JP2985261B2 - Printed circuit board wiring design equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is used for printed circuit board wiring design in electronic device packaging design. The present invention relates to a printed circuit board wiring design apparatus for arranging a pattern drawing direction determined by a logical attribute.

〔Overview〕

The present invention relates to a printed circuit board wiring designing apparatus for designing a wiring of a printed circuit board on which a surface mount component is mounted. By reducing the number of remodeling operations of the substrate, the number of steps and costs can be reduced.

[Conventional technology]

Conventionally, in the wiring design of a printed wiring board on which surface-mounted components (QEP, SOJ, etc.) are mounted, the direction in which the pattern is drawn from the component mounting pads follows the direction determined in the component library regardless of the logical attributes of the components. .

[Problems to be solved by the invention]

In the above-described conventional wiring device for surface mounting, the pattern drawing direction from the component mounting pad is determined by the pattern drawing direction of the component library and does not take into account the logical attribute of the component pin. It is not distinguished whether it is a GV pin (power supply / GND pin), so that highly modifiable signal pins are pulled out inside the pad, and less modifiable GV pins are pulled out of the pad. There is. In such a case, there is a problem that a special jig for cutting a pattern and removing a part is required for remodeling, and there is a problem that the substrate cannot be used due to an accident such as peeling of a copper foil pad.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide an apparatus which can determine the drawing direction of a pattern based on a logical attribute and reduce modification performed after wiring.

[Means for solving the problem]

The present invention provides an input unit for inputting a component arrangement coordinate value for setting a component arrangement position and a component library for defining a position of a pad and a land of a component for each component, and wiring pads and lands based on the input information. Component mounting pad expanding means to be developed on the area map, pin pair determining means for determining the pin pair to be wired based on the land and pad positions, wiring based on the determined pin pair, and judging completion of all wiring processing Wiring means, and a printed circuit board wiring design device comprising a wiring data output means for outputting wiring pattern data to an external file when the determination of wiring completion is received, wherein the input means,
Means for inputting logical connection information of a circuit diagram, wherein the pin pair determining means includes means for adding the logical connection information in addition to land and pad positions to determine a pin pair,
It is determined whether or not one of the pins of the wiring pin pair determined by the pin pair determining means is connected to the surface mount component, and when the pin is connected to the surface mount component, the connection is made to the power or ground side. Connection state determination means for determining whether or not a signal pattern is drawn from the inside of the component mounting pad when one of the pins connected to the surface mount component is connected to the power or ground side. And a signal pattern setting means for setting

Said signal pattern setting means, when one of the pins connected to the surface mount component is not connected to the power supply or the ground side, means for setting so that the signal pattern can be drawn out of the component mounting pad, wiring It is desirable to include means for determining whether or not the wiring processing for the two pins of the pin pair is completed, and sending a wiring processing completion notification to the wiring means when the wiring processing is completed.

[Action]

When drawing a pattern from a pad in the wiring design of a printed wiring board on which surface-mounted components are mounted, the direction in which the pattern is drawn is determined by logical attributes, and signal patterns that are highly likely to be modified are directed outward from the component pads. The power supply and GND patterns that are less likely to be modified are arranged so as to be drawn out preferentially inward of the component pads.

As a result, the frequency of pattern cutting for remodeling can be reduced, the damage to the substrate can be reduced, and the number of steps and cost can be reduced.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings. First
FIG. 2 is a block diagram showing a configuration of the embodiment of the present invention. FIG. 2 is a flowchart showing a flow of a logic circuit mounting design according to the conventional example and the embodiment of the present invention. FIG. It is a flowchart which shows the flow of a design.

The device according to the embodiment of the present invention relates to logic circuit design, and particularly relates to arrangement and wiring in mounting design.

The embodiment of the present invention is an input means 1 for inputting a component arrangement coordinate value 22 for setting a component arrangement position and a component library 23 for defining the positions of component pads and lands for each component.
Component mounting pad expanding means 2 for expanding pads and lands on a wiring area map based on the input information;
A pin pair determining means 3 for determining a pin pair to be wired based on the land and pad positions, a wiring means 6 for performing wiring based on the determined pin pair, and a wiring means 6 for determining completion of all wiring processing, and a determination of completion of wiring. Wiring data output means 7 for outputting wiring pattern data to an external file 24 when the input means 1 further includes means for inputting logical connection information 21 of a circuit diagram to the input means 1, The determining means 3 includes means for adding the logical connection information 21 in addition to the land and pad positions to determine the pin pair. One of the wiring pin pairs determined by the pin pair determining means 3 is connected to the surface mount component. And determine whether the connection is to the power or ground side when the pin is connected to a surface mount component. A connection state judging means 4 fixed to,
Signal pattern setting means 5 for setting a signal pattern to be drawn out from inside the component mounting pad when one of the pins connected to the surface mount component is connected to the power supply or the ground side; The setting means 5 includes:
Means for setting so that a signal pattern can be drawn out of the component mounting pad when one of the pins connected to the surface mount component is not connected to the power or ground side;
It includes means for judging whether or not wiring processing has been completed for two pins of the wiring pin pair, and sending a wiring processing completion notification to the wiring means 6 when the wiring processing has been completed.

Next, the operation of the embodiment of the present invention thus configured will be described. FIG. 4 is a flowchart showing the flow of the operation of the embodiment of the present invention.

First, logical connection information 21 such as a circuit diagram is input in the form of a netlist or the like (process S1). Next, a component arrangement coordinate value 22 to be mounted on the printed board is input (process S2). The part library 23 in which the positions of the pads and lands of the parts are defined for each part is input, and the pads and lands are developed on the wiring area map (processing S3). Next, a pin pair to be wired is determined from the logical connection information 21 input in step S1 and the land and pad positions (step S4).

It is checked whether or not one of the pins of the wiring pin pair determined in step S4 is connected to the surface mount component (step S5). If it is connected to a surface mount component, check whether the pin is a power / GND signal (process S6),
If it is a signal, the signal pattern is drawn from inside the component mounting pad and a via hole (through hole) is provided (processing S
7). If it is a signal line, a signal pattern is drawn from the outside of the component mounting pad and a via hole is provided (process S8).

Next, processing S5 to processing S8 are performed for two pins to be wired.
It is checked whether or not the processing has been completed (processing S9). If not completed, the process returns to processing S5. If completed, the via hole or T / H land generated in processing S5 to processing S8 is set as a routing target. A wiring process is performed (process S10). It is checked whether or not the processing has been performed for all the pin pairs (processing S11). If the processing has not been performed, the process returns to the processing S5. If the processing has been performed, the wiring pattern data is stored in an external file.
Output to 24 (process S12).

FIG. 5 shows an example of a pattern connected by such an operation.

〔The invention's effect〕

As described above, according to the present invention, the pattern extraction direction in the wiring design is determined based on the logical attribute, and the signal pattern having a high possibility of modification is extracted to the outside of the component pad. Pulling out the GND pattern to the inside of the component pad has the effect of reducing the work of peeling off the surface-mounted component by remodeling the board, and reducing the number of steps and cost.

[Brief description of the drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention. FIG. 2 is a flowchart showing a flow of a logic circuit design according to the conventional example and the embodiment of the present invention. FIG. 3 is a flowchart showing a flow of a packaging design according to a conventional example and an embodiment of the present invention. FIG. 4 is a flowchart showing the flow of the operation of the embodiment of the present invention. FIG. 5 is a diagram showing an example of a pattern connected according to the embodiment of the present invention. 1 ... input means, 2 ... component mounting pad deployment means, 3 ...
... Pin pair determination means, 4 ... Connection state determination means, 5 ...
Signal pattern setting means, 6 Wiring means, 7 Wiring data output means, 13 ... GND component mounting pad, 14 ... Pattern, 15 ... Signal component mounting pad, 16 ... VCC component mounting pad , 17 ... via hole, 21 ... logical connection information, 22 ... component arrangement coordinate value, 23 ... component library, 24
...... External file.

Claims (3)

(57) [Claims] An input means for inputting a component arrangement coordinate value for setting a component arrangement position and a component library for defining a position of a pad and a land of a component for each component, and a pad and a land based on the input information. A component mounting pad developing means for developing on a wiring area map, a pin pair determining means for determining a pin pair to be wired based on a land and a pad position, wiring is performed based on the determined pin pair, and termination of all wiring processing is performed. A printed circuit board wiring design device comprising: wiring means for determining; and wiring data output means for outputting wiring pattern data to an external file when the determination of wiring completion is received. Means for inputting the logical connection information to the pin pair determining means in addition to the land and pad positions. Means for determining a pin pair in addition to determining whether or not one of the pins of the wiring pin pair determined by the pin pair determining means is connected to the surface mount component, and determining whether the pin is connected to the surface mount component. Connection state determination means for determining whether or not the connection is on the power or ground side when the connection is made, and a signal when one of the pins connected to the surface mount component is connected to the power or ground side. And a signal pattern setting means for setting a pattern so that the pattern can be pulled out from the inside of the component mounting pad. 2. The signal pattern setting means sets a signal pattern from outside a component mounting pad when one of pins connected to a surface mount component is not connected to a power supply or a ground side. And means for performing
Printed circuit board wiring design device as described. 3. The signal pattern setting means includes means for determining whether or not wiring processing for two pins of a wiring pin pair has been completed, and sending a wiring processing completion notification to the wiring means when the wiring processing has been completed. The printed wiring board design apparatus according to claim 1.