JP2576803Y2 - Microwave component structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave component in which a microwave device, a microwave circuit, a substrate for mounting these devices, and the like are incorporated in a housing.

[0002]

2. Description of the Related Art Conventionally, when fabricating a microwave component that requires a particularly isolated characteristic, such as a switch, etc., a substrate is provided in a housing having a structure as shown in FIG. 4, (a) is a front view, (b) is C
FIG. 7C is a cross-sectional view taken along line DD, and FIG. 7 is a housing, which is a component mounting surface 9 on which a substrate on which a microwave device or a microwave circuit is mounted or a carrier plate on which the substrate is mounted is disposed. 9 '. Numeral 10 is a partition wall provided for improving isolation characteristics, for preventing leakage and leakage of microwaves radiated into spaces between components provided on the component mounting surfaces 9 and 9 '. belongs to. Reference numeral 8 denotes a hole provided for wiring between components provided on the component mounting surfaces 9 and 9 '. The housing is made of a material such as an aluminum alloy having high conductivity and high rigidity to protect the mounted components. When the housing 7 is actually used, the components of the carrier plates 15, 15 'and the microwave circuit boards 14, 14' are arranged on the board mounting surfaces 9 and 9 'of the housing 7 as shown in FIG. After that, the wiring member 5 such as a gold ribbon is passed through the through hole 8 and the wiring member is attached to the circuit patterns on the substrates 14 and 14 ′ disposed on the component mounting surfaces 9 and 9 ′ by thermocompression bonding or the like. And
A lid (not shown) is attached by a method such as screwing so as to cover the openings 11 and 11 '. 5A is a front view, and FIG. 5B is a cross-sectional view taken along EE. The microwave component thus formed connects a high-frequency input / output terminal and a bias supply terminal (not shown) to other modules and the like, and as a whole, oscillates, amplifies,
A microwave device having functions such as tuning and frequency conversion is configured.

[0003]

In the case of the structure of the housing as shown in FIG. 4, a special jig or the like is used to make the through hole 8 penetrate through the partition wall, or it is processed by electric discharge machining. There has been a problem that the production cost is higher than a casing or the like that can be manufactured only by cutting or casting. Further, when the lid is closed by screws or the like so as to close the openings 11 and 11 ′ of the housing 7 in FIG. 5, if the lid and the upper end surface of the partition wall 10 are in poor contact, microwaves leak to the adjacent space. In the case where the microwave component constitutes a switch or the like, there is a problem that isolation characteristics are deteriorated. SUMMARY OF THE INVENTION It is an object of the present invention to provide a microwave component that reduces the production cost and is less likely to cause the above-mentioned problems electrically.

[0004]

In order to achieve the above object, according to the present invention, a concave portion is formed at a position where the component mounting surface of the housing does not overlap with both the main surface of the housing and the back surface of the main surface. The depth of the component mounting surface formed on the main surface side from the main surface and the depth of the component mounting surface formed on the back surface side of the main surface from the back surface of the main surface are respectively represented by the respective component mountings. When a substrate is disposed on a surface, a circuit pattern surface such as a microwave strip line on each substrate is formed to a depth substantially horizontally aligned, and the circuit on the substrate disposed on the main surface side in the housing. And a penetrating portion through which a thin plate-like wiring member for electrically connecting a circuit on a substrate disposed on the back side of the main surface is formed, and the penetrating portion is formed on the main surface and the back surface of the main surface. Through the side.

[0005]

With this configuration, in the case of manufacturing a housing of a microwave component that needs to have good isolation characteristics, a cutting portion such as a milling cutter has a penetrating portion for component wiring provided in the housing. Either component mounting surface can be formed by the same processing, and in the case of casting such as die casting, the through portion for component wiring of the housing and one of the component mounting surfaces can be formed by the same mold.
In addition, the openings of the space (recess) where the parts enter will not be adjacent

[0006]

1 shows an embodiment of the present invention, in which (a) is a front view, (b) is a sectional view taken along line AA, (c) is a rear view,
The configuration of only the housing portion omitting the lid, the input / output terminal, and the bias terminal is shown. In FIG. 1, 1 is a housing, 6 is a penetrating portion, 12 and 12 'are component mounting surfaces, and 13 and 13' are openings. The housing 1 is easily manufactured by a milling machine or the like, and the penetrating portion 6 is formed by cutting the component mounting surface 12 from the front of the housing 1 before or after cutting the component mounting surface 12 ′ from the back of the housing 1. It is formed by cutting the wall between the component mounting surfaces 12 and 12 'into a semicircle. FIG. 2 is an embodiment of the present invention showing a state where components are incorporated in the housing 1. 2, (a) is a front view, (b) is a cross-sectional view taken along the line BB, and numerals 1, 6, 13 and 13 'are the same as those in FIG. Reference numerals 2 and 2 'denote microwave circuit substrates which are soldered onto carrier plates 3 and 3'. The carrier plates 3 and 3 'on which the substrate 2 or 2' is mounted are disposed on the housing 1 by a method such as screwing, and are mounted on the substrate 2 and the substrate 2 'by a wiring member 5 such as a gold ribbon passed through the penetrating portion 6. Are electrically connected. FIG. 3 shows the vicinity of the portion where the circuit on the substrate 2 and the circuit on the substrate 2 'in FIG. 2 are connected by the wiring member 5, and the reference numerals 1, 2, 2' and 3, 3 'denote FIGS.
Is the same as In FIG. 3, reference numerals 4 and 4 'denote circuit patterns such as microstrip lines formed on the substrates 2 and 2', respectively. A thin wiring member 5 such as a gold ribbon is covered by a method such as thermocompression bonding or soldering. And each surface is arranged substantially horizontally. The housing 1 in which the components are disposed as described above is not shown by a method such as screwing so as to close each of the openings 13 and 13 '(FIGS. 1 and 2).
After attaching the lids, connect the high-frequency input / output terminal and bias supply terminal (not shown) to other modules, etc.
Used as part of a microwave device. In the embodiment, the component mounting surface is provided on each of the front and back surfaces of the housing, but a plurality of mounting surfaces can be provided. The size of the penetrating portion 6 should be kept to the minimum necessary to improve the isolation characteristics.

[0007]

[Effects of the Invention] As described above, when the present invention is used for a microwave component such as a switch, the spaces where the respective components enter are independent except for the penetrating portions for wiring, and the respective spaces are provided. Are closed by separate lids, so that they are less susceptible to leakage or leakage of microwaves, thereby improving isolation characteristics. Further, according to the present invention, it is not necessary to perform cutting or electric discharge machining using a special jig or tool to produce the housing, so that production costs can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a housing according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing an embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a wiring state of components in FIG. 2;

FIG. 4 is an explanatory view showing a housing according to a conventional example.

FIG. 5 is an explanatory diagram showing a conventional example.

[Description of Signs] 1 housing 2, 2 ′ substrate 3 carrier plate 4 pattern 5 wiring material 6 penetrating part 7 housing 8 through hole 9, 9 ′ component mounting surface 10 partition wall 11, 11 ′ opening 12, 12 ′ Component mounting surface 13, 13 'Opening 14, 14' Substrate 15, 15 'Carrier plate

Claims (1)

(57) [Scope of request for utility model registration] In a structure of a microwave component in which a substrate on which a microwave device or a microwave circuit is mounted is mounted on a housing, a component mounting surface of the housing is a main surface side of the housing and a back surface of the main surface. A concave portion is formed at a position where they do not overlap each other on both sides; a depth from the main surface of the component mounting surface formed on the main surface side; The depth from the back side is formed to a depth at which the circuit pattern surface such as a microstrip line on each substrate is arranged substantially horizontally when the substrates are arranged on the respective component mounting surfaces, and Forming a penetrating portion through which a thin plate-shaped wiring member for electrically connecting the circuit on the substrate disposed on the main surface side and the circuit on the substrate disposed on the back surface side of the main surface passes; The portion penetrates the main surface side and the back surface side of the main surface. Features of microwave components.