JPH07105248A - Method and device for automatic arrangement in consideration of wiring - Google Patents

Abstract

PURPOSE:To provide the method and device for automatic arrangement which facilitate wiring operation by arranging components so that via inhibition areas overlap on the component surface and solder surface of a printed circuit board. CONSTITUTION:Surface mounted components in the same external shape are arranged one over the other on both the component surface and solder surface through a temporary arrangement step 102 wherein the components to be arranged which are selected in a component selection step 101 are temporarily arranged and an arrangement correction step 103 wherein the external shapes of the components that are already arranged on the opposite surface from the periphery of the temporarily arranged component are checked and the arrangement positions of the temporarily arranged components are so corrected that when there is a component in the same external shape with the temporarily arranged component, the external shapes of the components on both the surfaces of the component surface and solder surface are coordinated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic arranging method and apparatus for automatically arranging surface-mounted components in the design of a printed circuit board by considering wiring by using both the component side and the solder side.

[0002]

2. Description of the Related Art In recent years, printed circuit board design CAD (Comput
er Aided Design) has spread, an automatic placement device that automatically determines the positions of electronic components when designing a printed circuit board is being used.

Among such automatic placement methods and placement devices, there are those that perform automatic placement of surface mount components using both the component side and the solder side, but considering the connection relationship of each component. However, it is not sufficient because it does not take into consideration wiring, especially the extraction of patterns from the pins of surface mount components. For example, in the case of surface mount components, some patterns are drawn from the pins to form vias, and wiring is performed using the inner layer.However, in the conventional layout method, it is the opposite when the patterns are extracted from the pins and the vias are formed. Due to the prohibition of vias on the surface component, the vias may not be formed, and the lead-out pattern may become long or cannot be led out. If the lead-out pattern becomes long, it is likely to be affected by noise, and if the lead-out pattern cannot be pulled out, wiring cannot be performed, and it is necessary to correct the arrangement position of each component.

In such a case, conventionally, the CAD interactive processing function has been used to manually make corrections. That is, among the parts that have been automatically arranged once, the parts around the parts for which it is difficult to draw out the pattern are rearranged. However, such a method not only increases the number of man-hours for rearrangement, but also has little merit in performing automatic arrangement.

[0005]

In view of the above problems of the conventional automatic placement method and apparatus, the automatic placement is performed in consideration of the extraction of the pattern from the surface mount component after the automatic placement. It is an object to provide a method and a device.

[0006]

In order to achieve the above-mentioned object, the invention according to claim 1 selects a component to be arranged next on a printed circuit board in consideration of connection relations and electrical characteristics of the component. A step, a temporary placement step of temporarily placing the component on a printed circuit board, and an outline of a component already placed on the opposite surface of the periphery of the component temporarily placed by the temporary placement step, and the temporarily placed component If there is a component having the same outer shape as that of, the placement correction step of correcting the placement position of the provisionally placed component so that the outer shapes of the components match (just overlap) on both the component surface and the solder surface, Automatically characterized by sequentially repeating the component selection step, the temporary placement step, and the placement correction step, and laying out the surface-mounted components of the same outer shape on both the component side and the solder side in an overlapping manner. Constitute the 置方 method.

In order to achieve the above object, the invention according to claim 3 considers the connection relationship and electrical characteristics of the components and selects the component to be arranged next on the printed circuit board, and the component selecting step. A temporary placement step of temporarily placing on the printed circuit board, and a via prohibited area of the component already placed on the opposite surface of the periphery of the component temporarily placed by the temporary placing step are examined, and the via prohibited area and the temporarily placed A placement correction step of correcting the position of the temporarily placed component so that the area overlapping the via-prohibited area of the component is maximized, and the component selection step, the temporary placement step, and the placement correction step are performed. An automatic arrangement method is characterized in that the automatic arrangement method is performed by sequentially and repeatedly performing arrangement so that the overlapping portion of the via prohibited area is maximized on both the component surface and the solder surface.

[0008]

In the automatic placement method according to the first aspect of the present invention, with the above-described configuration, the component selection step selects the next component to be placed on the printed circuit board in consideration of the connection relationship and electrical characteristics of the component, and provisionally places the component. The step is provisionally placed on the printed circuit board in consideration of the connection relationship with the placed components and the electrical characteristics, and the placement correction step is already placed on the opposite surface of the periphery of the components provisionally placed by the provisional placement step. Check the external shape of the part that has been temporarily placed, and if there is a part that has the same external shape as the temporarily placed part, make sure that the position of the temporarily placed part matches the external shape of the part with the same external shape on both the component side and the solder side. By making the above correction and sequentially repeating each step, it becomes possible to easily pull out the surface-mounted component from the pin, and thus, it becomes possible to perform the automatic arrangement which facilitates the wiring.

According to the automatic placement method of the third aspect of the present invention, with the above configuration, the component selection step selects the component to be placed next on the printed circuit board in consideration of the connection relationship and electrical characteristics of the component, and temporarily places it. The deciding step temporarily arranges the selected component on the printed circuit board in consideration of the connection relationship with the arranged component and the electrical characteristics, and the placement correcting step has already been performed on the opposite surface of the periphery of the component provisionally arranged by the temporary arranging step. Check the via prohibited area of the placed component, correct the position of the temporarily placed component so that the area that overlaps the via prohibited area of the temporarily placed component is maximized, and repeat each step in sequence. By this, it becomes easy to pull out the surface-mounted component from the pin, and therefore, it is possible to perform the automatic arrangement that facilitates the wiring. Further, since the lead-out is easy, the lead-out distance can be shortened, and wiring that is not easily affected by noise can be realized.

[0010]

【Example】

(Embodiment 1) An embodiment of the automatic placement method and apparatus of the present invention will be described below with reference to the drawings.

FIG. 1A is a flow chart in an embodiment of the automatic placement method according to the first aspect of the present invention. 1
Reference numeral 01 denotes a component selection step, in which a component to be arranged next is selected from the unplaced components in consideration of the connection relationship with the components already arranged on the printed circuit board, the shape and type of the component, and the like. In addition,
At this time, if there are no unplaced parts, the automatic placement is terminated.
In the temporary placement step 102, the component selected by 101 is temporarily placed on the printed circuit board based on the connection relationship with the already placed component, the shape and type of the component, and the like. A layout correction step 103 checks the outer shape of the component on the opposite side of the periphery of the component provisionally arranged by 102, and corrects the position of the provisionally arranged component so as to match the component if there is a component having the same outer shape. 104
Check if all parts are placed on the printed circuit board,
If there are parts that have not been placed yet, go back to 101,
If all parts are placed, the process ends.

FIG. 1 (b) is a block diagram of an embodiment of the automatic placement apparatus according to the second aspect of the present invention. A storage unit 111 stores information necessary for printed circuit board design, such as component information and connection information. Reference numeral 112 denotes a component selection unit that selects a component to be arranged next from among unarranged components in consideration of the connection relationship with the components already arranged on the printed circuit board, the shape and type of the component, and the like. Reference numeral 113 tentatively arranges the component selected by 112 in consideration of the connection relationship with the component already arranged by the temporary arrangement means, the shape and type of the component, and the like. 114 is an arrangement correction means
The outlines of the components already arranged on the opposite surface around the temporarily arranged component are checked by 13, and if there is a component with the same outline, the position of the temporarily arranged component is corrected so as to match the component. A control unit 115 sequentially and repeatedly executes the component selection unit 112, the temporary placement unit 113, and the placement correction unit 114 until all the components are placed.

FIG. 2 shows an example of 14-pin SO component data. 201a to n are land of pins, 202
Reference numerals a and 202b represent silk outlines, and reference numerals 203a and 203b represent via prohibited areas. The via-prohibited area is an area where a via should not be hit, and it is 1m from the land of the pin according to the design standard.
m is provided. In addition, a resist, a placement / wiring prohibited area, or the like may be added.

FIG. 3 shows an example of the placement result obtained by the placement method according to claim 1 of the present invention.

FIG. 3A shows an example in which the temporary placement is performed by the temporary placement step, and FIG. 3B shows an example in which the placement position is corrected by the placement correction step.

In FIG. 3, 301 and 302 are pin lands of components arranged on the component surface, 303 and 304 are via-prohibited regions, and 305 and 306 are silk outlines. Again 30
7 is a land of pins arranged on the solder surface, 308 is a via prohibited area, and 309 is a silk outline. With the conventional placement method and apparatus, the placement is completed in the state of FIG. 3 (a), but with the placement method according to claim 1 of the present invention, the placement is then corrected and the placement result of FIG. 3 (b) is obtained. As a result, the via-prohibited area overlaps the component surface and the solder surface, the area in which the via can be hit increases, and it becomes easy to perform drawing and wiring.

(Embodiment 2) FIG. 4 shows an example of an arrangement result obtained by the arrangement method according to claim 3 of the present invention. FIG. 4A shows an example of a case where the arrangement position is temporarily arranged by the temporary arrangement step, and FIG. 4B shows an example of a case where the arrangement position is corrected by the arrangement correcting step.

In FIG. 4, 401 is a land of a pin of a component arranged on the component surface, 402 is a via prohibited region, and 403 is a silk outline. Further, 404 is a land of pins arranged on the solder surface, 405 is a via prohibited region, and 406 is a silk outline. With the conventional placement method and device, placement is completed in the state of FIG. 4A, but with the placement method according to claim 3 of the present invention, the placement is then corrected and the placement result of FIG. 4B is obtained. As a result, the via-prohibited area overlaps the component surface and the solder surface, the area in which the via can be hit increases, and it becomes easy to perform drawing and wiring.

FIG. 5 shows a specific example of a region for searching for placed components on the opposite surface in the placement correcting step of the present invention. 501 is a pin land, 502 is a via prohibited area, 503 is a silk outline, and 504 is a search area. In this example, the search area 504 is provided by designating the distances Y1 and Y2 from the via prohibited area and X1 and X2 from the silk outline. In addition, X1, X2, Y from the center of the parts
The search area may be provided by designating 1 or Y2, or may be designated from the land of the pin.

[0020]

When the automatic placement method according to claim 1 of the present invention is used, the via-inhibited areas of the surface-mounted components mounted on both the component surface and the solder surface are overlapped with each other, and the area in which the via can be hit becomes large, so that the surface mounting is performed. It is easy to pull out the pattern from the product and wire it. Further, since the pattern drawn on the surface can be shortened, the influence of noise can be suppressed, and its practical effect is great.

If the automatic placement method according to the third aspect of the present invention is used, the overlapping area of the via prohibited area of the surface mount component mounted on both the component surface and the solder surface becomes maximum, and the area where the via can be hit becomes large. It is easy to pull out the pattern from the surface mount product and to wire it. Further, since the pattern drawn on the surface can be shortened, the influence of noise can be suppressed, and its practical effect is great.

[Brief description of drawings]

FIG. 1A is a flow chart in a first embodiment of the present invention, and FIG. 1B is a configuration diagram in a first embodiment of the present invention.

FIG. 2 is a diagram showing component data used in the first embodiment of the present invention.

3A is a diagram showing a temporary placement step in the first embodiment of the present invention, and FIG. 3B is a diagram showing a placement correction step in the first embodiment of the present invention.

FIG. 4A is a diagram showing a temporary placement step in the second embodiment of the present invention, and FIG. 4B is a diagram showing a placement correction step in the second embodiment of the present invention.

FIG. 5 is a diagram showing a search area on the opposite surface according to an embodiment of the present invention.

[Explanation of symbols]

 101 parts selection step 102 temporary placement step 103 placement correction step

Claims (4)

[Claims] 1. A method for automatically arranging surface mount components by using both the component side and the solder side of the printed circuit board, wherein the component to be arranged on the printed circuit board is selected according to the connection relation and electrical characteristics of the specified component. The component selection step to be performed and the placement position of the component on the printed circuit board are determined according to the connection relation and electrical characteristics of the designated component, and the temporary placement step of temporarily placing the component and the temporary placement by the temporary placement step. Check the outer shape of the component already placed on the opposite side of the component periphery, and if there is a component with the same outer shape as the provisionally placed component, locate the provisionally placed component on both the component and solder sides. It has a layout correction step for correcting so that the outer shapes of the parts match, and is configured to sequentially execute the part selection step, the temporary layout step, and the layout correction step. Automatic placement method comprising and. 2. An apparatus for automatically arranging surface mount components by using both the component side and the solder side of a printed circuit board, which are necessary for determining the arrangement position of the component when designing the printed circuit board. A storage unit that stores information about the printed circuit board, a component selection unit that refers to the information stored in the storage unit, and selects a component to be arranged next on the printed circuit board, and a component on the printed circuit board. The placement position is determined with reference to the information stored in the storage unit, and the temporary placement unit temporarily places the component, and the component already placed on the opposite surface of the periphery of the component placed by the temporary placement unit. If there is a part that has the same outer shape as the provisionally placed part, correct the placement position of the provisionally placed part so that the contours of the parts match on both the component side and the solder side. With means and before Automatic placement apparatus characterized by being configured to sequentially repeatedly executing the the component selection means and temporary arrangement means the arrangement correction means. 3. A method for automatically arranging surface mount components by using both the component side and the solder side of the printed circuit board, which should be arranged next on the printed circuit board in consideration of the connection relationship and electrical characteristics of the components. A component selection step of selecting a component, a placement position of the component on a printed circuit board is determined in consideration of connection relations and electrical characteristics of the component, and a temporary placement step of temporarily placing the component, and a periphery of the temporarily placed component Check the via-prohibited area of the component already placed on the opposite surface of the, so that the area where the via-prohibited area and the via-prohibited area of the provisionally-placed component overlap with each other becomes maximum, An automatic placement method, comprising: a placement correction step of correcting a placement position, wherein the component selection step, the temporary placement step, and the placement correction step are sequentially repeated. 4. A device for automatically arranging surface mount components by using both the component side and the solder side of a printed circuit board, which are necessary for determining the arrangement position of the component when designing the printed circuit board. A storage unit that stores information about the printed circuit board, a component selection unit that refers to the information stored in the storage unit, and selects a component to be arranged next on the printed circuit board, and a component on the printed circuit board. The placement position is determined with reference to the information stored in the storage unit, and the temporary placement unit that temporarily places the component and the component that has been provisionally placed by the temporary placement unit have already been placed on the opposite surface of the periphery of the component. A placement correcting unit that checks the via-prohibited area of the component and corrects the placement position of the provisionally-placed component so that the area where the via-prohibited area and the provisionally-placed component via-prohibited area overlap each other becomes maximum. Have, Automatic placement apparatus characterized by being configured to perform serial component selection means and said temporary positioning means and the placement correction means sequentially repeatedly a.