JP2572083B2 - Material testing machine - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a technique for appropriately switching dedicated programs (test conditions and data processing methods) corresponding to various test methods in a material testing machine.

B. Prior Art In the field of material testing of general materials, there are various testing methods depending on various materials and types of data collected.
Therefore, it is necessary to set a test condition and a data processing method according to the test method in the material testing machine each time.

The types of test methods include simple batch test, low cycle fatigue test, high cycle fatigue test, bending test, crack growth test, static load test, elasto-plastic fracture toughness test, etc. Collect data such as, maximum stress, stress-strain characteristics, crack propagation speed, _K1C value, and _J1C value.

The test conditions of the electric / hydraulic material testing machine include the constants of PID control, the waveform, amplitude, average value of the load load signal, and the range of the load detection amplifier.

The test conditions of the screw rod type material testing machine include load speed, load direction, range of load detection amplifier, chart speed of recorder, maximum value and minimum value of load signal in case of repetitive load. is there.

The data processing method includes a data sampling method, a sampling data calculation method, a display method on a display, a printer printing method, and the like.

As described above, the work of setting different test conditions and data processing methods for each test method is very troublesome. In particular, when testing frequently with a single material testing machine for the purpose of quality control of various materials, it takes a great deal of time to set the test conditions and data processing methods, and not only is the workability poor, but also There is a possibility that a setting error may occur.

Therefore, in order to simplify the setting of the test program,
Conventionally, the following method has been used.

One is a method in which several types of test programs are stored in a floppy disk, and test programs are selected and loaded as needed.

The other is CMOS in the system in the material testing machine.
-A method in which one or more test programs are provided in RAM (with battery backup).

C. Problems to be Solved by the Invention However, each of the above methods has the following problems.

In the case of the floppy disk method, a floppy disk driver is required, which is expensive and disadvantageous in terms of cost. In addition, there are problems that operation is not easy, access time is long, and handling of a floppy disk requires care.

In the case of the in-system RAM method, the number of test programs is limited due to the storage capacity. When selecting one of a plurality of test programs,
Key operations while looking at the display tend to be complicated. In addition, the volume of the display or interrupt program is increased, so that the burden on the entire system program is increased, and the execution time of the program is prolonged.

Further, when the microprocessor goes out of control for some reason, all the stored test programs are destroyed, and there is a problem in reliability.

The present invention has been made in view of such circumstances, and is advantageous in terms of cost and operation, and is capable of high-speed access when switching test programs (test conditions and data processing methods) in various ways. It is an object of the present invention to provide a highly reliable material testing machine.

D. Means for Solving the Problems The present invention has the following configuration to achieve such an object.

That is, the material testing machine according to the present invention includes a microprocessor for controlling each part of the testing machine in accordance with the read program, a memory in a system having a basic program for a test condition and a data processing method and connected to the microprocessor, And a semiconductor memory module having a dedicated program for a data processing method and having a detachable and replaceable connection to a microprocessor,
The microprocessor consists of an internal selection key for selecting the basic program of the memory in the system and an external selection key for selecting the dedicated program for the semiconductor memory module. Program selection means for switching between a state to be executed and a state to be executed.

E. Operation The operation of the configuration of the present invention is as follows.

A plurality of semiconductor memory modules are prepared corresponding to various dedicated programs, a semiconductor memory module storing a dedicated program for necessary test conditions and a data processing method is selected, and the semiconductor memory module is micro-processed. Just by connecting to the processor and selecting the dedicated program by the program selecting means, each part of the test machine is controlled based on the required dedicated program.

That is, it is very easy to switch various dedicated programs (test conditions and data processing methods) by selecting a semiconductor memory module.

Access to the semiconductor memory module is much faster than in the conventional case of loading from a floppy disk. Further, the workability is better than the test program selection operation by frequent key operations of the conventional example (in-system RAM system).

Even if the microprocessor goes out of control and the basic program on the memory in the system is destroyed, the dedicated program (test conditions and data processing method)
Since it is stored in the semiconductor memory module itself,
It is avoided that all programs (basic programs and various dedicated programs) are destroyed as in the conventional example.

In terms of cost, the conventional example does not require a floppy disk driver, and the conventional example requires a small display and interrupt program volume, reducing the load on the system program. This is advantageous in that the execution time of the program is reduced.

Further, since the semiconductor memory module is packaged, its handling is simpler than that of a floppy disk.

Since the required number of semiconductor memory modules can be prepared, it can be said that there is no restriction on the number of types of dedicated programs, which is advantageous over the conventional in-system RAM system.

F. Embodiment In FIG. 1 showing a block diagram of a main part of a material testing machine according to an embodiment of the present invention, reference numeral 1 denotes a microprocessor (CPU) in a microcomputer, and 2 denotes a system program and a basic program (test conditions and data). (Processing method) is stored in the ROM (read only memory), 3 is a RAM (random access memory) storing the obtained data, and the ROM 2 and the RAM 3 are the microprocessor 1
Are connected via an address bus, a data bus, and a control bus.

ROM2 and RAM3 correspond to the in-system memory in the configuration of the present invention.

Reference numeral 4 denotes an interface for transmitting and receiving signals between the tester main body and the microprocessor 1, reference numeral 5 denotes a display such as a CRT or a liquid crystal display, reference numeral 6 denotes a keyboard, and reference numeral 7 denotes a recorder such as a printer or plotter.

Reference numeral 8 denotes a semiconductor memory module which stores a dedicated program (test conditions and data processing method), is detachably connected to the microprocessor 1, and is replaceable.

A plurality of semiconductor memory modules 8 storing dedicated programs (test conditions and data processing methods) corresponding to various test methods are provided, each of which is a compact ROM-based or CMOS-RAM with a backup battery. The package is configured with a label indicating what the dedicated program (test conditions and data processing method) stored is for the package.

The semiconductor memory module 8 is set to “L” when the address bus, the data bus, the control bus, and the semiconductor memory module 8 are connected to the microprocessor 1.
It is configured to be connected to the microprocessor 1 via a connection detection signal line 9 for outputting a level connection detection signal ▲ ▼. The connection detection signal line 9 is connected to a DC power supply Vcc via a pull-up resistor R1.

Reference numeral 10 denotes a program selection key for switching between a state in which the microprocessor 1 executes the basic program of the ROM 2 and a state in which the dedicated program of the semiconductor memory module 8 is executed, and an internal selection key 10a for selecting a basic program in the system. And an external selection key 10b for selecting a dedicated program outside the system. One ends of these keys 10a, 10b are connected to a DC power supply Vcc via pull-up resistors R2, R3, and the other ends are grounded. The program selection key 10 corresponds to a program selection means according to the present invention.

PL1 is an internal selection display lamp that lights up when the internal selection key 10a is turned on, and PL2 is an external selection display lamp that lights up when the external selection key 10b is turned on. Each indicator lamp PL
1, Light emitting diode is used for PL2.

Figure 2 shows a specific configuration of a semiconductor memory module 8, Vcc is + 5V power supply, GND is 0V power supply, A ₀ to A _n address bus, D ₀ to D _n is the data bus, ▲ ▼ chip enable terminal, ▲ ▼ indicates an output enable terminal (lead terminal) when the semiconductor memory module 8 is a ROM. When the semiconductor memory module 8 is a RAM, the output enable terminal ▲ ▼ is the read / write terminal R /
Becomes

In addition, as shown in FIG.
Is attached to the internal selection key 10a, and the external selection indicator lamp PL2
Is attached to the external selection key 10b.

Next, the operation of this embodiment will be described with reference to the flowchart of FIG.

The operation from step S1 is started when the power of the system is turned on.

In step S1, all states are initialized, and in step S2, it is determined whether or not the connection detection signal ▼ is at the “L” level.

When the semiconductor memory module 8 is not connected to the microprocessor 1, the terminal ▼ is connected to the DC power supply Vcc via the pull-up resistor R1, so that it becomes “H” level. When the semiconductor memory module 8 is connected, the ▲ terminal is connected to the GND terminal and thus “L”.
Level.

If the determination in step S2 is NO, proceed to step S3 and
▼ By setting the terminal to “L” level, the internal selection display lamp PL1 is turned on, and the flag F is set to “IN” (=
After “0” is set, the basic program stored in the ROM 2 which is a memory in the system is executed in step S5.

That is, according to the test conditions and the data processing method according to the basic program, a register corresponding to each part of the tester main body is set, and a material test is performed by controlling each part of the tester main body. The test data thus obtained is stored in the RAM 3.

The transition from step S2 to step S5 means that when the semiconductor memory module 8 is not connected when the power is turned on, the basic program used immediately before the end of the previous operation is continuously used.

If the determination in step S2 is YES, the process proceeds to step S6, in which the external selection indicator lamp PL2 is turned on by setting the ▲ ▼ terminal to “L” level, and the flag F is set to “EXT” in step S7.
After setting (= “1”), the dedicated program (test condition and data processing method) is read from the semiconductor memory module 8 in step S8, loaded into the RAM3, and the dedicated program stored in the RAM3 is loaded in step S9. According to the test conditions and the data processing method, a register corresponding to each part of the tester main body is set, and a material test is performed by controlling each part of the tester main body. Also in this case, the obtained test data is stored in the RAM 3.

After the loading from the semiconductor memory module 8 to the RAM 3 is completed, the semiconductor memory module 8 may be separated from the microprocessor 1 or may be kept connected.

In step S10, it is determined whether or not the operation of the tester main body is stopped. If the operation is continued, the process returns to step S10 to stop the test operation.

Step S1 when the operation of the testing machine is stopped
Go to 1 and check whether the internal selection key 10a is ON
▼ Judge by whether the terminal is "L" level.

If it is ON, the process proceeds to step S12 to determine whether "EXT" is set in the flag F. If NO, that is, the execution of the basic program in the ROM 2 is continued, and the process returns to step S5.

Flag F is set to "EXT" and the internal selection key
The fact that 10a is ON means that the dedicated program loaded in RAM3 in step S8 is used.
This means switching to a state in which the basic program of ROM2 is used.

That is, the process proceeds to step S13, where the ▲ ▼ terminals are set to “H”.
Level, the external selection display lamp PL2 is turned off, the internal selection display lamp PL1 is turned on in step S14, and the flag F is switched to "IN" in step S15.
After executing the basic program of ROM2 in S16, step S10
Return to

If it is determined in step S11 that the internal selection key 10a is OFF, the process proceeds to step S17 to determine whether the external selection key 10b is ON. Step S10 when OFF
Returns to step S.
It is determined whether "IN" is set in the flag F. If NO, that is, the execution of the dedicated program loaded in the RAM 3 is continued, and the process returns to step S9.

The flag F is set to “IN” and the external selection key 1
When 0b is ON, it means that the state in which the basic program of the ROM 2 is used is switched to the state in which the dedicated program stored in the semiconductor memory module 8 is used.

In this case, the process proceeds to step S19, where the connection detection signal ▲
It is determined whether or not ▼ is at the “L” level. When the semiconductor memory module 8 is not connected, it is not possible to switch from the basic program to the dedicated program, so the process returns to step S10, and steps S10 → S11 → S17 → S18 → S19 → S10 until the semiconductor memory module 8 is connected.
repeat.

If a new semiconductor memory module 8 has already been connected by replacement or has been newly connected, the process proceeds to step S20, and the internal selection display lamp PL1 is turned off by setting the ▲ ▼ terminal to the “H” level, In step S21, the external selection display lamp PL2 is turned on.

Next, the process proceeds to step S22, in which the flag F is switched to "EXT", a dedicated program is read from the semiconductor memory module 8 in step S23, loaded into the RAM 3, and a test is executed by the dedicated program stored in the RAM 3 in step S24. After that, the process returns to step S10.

After the loading from the semiconductor memory module 8 to the RAM 3 is completed, the semiconductor memory module 8 may be separated from the microprocessor 1 or may be kept connected.

In the above series of operations, to switch the program to be used from the basic program to the dedicated program, (a) the operation of the tester body is stopped, (b) the external selection key 10 is turned on, c) The case where the semiconductor memory module 8 is connected to the microprocessor 1 and the terminal ▲ is at “L” level, and the following three conditions are satisfied.

On the other hand, in order to switch the program to be used from the dedicated program to the basic program, the following two conditions must be met: (a) the operation of the tester body is stopped, and (b) the internal selection key 10a is turned on. It is not always necessary that the ▲ ▼ terminals are at “L” level.

The flowchart in FIG. 4 shows only a basic schematic flow, and in actuality, the contents of the test conditions of the dedicated program read from the semiconductor memory module 8 are checked, and if the test conditions are satisfied, When there is an error, an error process of setting a default value (standard value) of the basic program stored in the ROM 2 instead of the test condition is performed.

In the flowchart of FIG. 4, when the dedicated program is selected, the dedicated program of the semiconductor memory module 8 is temporarily written into the RAM 3 which is a memory in the system, and the dedicated program in the RAM 3 is accessed. There is no need to limit the configuration, and the semiconductor memory module 8 may be configured to be directly accessed without writing the dedicated program to the RAM 3.

In the above embodiment, the number of the semiconductor memory modules 8 connected to the microprocessor 1 is one. Instead, a plurality of semiconductor memory modules 6 are connected to the microprocessor 1 at the same time. Any one of them may be selected. In this case, an internal selection key 10a, an external selection key 10b, an internal selection display lamp PL1, and an external selection display lamp PL2 are individually provided for each semiconductor memory module 8.

Furthermore, in the above embodiment, the internal selection key 10a and the external selection key 10b are provided as program selection means for switching between the basic program and the dedicated program.
These keys 10a and 10b are not always necessary,
The configuration may be such that the dedicated program is always selected when the ▼ terminal is at “L” level, and the basic program is always selected when the ▲ ▼ terminal is at “H” level.

G. Effects of the Invention According to the present invention, the following effects are exhibited.

By simply selecting a required semiconductor memory module from a plurality of semiconductor memory modules having dedicated programs corresponding to various test conditions and data processing methods, connecting the selected semiconductor memory module to the microprocessor, and selecting the dedicated program by the program selecting means, Each part of the testing machine can be controlled based on the required dedicated program. That is, the dedicated program (test condition and data processing method) can be switched in various ways by a very simple operation of selecting and connecting the semiconductor memory module. Therefore, if a semiconductor memory in which specific test conditions are set is prepared, simply installing a semiconductor memory module in which necessary test conditions are stored eliminates the need for complicated test condition settings, and also complicates tension and compression. By storing test settings in the system memory for basic types such as tests and storing various special programs such as fatigue tests in the semiconductor memory module, these programs can be switched easily. By simply selecting and connecting a semiconductor memory module that stores the necessary dedicated programs, the material test of any combination of the basic test and the special test can be executed by a single material test machine. It works.

Since the number of semiconductor memory modules is arbitrary, there is no restriction on the number of types of dedicated programs, which is advantageous as compared with the conventional in-system RAM system.

Even if the microprocessor goes out of control and the basic program on the memory in the system is destroyed, the dedicated program (test conditions and data processing method)
Since it is stored in the semiconductor memory module itself,
As a result, all programs (basic programs and various dedicated programs) are prevented from being destroyed as in the related art, and the reliability can be improved. Access to the semiconductor memory module is much faster than when loading from a conventional floppy disk, and it is possible to improve workability compared to the conventional frequent key operation of selecting test programs. it can. In terms of cost, it is advantageous in that a floppy disk driver is not required, the volume of a display or interrupt program is small, the load on the system program is light, and the execution time of the program is short.

Further, since the semiconductor memory module is packaged, its handling is simpler than that of a floppy disk. As described above, according to the present invention, in switching the dedicated program (test conditions and data processing method) in various ways, it is advantageous in terms of cost and operation, high-speed access is possible, and high reliability can be obtained. It has the effect of being able to.

[Brief description of the drawings]

1 to 4 relate to an embodiment of the present invention, FIG. 1 is a block diagram of a main part, FIG. 2 is a configuration diagram of a semiconductor memory module, and FIG. 3 is a diagram showing an internal selection key 10 and an external selection key. FIG. 4 and FIG. 4 are flowcharts for explaining the operation. 1 Microprocessor 2 ROM (memory in the system) 8 Semiconductor memory module 10 Program selection key (program selection means) 10a Internal selection key 10b External selection key

Continuation of the front page (56) References JP-A-60-114742 (JP, A) JP-A-62-25301 (JP, A) JP-A-58-127212 (JP, A)

Claims (1)

(57) [Claims] 1. A microprocessor for controlling each part of a tester in accordance with a read program, a memory in a system having a basic program for a test condition and a data processing method and connected to the microprocessor, and a test condition and a data processing method. A semiconductor memory module which has a dedicated program and is detachably connectable to and replaceable with the microprocessor, an internal selection key for selecting a basic program of the memory in the system for the microprocessor, and an external selection for selecting a dedicated program for the semiconductor memory module A material testing machine comprising keys and a program selecting means for switching between a state in which a basic program is executed and a state in which a dedicated program is executed by turning on / off these select keys.