described with reference to FIGS. This manufacturing method includes a setting process, a filling process, a curing process, and a release process.

  In the setting process, the circuit module 21 is set in the mold 65 shown in FIGS. Prior to this setting, a component cap 35 is attached to the component mounting surface 22a so as to cover the electrolytic capacitor 26b. Further, the connector cap 43 is already fitted on the wire connector 24. Similarly, a connector cap 44 is fitted on the electric wire connector 25.

  The mold 65 is made of metal, and its upper surface is opened. The shape of the opening is slightly larger than the circuit board 22. A plurality of convex portions 58 to 62 are formed on the bottom portion of the mold 65 upward. The convex portions 58 to 62 are provided corresponding to the concave portions 48 to 52, respectively. Substrate placement portions 63 and 64 are formed at both ends in the longitudinal direction of the mold 65. The substrate mounting parts 63 and 64 are higher than the convex parts 58 to 62.

  A set hole 63a is formed in the upper wall of the substrate platform 63, and similarly, a set hole 64a is also formed in the upper wall of the substrate platform 64. The set hole 63 a is smaller than the step 45 of the connector cap 43. Cap portions other than the step 45 of the connector cap 43 can be inserted through the set hole 63a. Similarly, the set hole 64 a is smaller than the step 45 of the connector cap 44. Cap portions other than the step 45 of the connector cap 44 can be inserted through the set hole 63a.

  In the setting process, the circuit module 21 is disposed in the mold 65 with its component mounting surface 22a facing downward. In this case, the connector cap 43 is passed through the set hole 63a, and the connector cap 44 is passed through the set hole 64a. Accordingly, the set hole 63 a is blocked by the step 45 of the connector cap 43, and the set hole 64 a is blocked by the step 45 of the connector cap 44.

  Therefore, both end portions of the circuit board 22 are supported on the substrate mounting portions 63 and 64 by using the step portion 45 as a spacer, and the circuit module 21 is positioned at a predetermined position of the molding die 65. Thereby, the convex portions 58 to 62 of the molding die 65 are formed in the region where the arrangement density of the electrical components 26 of the circuit module 21 is low and the region where the electrical components such as chip components are gathered and arranged. Each is opposite.

  Thus, the terminals 29 of the electrical components 26 of the circuit module 21 and the terminals 30 of the electric wire connectors 24 and 25 housed in the mold 65 face upward and protrude from the soldering surface 22b of the circuit board 22, respectively. However, the soldering surface 22 b and the terminals 29 and 30 are positioned so as to be lower than the upper surface of the mold 65. This state is shown in FIG.

  The next filling step is performed by injecting an uncured resin material through a gap between the edge of the upper surface opening of the mold 65 and the circuit board 22, in particular, the notch 22 c.

  In this pouring operation, the opening through which the uncured resin material flows to the lower side of the circuit board 22 is widened by the notch 22c from the other gap. In addition, the air below the circuit board 22 easily escapes through the other notches 22c that are not used for injection. For this reason, even an uncured resin material having a certain degree of viscosity can be smoothly injected into the mold 65 and filled. Therefore, the filling time of the uncured resin material is shortened, which can contribute to cost reduction.

  As described above, poor replacement of uncured resin material and air can suppress filling failure. That is, a cavity caused by residual air can be prevented from being generated between the component mounting surface 22a and the mold 65. In the case where the cavity remains in the resin material 55, there is a possibility that moisture may accumulate therein, which is not preferable from the viewpoint of waterproofing and insulation.

  The notch 22c that is not used for injection when the uncured resin material is filled is used as a return path for the surplus of the injected resin material. Through this return passage, the already injected resin material flows backward from the lower side of the circuit board 22 to the upper side of the circuit board 22. Thereby, the uncured resin material 55w is covered with the soldering surface 22b. This state is shown in FIG.

  In the above filling, it is preferable to use an uncured resin material that has been defoamed in advance. Further, it is preferable to perform a defoaming process on the uncured resin material being injected into the mold 65 or the uncured resin material injected into the mold 65. The defoaming process is performed by placing an uncured resin material in a reduced-pressure atmosphere. By such defoaming treatment, it is possible to prevent a cavity due to residual bubbles from being formed in the cured resin material 55.

  At the time of the above filling, the electrolytic capacitor 26b is isolated from the uncured resin material filled in the molding die 65 by the component cap 35 covering the electrolytic capacitor 26b. That is, the uncured resin material filled in the molding die 65 does not contact the electrolytic capacitor 26b to fill the electrolytic capacitor 26b. For this reason, there is no fear that the function of the electrolytic capacitor 26b is lowered by the resin material to be cured as will be described later, and the intended function can be exhibited in the electrolytic capacitor 26b.

  In the next curing step, the molding die 65 into which a predetermined amount of uncured resin material is injected is passed through a heat curing furnace (not shown) to cure the uncured resin material. By this curing process, the waterproof assembly 31 including the circuit module 21 and the cured resin material 55 in which the circuit module 21 is embedded is formed.

  In the final mold release step, the waterproof assembly 31 is removed from the mold 65. In this mold release operation, after the mold 65 is turned over, the connector caps 43 and 44 protruding from the back surface of the mold 65 may be pushed into the mold 65. Thereby, the waterproof assembly 31 is extruded from the mold. This state is shown in FIG. In order to facilitate the mold release operation, it is preferable to previously apply a mold release agent on the inner surface of the mold 65 in the setting step.

  In the above manufacturing method, a split mold can be used to facilitate the release of the waterproof assembly 31 from the mold. The split mold includes a plurality of mold elements, and these mold elements can be moved to clamp and open the mold.

  Since the component cover layer 55a of the resin material 55 of the waterproof assembly 31 manufactured as described above has the concave portions 48 to 52, the amount of the resin material 55 used is small compared to a configuration without these. Thereby, while being able to make the waterproof assembly 31 lightweight, filling operation time can be shortened. Therefore, it is possible to reduce the cost of the lighting device 5 and thus the lighting fixture 1 including the lighting device 5.

  In the manufactured waterproof assembly 31, the circuit module 21 is embedded in the resin material 55 except for the wire connectors 24 and 25. The resin material 55 is electrically insulating and waterproof, and also has flexibility. For this reason, the circuit board 22, the electrical component 26, the soldering surface 22b, etc. of the circuit module 21 can be waterproofed by the waterproof performance of the resin material 55.

The manufactured waterproof assembly 31 completely embeds the circuit module 21 with the resin material 55 except for the wire connectors 24 and 25 . Thereby, it can protect so that something else may not hit the electrical component 26 and the soldering surface 22b. Therefore, subsequent handling of the waterproof assembly 31 is easy. Further, the back cover layer 55b of the molded resin material 55 is in close contact with the solder on the soldering surface 22b and covers the soldering surface 22a. For this reason, even if the waterproof assembly 31 is bent, the back surface cover layer 55b can suppress the solder from being peeled off from the soldering surface 22a.

  The waterproof assembly 31 is accommodated in the outer case 11 as shown in FIGS. 3 and 5. In this accommodated state, the component cover layer 55a is in contact with the base wall 12a of the accommodation base 12, and the back cover layer 55b is in contact with the cover main wall 15a of the cover 15. The waterproof assembly 31 is attracted and fixed to one side wall of the outer case 11 with screws 68 (see FIGS. 3 and 7). The screw 68 is screwed into the heat radiating plate 27 through one side wall of the cover 15 and one side wall 12b of the housing base 12 overlapping therewith. The cover 15 and the accommodation base 12 are connected also in this screwed portion.

  The outer case 11 functions as an electromagnetic shielding member for the waterproof assembly 31 housed therein, a mechanical protection member, and the like.

  The resin material 55 of the lighting device 5 has not only waterproof performance but also heat dissipation performance. For this reason, heat of the power transistor 26 a and other electrical components that generate heat can be conducted to the outer case 11 through the resin material 55. In this case, the capacity of the resin material 55 is large, and the heat conduction area from the resin material 55 to the outer case 11 is large. Therefore, excellent heat dissipation characteristics can be obtained.

  That is, the back cover layer 55 b of the resin material 55 is in surface contact with the cover 15 with respect to the outer case 11. Further, one side surface of the resin material 55 is in surface contact with one side of the outer case 11 as the screw 68 is pulled. Thereby, heat conduction from the resin material 55 of the waterproof assembly 31 to the outer case 11 can be performed.

  In addition, the resin material 55 is excellent in heat dissipation from the surface. Moreover, since the resin material 55 has the recesses 48 to 52, the surface area thereof is increased. Thereby, heat can be radiated from the resin material 55 to the outer case 11 satisfactorily. In particular, by employing the resin material 55 in which an inorganic filler is mixed, the heat dissipation characteristics can be further improved.

  The heat of the outer case 11 is released to the chassis 2. Therefore, the heat generated by the power transistor 26a and the like that generate a large amount of heat can be released to suppress the temperature rise of the circuit module 21.

  As described above, the resin material 55 is in contact with the waterproof assembly 31 in contact with the metal outer case 11, but the resin material 55 has electrical insulation. For this reason, in spite of the contact, there is no need for a member for electrical insulation between the outer case 11 and the circuit module 21, and the number of parts and assembly man-hours can be reduced.

  Since the waterproof assembly 31 itself has a waterproof structure that can withstand a high humidity environment, a large waterproof case for housing the outer case 11 is not required. Thereby, the effort which accommodates the lighting device 5 in a waterproof case, and the effort which assembles a waterproof case after this are unnecessary. Therefore, the lighting device 5 can be easily assembled. In addition, it is possible to eliminate the cost increase due to the use of the waterproof case itself. In addition, the assembly cost can be reduced. Therefore, it is possible to reduce the cost of the lighting device 5 and thus the lighting fixture 1 including the lighting device 5. Furthermore, the outer case 11 that houses the waterproof assembly 31 does not require a waterproof structure. Thereby, the assembly of the outer case 11 can be simplified.

  Each of the accommodation base 12 and the cover 15 of the outer case 11 is provided with a drainage portion. That is, as shown in FIGS. 2 to 4, a plurality of drainage portions 14 are opened in the base wall 12 a of the housing base 12. At the same time, a plurality of drainage portions 18 are also opened in the cover main wall 15 a of the cover 15. These drainage parts 14 and 18 consist of holes.

  Moisture or the like may condense between the outer case 11 and the resin material 55 of the waterproof assembly 31. In this case, the condensed water can be discharged to the outside of the outer case 11 through the drainage parts 14 and 18. Therefore, the electrical insulation performance of the lighting device 5 can be improved. Such drainage is also effective in suppressing the occurrence of rust in the outer case 11 when the outer case 11 is made of a ferrous metal.

  All the heat conduction paths described above are made of metal parts. Therefore, the ground path from the circuit module 21 to the chassis 2 can also serve as the heat conduction path. The ground can be secured as follows. For example, an earth line formed on the circuit board 22 may be connected to the electric wire connector 25, and the earth wire may be plugged into the electric wire connector 25.

  Since the circuit module 21 is embedded in the resin material 55 as described above, the resin material 55 can surely prevent dust. Thereby, it is suitable also as the lighting device 5 used in the place where there is a lot of dust, and thus the dust-proof lighting fixture 1 including the lighting device 5.

  14 to 16 show a second embodiment of the present invention. The second embodiment is the same as the first embodiment except for the items described below. For this reason, the same or functionally similar configuration as in the first embodiment is denoted by the same reference numeral as in the first embodiment, and description thereof is omitted.

  In the second embodiment, the outer case used in the first embodiment is omitted, and the waterproof assembly 31 itself also serves as a lighting device as an electronic device. The waterproof assembly 31 has a plurality of through holes 31a and 31b. The through hole 31 a is provided in the vicinity of the connector cap 43. The through hole 31 b is provided in the vicinity of the connector cap 44. These through holes 31a and 31b are provided by post-processing.

  A screw 71 is inserted through each of the through holes 31a and 31b. By screwing these screws 71 into the chassis 2, the waterproof assembly 31 is directly attached to the chassis 2. With this attachment, the back cover layer 55 b of the waterproof assembly 31 is brought into close contact with the chassis 2. Thereby, the back surface cover layer 55b is used as a heat transfer portion to the chassis 2.

  The configuration other than the items described above is the same as that of the first embodiment. Therefore, the second embodiment can obtain the same operation as the first embodiment and can solve the problem of the present invention. In addition, by omitting the outer case, the number of parts can be reduced and the cost can be further reduced. Further, since the surface of the waterproof assembly 31 is exposed, not only the heat conduction from the back cover layer 55b to the chassis 2 but also the heat radiation from the surface of the resin material 55 can suppress the temperature rise of the circuit module 21.

  Furthermore, as described above, the resin material 55 has flexibility. For this reason, when the electronic device mounting surface of the chassis 2 is curved, the waterproof assembly 31 can be curved according to the curved surface, and the waterproof assembly 31 can be directly mounted on the electronic device mounting surface. In this case, it is preferable to use a pressing member that holds the curve of the waterproof assembly 31 in combination.

  FIG. 17 shows a third embodiment of the present invention. The third embodiment is the same as the second embodiment except for the items described below. For this reason, the same or functionally similar configuration as in the second embodiment is denoted by the same reference numeral as in the second embodiment, and the description thereof is omitted.

  In the third embodiment, the connector cover used in the second embodiment is omitted. Insulated coated wires 57 and 58 are individually inserted and connected to the wire connectors 24 and 25, respectively. At the time of manufacture, the electric wire connectors 24 and 25 are passed through the set holes 63a and 64a (see FIGS. 10 and 13) of the mold in a watertight manner.

  The configuration other than the items described above is the same as that of the second embodiment. Therefore, the third embodiment can obtain the same operation as the second embodiment and can solve the problem of the present invention.

  In the second and third embodiments, the fixing means for attaching the waterproof assembly 31 constituting the lighting device to the chassis 2 is not limited to the screw portion. For example, a belt or a clamp can be provided on the chassis 2 as a fixing means.

  In the present invention, the circuit module may not include the electric wire connector. In this case, the insulated coated electric wire may be directly connected to the circuit board of the circuit board by soldering or the like. This insulated wire is drawn out of the circuit module through the resin material.

  When implementing this invention as an electronic device, implementation is not restrict | limited to a lighting device. For example, the present invention can be applied as an electronic device forming an electric circuit of a waterproof radio. Furthermore, the present invention can also be applied to portable electronic devices and the like that need to have a waterproof function enhanced.

The perspective view which shows the lighting fixture which concerns on 1st Embodiment of this invention. The perspective view which shows the lighting device which concerns on 1st Embodiment of this invention with which the lighting fixture of FIG. 1 is provided. Sectional drawing which follows the F3-F3 line | wire in FIG. The perspective view which expands and shows the one end part of the lighting device of FIG. Sectional drawing which follows the F5-F5 line | wire in FIG. The perspective view which shows the waterproof assembly of the lighting device of FIG. 2 as seen from the back side. The perspective view which shows the waterproof assembly of the lighting device of FIG. 2 seeing from the front side. The perspective view which shows the circuit module with which the waterproof assembly of FIG. 6 is provided seeing from the back side. FIG. 7 is a perspective view showing a part of the circuit module provided in the waterproof assembly of FIG. 6 as seen from the front side. The perspective view which shows the relationship between the shaping | molding die used for manufacture of the waterproof assembly of the lighting device of FIG. 2, and the circuit module of FIG. The perspective view which shows the state by which the circuit module of FIG. 8 was set to the shaping | molding die of FIG. The perspective view which shows the state by which the resin material was inject | poured into the shaping | molding die of FIG. Sectional drawing which shows the shaping | molding die of FIG. 10, and the waterproof assembly released | released from this. The perspective view which shows the lighting device of the lighting fixture which concerns on 2nd Embodiment of this invention seeing from the front side. The perspective view which shows the lighting device of FIG. 14 seeing from a back side. Sectional drawing which shows the lighting device of FIG. Sectional drawing which shows the lighting device of the lighting fixture which concerns on 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Lighting fixture, 2 ... Chassis, 3 ... Lamp socket, 4 ... Fluorescent lamp (discharge lamp), 5 ... Lighting apparatus (electronic device), 11 ... Outer case, 12 ... Housing base, 15 ... Cover, 16 , 17 ... Hole part, 21 ... Circuit module, 22 ... Circuit board, 22a ... Component mounting surface, 22b ... Soldering surface (back surface of circuit board) , 23 ... Lighting circuit, 24, 25 ... Electric wire connector, 26 ... Electrical component , 31 ... Waterproof assembly, 31c ... Uneven surface, 43,44 ... Connector cap, 55 ... Resin material, 55a ... Part cover layer, 55b ... Back cover layer, 48-52 ... Concavity, 58-62 ... Convex

Claims (3)

Mainly Rutotomoni comprising a mounted one surface to the circuit board and the substrate was a component mounting surface a plurality of electric components constituting the electronic circuit, connected to the electronic circuit for the mounted input and output to the circuit board A circuit module further comprising: an electric wire connector ; and a connector cap that fits over these connectors and that allows the insulation-coated electric wire connected to the electric wire connector to pass through in a watertight manner ;
The component parts cover layer having an irregular surface to which the concave recessed toward the component mounting surface is formed to cover the mounting surface, and has a rear cover layer covering the back surface of the circuit board, the circuit board across and the Waterproof resin material with embedded electrical components;
Equipped with,
The wire connector and the connector cap penetrate the component cover layer and protrude from the resin material to the outside, and a circuit board side portion of the connector cap that is in contact with the component mounting surface is embedded in the resin material. electronic apparatus, characterized by that.
An electronic device characterized by that. Mainly Rutotomoni comprising a mounted one surface to the circuit board and the substrate was a component mounting surface a plurality of electric components constituting the electronic circuit, connected to the electronic circuit for the mounted input and output to the circuit board A circuit module further comprising: a wire connector; and a connector cap that fits over the connector and that allows the insulation-coated wire connected to the wire connector to pass through in a watertight manner; and covers the component mounting surface and mounts the component component cover layer having an irregular surface in which a recess is formed that is recessed towards the surface, and the have a rear cover layer covering the back surface of the circuit board, the circuit board and the entire waterproof resin material in which are embedded the electric component A waterproof assembly including:
A metal outer case having a hole for exposing the connector cap and containing the assembly;
Equipped with,
The wire connector and the connector cap penetrate the component cover layer and protrude from the resin material to the outside, and a circuit board side portion of the connector cap that is in contact with the component mounting surface is embedded in the resin material. electronic apparatus, characterized by that. With chassis;
A lamp socket attached to this chassis;
A discharge lamp removably supported in the socket;
A lighting device that is formed by the electronic device according to claim 1 or 2 and that is attached to the chassis by bringing a back cover layer into contact with the chassis and lights the discharge lamp;
The lighting fixture characterized by comprising.

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