JP2575945Y2 - Cutting equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cutting an object to be cut such as a column-shaped ingot into a thin leaf shape.

[0002]

2. Description of the Related Art As shown in FIG. 7, a cutting device (slicing machine) for cutting a thin wafer from a terminal of an ingot, which is a semiconductor material, includes a workpiece 1 such as an ingot.
Reference numeral 0 is fixed to a support member 12 formed of a material such as graphite by an adhesive means or the like. Then, the ingot 10 is cut by horizontally moving the slicing machine in which the cutting blade 8 is fixed to the flange 6 in the direction of arrow A. Then, after returning the slicing machine to the original position, the support member 12
Is lowered in the direction of arrow B by the desired pitch, and the cutting blade 8 is advanced again to cut the ingot 10, and the wafer 11
To form An apparatus for forming a wafer by cutting such an ingot into a thin plate is disclosed in Japanese Utility Model Laid-Open No. 60-102907.

[0003]

When the object to be cut is cut by the apparatus described in the section of the prior art, the cut object (wafer) 11 is supported on one side only by the bonding surface with the supporting member 12. Since it is in a comb-like shape in the state,
As the 0 is cut, the cut side of the cut object 11 may be lowered by the component force of the cutting resistance. When the object 10 is lowered at a constant pitch in such a state, the accuracy of the thickness of the cut object 11 becomes inaccurate, or the accuracy of the cut surface and the parallelism of the object 11 becomes low, There was the disadvantage of reducing the quality of the cut product. In addition, when the cutting efficiency is increased, the deformation of the cut material is gradually increased, the product accuracy is reduced, and the working efficiency cannot be increased. Therefore, the present invention provides a cutting device that can efficiently produce a cut product with high product accuracy.

[0004]

SUMMARY OF THE INVENTION A cutting device according to the present invention is provided with a support for a workpiece provided with a support member having mounting means for fixing the workpiece, and an axis of the workpiece fixed to the support. A rotary table having a cutting blade that reciprocates in a direction perpendicular to the rotary table, wherein the support member of the supporter intermittently moves at a predetermined feed pitch, and the feed pitch of the support member is set below the cutting blade of the rotary table. And a plurality of plate-like support discs are mounted at the same interval as the dimension of the above.

[0005]

The object to be cut fixed to the support member of the support portion is cut into a thin leaf shape by a cutting blade which rotates and moves. The plate-like support disk attached to the lower part of the cutting blade enters the cutting gap of the object to be cut, and prevents the cutting object from being deformed by the component force of the cutting resistance.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the cutting apparatus of the present invention is applied to a cutting apparatus for cutting a wafer from an ingot as a semiconductor material will be described with reference to the drawings. FIG. 1 is an overall explanatory view of the cutting device, and FIG. 2 is a top view thereof. The cutting device is an object to be cut 50
A supporting portion 60 for supporting an ingot,
The rotary table 70 has a cutting blade 73 attached to the inner circumference of the rotary table 1. The support part 60 attaches a support member 65 to the tip of the support arm 61. The support member 65 is provided with a mounting member 63 for mounting the workpiece 50 formed of a material such as graphite. The support member 65 is supported by a driving mechanism (not shown).
1 can be moved up and down. Turntable 7
Reference numeral 0 denotes a drive unit 75 that can move in the directions of arrows XY on a base 79.
And a rotating unit 72 that is driven by the driving unit 75 and rotates. The rotating part 72 fixes the cutting blade 73 to the inner periphery of the flange 71 and also
1 at a constant distance from the cutting blade 73 on the inner periphery of
The disk 74 is mounted. The rotating shaft 77 projecting from the lower center of the rotating unit 72 is connected to the driving unit 75. The driving unit 75 rotates the rotating unit 72 around a rotating shaft 77 by a motor 76 incorporated therein. Also, the driving unit 75
Is movable in a horizontal direction (directions of arrows XY in FIG. 1) on the table 79 by a drive mechanism (not shown).

[0007] The operation of the cutting device thus configured will be described (see FIGS. 3 and 4). The cut object 50 such as an ingot is fixed to the attachment member 63 of the support portion 60 by means such as bonding. The driving unit 75 is operated to rotate the rotating unit 72. While rotating the rotation unit 72, the driving unit 75
Move on the table 79 in the direction. With the movement of the drive unit 75, the cutting blade 73 and the support disk 74 of the rotating unit 72 move horizontally in the X direction while rotating. Then, the cutting blade 73 cuts the object 50 while moving. When the cutting blade 73 reaches the mounting member 63, the movement of the drive unit 75 in the X direction is stopped. Then, the drive unit 75 is horizontally moved in the Y direction to return the rotating unit 72 to the initial position with respect to the support unit 60.
By this one reciprocating movement of the rotating part 72 in the horizontal direction,
The cutting blade 73 includes the first cut object 501 and the first
Is formed.

Next, the support member 65 is lowered in the arrow Z direction. The feed pitch of the support member 65 is set to a size P obtained by adding a margin to the plate thickness of the cut object 50. Then, the turntable 70 is moved in the direction of the arrow X while rotating the rotating unit 72 in the same manner as the first cutting. The cutting blade 73 cuts the upper part of the cut object 50 by the dimension P from the first cutting gap 511 because the cut object 50 is lowered by the dimension P corresponding to the feed pitch, and cuts the second cut object 502. Form. At this time,
The support disk 74 attached to the lower part of the cutting blade 73 with a gap of the dimension P corresponding to the feed pitch is inserted into the first cutting gap 511. The thickness of the support disk 74 is substantially equal to the gap width Q of the cutting gap 511, and the length thereof is the same as the length of the cutting blade 73.

Next, the operation of the support disk 74 will be described with reference to FIG.
With reference to, while the cutting blade 73 rotates to cut the object 50 to form the second cut object 502,
As proceeding in the direction of the arrow X, the support disk 74 becomes the first cutting gap 511 cut by the cutting blade 73 last time.
To enter. The support disk 74 has a cutting gap 511.
The second cut object 502 is supported from below at the stage of entering. The second cut object 502 exerts a force to deform the cut object 502 as indicated by an arrow due to the component force of the cutting resistance of the cutting blade 73, but the support disk 74 supports the second cut object from below. Hold 502 in place to prevent deformation. Due to the support action of the support disk 74, the support member 65 is lowered by the feed pitch, and the cutting blade 73 is moved by the arrow X.
When the workpiece 50 is cut by moving horizontally in the direction, the workpiece 50 is supported to prevent deformation, and the horizontal precision of the cutting progress operation of the cutting blade 74 is improved. Even if the support disk 74 enters the cutting gap 511, there is a small amount of clearance between the support disc 74 and the cut object 50. Therefore, problems such as heat generation due to friction with the cut object during rotation in the gap are caused. Does not occur. By repeating this operation, it is possible to manufacture a product with high levelness and plate thickness accuracy of the cut surface of the cut object 501 with good reproducibility.

In the above-described embodiment, the case where the cutting blade in the cutting device is an inner peripheral blade attached to the inside of the flange has been described. However, as shown in FIG. In the case of a cutting device provided with a circular support blade, a circular support disk 7 having the same diameter as the circular cutting blade 730 is used.
40 is fixed to the rotating shaft 770 at a lower portion of the cutting blade 730 with an interval of the dimension P provided. By rotating the rotating shaft 770, the circular cutting blade 730 and the circular support disk 74 are formed.
0 rotates to cut the object 50, and the circular support disk 740 enters the cutting gap to support the object from below.

Further, as shown in FIG. 6, by providing a plurality of support disks 741, 742, 743, 744... At intervals of a dimension P obtained by adding an allowance to the feed pitch, the cutting blade operates. In addition to supporting the cut material at the place where the cutting is performed, the wide range of the cut material is supported by the support disk, so that higher cutting workability and product accuracy can be improved.

[0012]

According to the cutting device of the present invention, a plate-shaped support disk enters the cutting gap to replenish and support the gap between the cut objects, thereby preventing deformation of the cut object during cutting, and The plane parallelism and processing accuracy are improved, and the product accuracy is increased.
In addition, in order to ensure product accuracy, precise management of the tip shape of the cutting blade and control of the bending of the cutting blade during cutting are necessary, but this cutting device is able to secure the object to be cut securely. Since there is no deformation of the object to be cut, the management of the members becomes easy, and the cutting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is an overall explanatory view of a cutting device.

FIG. 2 is a top view of the cutting device.

FIG. 3 is an explanatory view of a cut portion.

FIG. 4 is an explanatory diagram of an operation of a cut portion.

FIG. 5 is an explanatory diagram of another embodiment.

FIG. 6 is an explanatory view of still another embodiment.

FIG. 7 is an explanatory view of a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 50 workpiece 60 support section 63 mounting member 65 support member 70 turntable 72 rotating section 73 cutting blade 74 support disk 75 drive section

Claims (1)

(57) [Scope of request for utility model registration] 1. A reciprocating movement in a direction perpendicular to an axis of a workpiece fixed to the support, comprising a support portion of the workpiece provided with a support member having mounting means for fixing the workpiece.
A rotary table having a cutting blade, wherein the support member of the support section intermittently moves at a predetermined feed pitch, and a plate is provided below the rotary blade of the rotary table at an interval of the same dimension as the feed pitch of the support member. wipe Jo of support disk
A cutting device equipped with several pieces .