JP2580986B2 - Design processing method for printed circuit boards with surface mount components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount device (SMD).
Design processing method of printed circuit board mounted with PCB, in particular, to perform X-ray inspection of the connection between the pad for mounting the surface mounted component (SMD pad) and the lead of the surface mounted component without the wiring pattern running under the pad for the printed circuit board wiring The present invention relates to a design processing method for a surface-mounted component mounting printed board to be processed.

[0002]

2. Description of the Related Art In a printed circuit board on which surface mount components are mounted, mounting of pads on the substrate and pins of the surface mount components is inspected using X-rays after mounting the surface mount components.

In this inspection, if an inner layer pattern such as an inner layer wiring or a solid pattern exists under the pad, the X-ray transmission power is reduced. Wiring processing that does not generate an inner layer pattern is required.

Heretofore, in this processing, a method has been adopted in which a human recognizes and judges under a pad each time wiring processing is performed, and sets a wiring prohibited area under the pad for each inner layer.

[0005]

Conventionally, the setting of the wiring prohibited area under the pad for the purpose of inspecting the connection between the lead of the surface mount component and the pad by the X-ray is conventionally performed by human recognition and judgment. Therefore, there is a problem that the setting takes a lot of man-hours, and further, a design error easily occurs.

[0006]

According to the present invention, there is provided a design processing method for a printed circuit board on which surface mounting components are mounted. The number of layers of the printed circuit board, the names of the layers and the component names of the mounted components, the component types, the pin numbers, the pad shapes, etc. Printed board library including configuration information and component information, printed circuit board shape, component names of mounted components,
A printed circuit board design file including component mounting information such as layout coordinates, layout layer names, and pin numbers, and wiring information; a target component is extracted from the printed board library and the printed board design file; Wiring prohibition information generating means for creating an enlarged pad shape by expanding the pad shape by a predetermined width; mounting and disposing the target component; developing the enlarged pad shape over all inner layers; It is characterized by having surface mounting component arranging means set on each layer as a wiring prohibited area and wiring processing means performing wiring processing avoiding the wiring prohibited area set on each layer.

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

FIG. 1 is a block diagram showing the configuration of an embodiment of a design processing method for a printed circuit board on which surface mount components are mounted according to the present invention. The input / output device 1 inputs and outputs various information data relating to the design of the printed circuit board. 1 shows a storage device 3 for storing the data obtained and the design data being designed, and a central processing unit 2 for controlling a surface-mounted component-mounted printed board design processing device 4 using various data stored in the storage device 3.
The surface mount component mounted printed board design processing device 4 includes a wiring prohibition information generation mechanism 41, a surface mount component placement mechanism 42, and a wiring processing mechanism 43.

FIG. 2 stores layer configuration information such as the number of layers and layer names of the printed circuit board, and information such as component names, component types, pin numbers, and pad shapes of components including surface mounted components mounted on the printed circuit board. It is a structural example of a printed board library.

FIG. 3 also shows mounting information such as component names, layout coordinates, layout layer names, and pin numbers of components including surface mounting components mounted on a printed circuit board, wiring information, and design information such as the shape of a printed circuit board. It is a structural example of a printed board design file.

FIG. 4 is a flowchart showing the operation of the printed circuit board design processing apparatus mounted with surface mount components. The operation will be described with reference to FIGS.

Various data and component data of the printed board input from the input / output device 1 are stored in the storage device 3 by the central processing unit 2 in the configuration shown in FIGS.

First, the operation of the wiring prohibition information generating mechanism 41 will be described.

The layer configuration information is input from the printed board library shown in FIG. 2 stored in the storage device 3 (S1).

Next, similarly, mounted component data is extracted from the printed board design file shown in FIG. 3 (S2).

A component name of the printed board library is searched for from the mounted component name and its component type is extracted.

From this component type, it is determined whether or not the mounted component is a surface mounted component (S3, S4).

If the component is a surface mount component, the pad shape of the component pin is input from the printed board library (S
5). Next, an area in which the pad shape is expanded by a predetermined width is created (S6).

This area is set as a wiring prohibited area to be used in subsequent processing.

The above is the operation of the wiring prohibition information generating mechanism 41.

Next, the operation of the surface mount component placement mechanism 42 will be described.

Here, the arrangement coordinates for mounting the component on the printed board are determined. If the component to be arranged is not a surface-mounted component, it is arranged on predetermined position coordinates (S10).

On the other hand, if the component is a surface mount component, the above-described wiring prohibited area shape is developed for all pins (pads) over all layers from the arrangement coordinates of the component (S8).

Further, this area will be described as a wiring prohibited area in each layer (S9).

It is determined whether or not there are still components to be mounted (S
11).

If there is still a component to be mounted, the component to be mounted is subsequently extracted from the printed board design file (S
2) Repeat from the operation.

If there is no component, the process proceeds to wiring processing.

Here, the wiring processing is performed without running the wiring pattern in the wiring prohibited area set above (S1).
2).

FIG. 5 shows an example of the wiring prohibited area obtained by the design processing method of the printed circuit board on which the surface mount components are mounted according to the present invention.
Shown in

The lead pins 7 of the surface mount component 6 arranged on the four-layered printed board 5 are connected to the printed board by pads 8.

The wiring prohibited areas 81 to 83 in which the shape of the pad 8 is enlarged are developed over all the inner layers.

[0032]

As described above, the surface mount component mounting printed board design processing method according to the present invention is automatically performed based on the pad shape of the surface mount component, the layer configuration information of the printed board, and the arrangement coordinates of the surface mount component. Since the wiring prohibited area under the pad can be generated in all layers, the wiring prohibited area under the pad can be easily set, and the design error can be eliminated.

[Brief description of the drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of a design processing method for a printed board on which surface-mounted components are mounted according to the present invention.

FIG. 2 is a diagram illustrating a configuration example of a printed board library.

FIG. 3 is a diagram showing a configuration example of a printed board design file.

FIG. 4 is a flowchart showing the operation of the design processing method for a surface-mounted component-mounted printed board according to the present invention.

FIG. 5 is a perspective view showing a wiring prohibition region in which a pad shape of a surface mount component is set on a multilayer structure printed circuit board;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 input / output device 2 storage device 3 central processing unit 4 surface mounted component mounted printed board design processing device 41 wiring prohibition information generating mechanism 42 surface mounting component placement mechanism 43 wiring processing mechanism S1 to S12 Operation flow of the present invention 5 multilayer structure printing Board 6 Surface mount component 7 Lead pin 8 Pad 81 to 83 Wiring forbidden area developed in inner layer

Claims (1)

(57) [Claims] 1. A design processing method for a surface-mounted component-mounted printed board in which a pad shape of a surface-mounted component mounted on a multilayer-structured printed board is set as a wiring-prohibited area over all layers of the printed board, and then wiring is performed. In the number of layers of the printed board, the layer name and the component name of the mounted component,
A printed board library including layer configuration information such as component types, pin numbers, pad shapes and component information, a printed board shape, component names of the mounted components, arrangement coordinates,
A printed circuit board design file including component mounting information such as an arrangement layer name and a pin number and wiring information; extracting a target component from the printed board library and the printed circuit board design file; and forming a pad shape of the target component. Wiring prohibition information generating means for creating a pad enlarged shape by expanding the pad by a predetermined width, mounting and arranging the target component, expanding the pad enlarged shape over all the inner layers, and prohibiting wiring of the pad enlarged shape A surface mounting component placement means for setting each area as an area, and a wiring processing means for performing wiring processing while avoiding the wiring prohibited area set for each layer, a design processing method for a surface mounting component mounting printed board, .