JP2571389Y2 - Component mounting equipment - Google Patents

Component mounting equipment

Info

Publication number
JP2571389Y2
JP2571389Y2 JP1992062685U JP6268592U JP2571389Y2 JP 2571389 Y2 JP2571389 Y2 JP 2571389Y2 JP 1992062685 U JP1992062685 U JP 1992062685U JP 6268592 U JP6268592 U JP 6268592U JP 2571389 Y2 JP2571389 Y2 JP 2571389Y2
Authority
JP
Japan
Prior art keywords
substrate
component
support rods
components
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1992062685U
Other languages
Japanese (ja)
Other versions
JPH0629200U (en
Inventor
克彦 田口
Original Assignee
ジューキ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ジューキ株式会社 filed Critical ジューキ株式会社
Priority to JP1992062685U priority Critical patent/JP2571389Y2/en
Publication of JPH0629200U publication Critical patent/JPH0629200U/en
Application granted granted Critical
Publication of JP2571389Y2 publication Critical patent/JP2571389Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】この考案は基板に部品を搭載する
ための部品搭載装置に関し、詳しくは基板を容易かつ適
正に水平状態に支持する部品搭載置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting components on a substrate, and more particularly to a component mounting device for easily and properly supporting a substrate in a horizontal state.

【0002】[0002]

【従来の技術】[Prior art]

【0003】図4ないし図6は部品搭載装置を示す図で
あり、この部品搭載装置は水平状態に支持された基板1
(電気装置の基板)に対し、ダイオード、LSI等の電
子部品を予め決められた位置に設置する装置である。
FIGS. 4 to 6 show a component mounting apparatus. The component mounting apparatus includes a board 1 supported in a horizontal state.
This is a device for installing electronic components such as a diode and an LSI at a predetermined position with respect to a (substrate of an electric device).

【0004】図において5は支持手段であり、この支持
手段5は基板1を水平状態に支持するもので、図5に示
すよう基板1の両端部分を載置する二体のベルトコンベ
アからなり、基板1の部品搭載装置への挿入、取り出し
を容易なものとするよう矢符Yに示す方向に基板1を移
動することが出来るようになっている。そして4は部品
移送手段であり、この部品移送手段4は図4に示すよう
水平状態に支持される基板1の上方に設けられる移動腕
3と、移動腕3に設けられる吸引部2と、から構成され
ている。
In FIG. 1, reference numeral 5 denotes support means, which supports the substrate 1 in a horizontal state, and comprises two belt conveyors on which both end portions of the substrate 1 are placed as shown in FIG. The board 1 can be moved in the direction shown by the arrow Y so as to facilitate insertion and removal of the board 1 from the component mounting apparatus. Reference numeral 4 denotes a component transfer unit. The component transfer unit 4 includes a moving arm 3 provided above the substrate 1 supported in a horizontal state as shown in FIG. It is configured.

【0005】移動腕3は図においてX方向に移動可能な
X移動腕3aと、このX移動腕3aに設けられY方向に
移動可能なY移動腕3bとからなり、吸引部2は、不図
示の吸引装置に連結されY移動腕3bの下端に基板1と
対向するように設けられている。また9は部品供給手段
であり、この部品供給手段9は、電子部品を所定間隔を
おいて巻装している部品リール6を図に示すように複数
種類一列に支持する支持体7と、この複数の部品リール
6からそれぞれ部品を取り出すよう部品リール6を駆動
させるよう複数(60ないし100本)設けられる供給
シリンダ8(図5参照)と、からなっている。
The moving arm 3 comprises an X moving arm 3a movable in the X direction in the figure and a Y moving arm 3b provided on the X moving arm 3a and movable in the Y direction. Is provided at the lower end of the Y moving arm 3b so as to face the substrate 1. Reference numeral 9 denotes component supply means. The component supply means 9 supports a plurality of types of support members 7 which support component reels 6 on which electronic components are wound at predetermined intervals, as shown in FIG. A plurality (60 to 100) of supply cylinders 8 (see FIG. 5) are provided to drive the component reels 6 so as to take out the components from the plurality of component reels 6, respectively.

【0006】以上説明した各手段を備えた部品搭載装置
は、支持手段5により所定位置に基板1を移動させた
後、部品移送手段4の移動腕3を部品リール体6と基板
1との間で移動させ、部品リール6の部品を吸引部2で
保持して基板1の所定位置まで搭載する運動を複数回行
う。また部品供給手段9は部品移送手段4が部品を転送
している間に次に供給する部品を取り出し可能となるよ
う駆動をなし、供給シリンダ8は不図示のエアー供給源
とそれぞれエアー制御手段10を介して配管されてい
て、このエアー制御手段10により必要時のみエアーが
送られるようになっている。
In the component mounting apparatus provided with the above-described respective means, after the substrate 1 is moved to a predetermined position by the support means 5, the moving arm 3 of the component transfer means 4 is moved between the component reel body 6 and the substrate 1. The movement of holding the components of the component reel 6 by the suction unit 2 and mounting the components to a predetermined position on the substrate 1 is performed a plurality of times. The component supply means 9 is driven so that the next component to be supplied can be taken out while the component transfer means 4 is transferring the component, and the supply cylinder 8 is connected to an air supply source (not shown) and the air control means 10 respectively. The air is supplied only when necessary by the air control means 10.

【0007】ところでこの部品搭載装置において支持手
段5により両端部分を載置するように水平状態に支持さ
れる基板1は、中央部が重さにより撓んでしまい、部品
が適正位置に設置出来ないという不都合が生じる。なお
基板1の裏面にも部品が設置されるので、基板1の裏面
に至るように支持手段5の上面を広く形成することは出
来なかった。
By the way, in this component mounting apparatus, the substrate 1 which is supported horizontally by the support means 5 so that both end portions are mounted, the central portion is bent by the weight, and the component cannot be installed at an appropriate position. Inconvenience occurs. Since the components are also provided on the back surface of the substrate 1, the upper surface of the support means 5 cannot be formed wide so as to reach the back surface of the substrate 1.

【0008】このため今日では図6に示す基板安定手段
が提案されている。図6において12は鉄板であり、こ
の鉄板12は垂直足12aと、垂直足12aを挿通する
ように支持する支持板12bとにより水平状態を維持し
たまま昇降移動可能となっている。そして13は進退部
を鉄板12に固定し、鉄板12を昇降させるシリンダで
ある。
For this reason, a substrate stabilizing means shown in FIG. 6 has been proposed today. In FIG. 6, reference numeral 12 denotes an iron plate. The iron plate 12 can be moved up and down while maintaining a horizontal state by a vertical foot 12a and a support plate 12b that supports the vertical foot 12a so as to pass therethrough. Reference numeral 13 denotes a cylinder that fixes the advance / retreat portion to the iron plate 12 and moves the iron plate 12 up and down.

【0009】また14は支持部材であり、この支持部材
14は下端に鉄板12に吸着する磁石体を備えるととも
に図に示すように垂直状態に伸びる垂直棒を備えてい
て、鉄板12の上昇時においては基板1の底面に上端を
当接するようになっている。そしてこの支持部材14を
鉄板12に複数個(図では3個)設置することで基板1
の撓み問題を解消することが出来る。
Reference numeral 14 denotes a support member. The support member 14 has a magnet at its lower end and a vertical bar extending vertically as shown in FIG. The upper end is in contact with the bottom surface of the substrate 1. By mounting a plurality (three in the figure) of the support members 14 on the iron plate 12, the substrate 1
Can be solved.

【0010】[0010]

【発明が解決しようとする課題】しかしながら上記従来
の部品転送装置には次のような問題がある。従来の部品
搭載装置の基板安定手段は、基板1の裏面に設置される
部品に接っして部品が破損することなないよう、鉄板1
2上面の適正位置に支持部材14を設置しなければなら
ず、この設置作業は基板1の裏面を確認しつつ行う煩雑
で時間のかかる作業を余儀なくさた。
However, the above-mentioned conventional component transfer apparatus has the following problems. The board stabilizing means of the conventional component mounting apparatus uses an iron plate 1 to prevent the components from being damaged by contact with the components installed on the back surface of the board 1.
The support member 14 must be installed at an appropriate position on the upper surface of the substrate 2, and this installation operation has to be performed with a complicated and time-consuming operation while checking the back surface of the substrate 1.

【0011】特に近年でおいては多品種少量生産が要求
されるようになり、種々の基板の交替の度に煩雑な支持
部材14の位置変更を余儀なくされ、作業能率、生産能
率を低下させる原因となっていた。
In particular, in recent years, high-mix low-volume production has been required, and the position of the support member 14 has to be changed complicatedly every time various substrates are replaced, which causes a decrease in work efficiency and production efficiency. Had become.

【0012】[0012]

【課題を解決するための手段】本願発明は、基板を水平
状態に支持する支持手段と、部品を収納保持する部品供
給手段と、基板上でX方向、Y方向に移動するように設
けられる移動腕及び移動腕の下端に設置された吸引部と
からなり、部品供給手段の部品を吸引部が吸着保持して
基板上に移動して部品を基板上に載置可能とした部品移
送手段と、支持手段に支持された基板の下方においてX
方向、Y方向に行列配置され上端を基板底面に当接可能
とした複数の支持棒と、前記支持棒に各別に連結し作用
により支持棒を先端が基板底面に接する位置に上昇させ
る複数のエアシリンダと、前記エアシリンダを選択的に
作用させるエア−制御手段、とを備えた部品転送装置に
おいて、前記各支持棒の中間部外周に設け下面を形成し
た突出部と、基板と各支持棒との間において側方向に移
動可能に配置し、各支持棒の突出部が各別に貫通可能な
貫通孔を複数形成し、一側方向への移動時に前記突出部
下面に係合可能とした上面を有する当接板、とを備え、
前記突出部下面と前記当接板上面との係合により支持棒
の下降を阻止することにより、達成する。
According to the present invention, there is provided a support means for supporting a substrate in a horizontal state, a component supply means for storing and holding components, and a moving means provided to move in the X and Y directions on the substrate. A component transfer means comprising a suction unit provided at a lower end of the arm and the moving arm, wherein the component of the component supply means is sucked and held by the suction unit, moved to the substrate, and the component can be placed on the substrate; X below the substrate supported by the support means
A plurality of support rods arranged in rows and columns in the Y-direction and having an upper end capable of contacting the bottom surface of the substrate, and a plurality of air separately connected to the support rods and raising the support rod to a position where the tip comes into contact with the bottom surface of the substrate by action. A cylinder and an air-control means for selectively operating the air cylinder, wherein the component transfer device includes: a protruding portion provided on the outer periphery of an intermediate portion of each of the support rods; The upper surface is arranged so as to be movable in the lateral direction between the protrusions, and the protrusion of each support rod forms a plurality of through holes that can be individually penetrated, and the upper surface that can be engaged with the lower surface of the protrusion when moving in one direction. A contact plate having
This is achieved by preventing the lowering of the support rod by the engagement between the lower surface of the protrusion and the upper surface of the contact plate.

【0013】[0013]

【作用】この発明に係る部品搭載装置は、複数設けられ
るエアー制御手段の切り替えによって、基板の裏面の支
持を行うに適した支持棒を備えた昇降シリンダを複数個
上昇さる。
In the component mounting apparatus according to the present invention, a plurality of lifting cylinders each having a support rod suitable for supporting the back surface of the substrate are raised by switching a plurality of air control means.

【0014】ついで当接板を横方向に移動させ、この当
接板を支持棒の突出部と当接させることで上昇した支持
棒の下降を阻止し、エアー制御手段による昇降シリンダ
の上昇を解除して基板を適正に支持する。そして部品搭
載装置の駆動時においてエアー制御手段は、供給シリン
ダの駆動の制御のみを行うようにする。
Then, the contact plate is moved in the lateral direction, and the contact plate is brought into contact with the protruding portion of the support rod to prevent the raised support rod from descending and release the lifting of the lifting cylinder by the air control means. To properly support the substrate. When the component mounting apparatus is driven, the air control means controls only the driving of the supply cylinder.

【0015】[0015]

【実施例】図面にもとづいてこの発明の実施例を説明す
る。なお従来例と同一箇所には同一符号を付して重複説
明は省略する。図1ないし図3はこの発明に係る部品搭
載装置の一実施例を示す図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. The same parts as in the conventional example are denoted by the same reference numerals, and redundant description will be omitted. FIGS. 1 to 3 are views showing an embodiment of a component mounting apparatus according to the present invention.

【0016】図1においてAは昇降シリンダであり、こ
の昇降シリンダAは基板1の下方に位置していて図に示
すようにX方向、Y方向に行列設置され、駆動部を上下
方向に駆動するように設けられている。そしてこの昇降
シリンダAは内部にスプリングバネ(図2参照)を備え
ていて、このスプリングバネにより常には下降状態とな
るように付勢されている。なお図1では上昇状態を示
す。
In FIG. 1, reference numeral A denotes a lifting cylinder, which is located below the substrate 1 and is arranged in rows and columns in the X and Y directions as shown in FIG. It is provided as follows. The elevating cylinder A is provided with a spring spring (see FIG. 2) inside, and is urged by the spring spring to always be in a lowered state. FIG. 1 shows a rising state.

【0017】またBは昇降シリンダAの進退部に設けら
れる支持棒であり、この支持棒Bは横方向に突出する突
出部Baを備えていて、昇降シリンダAによる上昇時に
おいて上端部を設置された基板1の下面に当接する長さ
を有している。一方Cは当接板であり、この当接板Cは
図に示すように複数の昇降シリンダAの進退部の近傍に
設けられ、支持棒Bが昇降通過可能な貫通穴を複数備
え、横方向に移動可能に設けられている。
Reference numeral B denotes a support bar provided at the reciprocating portion of the elevating cylinder A. The supporting bar B has a protruding portion Ba which protrudes in the lateral direction. And has a length in contact with the lower surface of the substrate 1. On the other hand, C is a contact plate, which is provided in the vicinity of the advancing / retracting portions of the plurality of lifting cylinders A as shown in the figure, and has a plurality of through holes through which the support rod B can pass up and down. Is provided so as to be movable.

【0018】一方前記の昇降シリンダAは前記のエアー
供給手段10(図5参照)にそれぞれ配管され、基板の
おおきさあるいは形状等に応じて、基板の下方に対向す
る支持棒Bに設けた昇降シリンダを、エアー経路の弁の
開閉等の手段により自動または手動的に選択して駆動さ
せることが出来るようになっている。
On the other hand, the elevating cylinder A is piped to the air supply means 10 (see FIG. 5), and the elevating cylinder A is provided on a support rod B opposed to the lower part of the substrate according to the size or shape of the substrate. The cylinder can be automatically or manually selected and driven by means such as opening and closing a valve in an air path.

【0019】以上説明した部品搭載装置は、基板1の裏
面の支持を行うに適した位置、すなわち部品が設置され
ていない基板面の下方位置にある昇降シリンダAを複数
個選択し、エアー制御手段10によってこれら昇降シリ
ンダAを上昇駆動させ、図2に示すように選択した支持
棒Bの先端部を基板1の裏面に当接させる。次いで図3
に示すように当接板Cを横方向に移動させ、この当接板
Cを支持棒Bの突出部Baの下方に挿入させる。
The component mounting apparatus described above selects a plurality of lifting cylinders A at a position suitable for supporting the back surface of the substrate 1, that is, at a position below the surface of the substrate on which no components are installed. The lifting cylinder A is driven to move upward by 10 so that the tip of the selected support rod B is brought into contact with the back surface of the substrate 1 as shown in FIG. Then FIG.
As shown in (1), the contact plate C is moved in the lateral direction, and the contact plate C is inserted below the protrusion Ba of the support rod B.

【0020】そしてこの当接板Cの移動後にエアー制御
手段10を切り替え、昇降シリンダAへのエアー供給を
停止し、エアー制御手段10を供給シリンダ8(図5参
照)の駆動の制御のみを行うようにする。これにより昇
降シリンダAは格納するスプリングバネにより支持棒B
を下降させようとするが、支持棒Bは当接板Cにより下
降が阻止されているので先端部により基板1に撓みが生
じないように適正に支持することが出来る。
After the movement of the contact plate C, the air control means 10 is switched to stop the air supply to the lifting cylinder A, and the air control means 10 controls only the driving of the supply cylinder 8 (see FIG. 5). To do. Thus, the lifting cylinder A is supported by the supporting rod B by the retracted spring spring.
However, since the support bar B is prevented from being lowered by the contact plate C, the support rod B can be properly supported so that the substrate 1 is not bent by the tip.

【0021】[0021]

【考案の効果】この考案は、各支持棒の中間部外周に設
け下面を形成した突出部と、基板と各支持棒との間にお
いて側方向に移動可能に配置し、各支持棒の突出部が各
別に貫通可能な貫通孔を複数形成し、一側方向への移動
時に前記突出部下面に係合可能とした上面を有する当接
板、とを備え、前記突出部下面と前記当接板上面との係
合により支持棒の下降を阻止することにより、基板の設
置を迅速かつ容易にするとともに、基板に撓みを生じさ
せないように適正に支持することができ、更に突出部下
面と当接板上面とにより上下方向に確実に支持でき、基
板上面と部品移送手段の吸着部との上下方向誤差が生じ
ることがなく、製品の信頼性を向上するという、この種
装置特有の効果が得られる。
According to the present invention, a projecting portion provided on the outer periphery of an intermediate portion of each support rod and having a lower surface is disposed so as to be movable in a lateral direction between the substrate and each support rod, and the projecting portion of each support rod is provided. A plurality of through-holes that can be individually penetrated, and a contact plate having an upper surface capable of engaging with the lower surface of the protruding portion when moving in one side direction; and a lower surface of the protruding portion and the abutting plate. By preventing the lowering of the support rod by engaging with the upper surface, the substrate can be quickly and easily installed, and the substrate can be properly supported so as not to bend, and further, can be brought into contact with the lower surface of the protrusion. The upper surface of the board can be reliably supported in the up-down direction, and there is no vertical error between the upper surface of the board and the suction portion of the component transfer means, thereby improving the reliability of the product. .

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明に係る部品搭載装置の一実施例を示す
一部省略斜視図である。
FIG. 1 is a partially omitted perspective view showing one embodiment of a component mounting apparatus according to the present invention.

【図2】図1に示した部品搭載装置の昇降シリンダを上
昇させた状態を示す説明図である。
FIG. 2 is an explanatory view showing a state where a lifting cylinder of the component mounting apparatus shown in FIG. 1 is raised.

【図3】図2の状態で当接板を横方向に移動させ支持棒
の下降を阻止した状態を示す説明図である。
FIG. 3 is an explanatory view showing a state in which the contact plate is moved in the lateral direction in the state of FIG. 2 to prevent the support rod from descending.

【図4】従来の部品搭載装置を示す外観斜視図である。FIG. 4 is an external perspective view showing a conventional component mounting apparatus.

【図5】図4に示した部品搭載装置の支持手段および供
給シリンダの設置状態を示す外観斜視図である。
FIG. 5 is an external perspective view showing an installation state of a support means and a supply cylinder of the component mounting apparatus shown in FIG. 4;

【図6】図4に示した部品搭載装置に設けられた基盤安
定手段を示す側面図である。
FIG. 6 is a side view showing a base stabilizing unit provided in the component mounting apparatus shown in FIG.

【符号の説明】[Explanation of symbols]

1 基板 2 吸引部 3 移動腕 4 部品移送手段 5 支持手段 6 部品リール体 8 供給シリンダ 9 供給手段 10 エアー制御手段 A 昇降シリンダ B 支持棒 C 当接棒 DESCRIPTION OF SYMBOLS 1 Substrate 2 Suction part 3 Moving arm 4 Parts transfer means 5 Support means 6 Parts reel body 8 Supply cylinder 9 Supply means 10 Air control means A Elevating cylinder B Support rod C Contact rod

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 基板を水平状態に支持する支持手段と、 部品を収納保持する部品供給手段と、 基板上でX方向、Y方向に移動するように設けられる移
動腕及び移動腕の下端に設置された吸引部とからなり、
部品供給手段の部品を吸引部が吸着保持して基板上に移
動して部品を基板上に載置可能とした部品移送手段と、 支持手段に支持された基板の下方においてX方向、Y方
向に行列配置され上端を基板底面に当接可能とした複数
の支持棒と、 前記支持棒に各別に連結し作用により支持棒を先端が基
板底面に接する位置に上昇させる複数のエアシリンダ
と、 前記エアシリンダを選択的に作用させるエア−制御手
段、 とを備えた部品転送装置において、 前記各支持棒の中間部外周に設け下面を形成した突出部
と、 基板と各支持棒との間において側方向に移動可能に配置
し、各支持棒の突出部が各別に貫通可能な貫通孔を複数
形成し、一側方向への移動時に前記突出部下に係合可
能とした上面を有する当接板、 とを備え、前記突出部下と前記当接板上面との係合に
より支持棒の下降を阻止することを特徴とした部品転送
装置。
1. A supporting means for supporting a substrate in a horizontal state, a component supply means for storing and holding components, a moving arm provided to move in the X and Y directions on the substrate, and a lower end of the moving arm. And a suction unit
A component transferring means for sucking and holding the components of the component supply means by the suction unit and moving the components onto the board so that the components can be placed on the board; and a X-direction and a Y-direction below the board supported by the supporting means. A plurality of support rods arranged in a matrix and having an upper end capable of contacting the bottom surface of the substrate; a plurality of air cylinders respectively connected to the support rods to raise the support rods to a position where the top ends contact the bottom surface of the substrate by action; An air control means for selectively operating a cylinder, wherein: a protruding portion provided on the outer periphery of an intermediate portion of each of the support rods and forming a lower surface; and a lateral direction between the substrate and each of the support rods. Abutment plate having a top surface that is movably arranged, and that has a plurality of through holes through which the protrusion of each support rod can individually penetrate, and which can be engaged with the lower surface of the protrusion when moving in one direction. And the lower surface of the protrusion and the contact A component transfer device, wherein a lowering of a support rod is prevented by engagement with an upper surface of a contact plate.
JP1992062685U 1992-09-07 1992-09-07 Component mounting equipment Expired - Fee Related JP2571389Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992062685U JP2571389Y2 (en) 1992-09-07 1992-09-07 Component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992062685U JP2571389Y2 (en) 1992-09-07 1992-09-07 Component mounting equipment

Publications (2)

Publication Number Publication Date
JPH0629200U JPH0629200U (en) 1994-04-15
JP2571389Y2 true JP2571389Y2 (en) 1998-05-18

Family

ID=13207392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992062685U Expired - Fee Related JP2571389Y2 (en) 1992-09-07 1992-09-07 Component mounting equipment

Country Status (1)

Country Link
JP (1) JP2571389Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666823B2 (en) * 2001-07-12 2011-04-06 株式会社日立ハイテクインスツルメンツ Board backup mechanism for electronic component mounting equipment
JP4501771B2 (en) * 2005-05-09 2010-07-14 パナソニック株式会社 Substrate receiving device and substrate receiving method in electronic component mounting apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH082000B2 (en) * 1989-06-28 1996-01-10 ジューキ株式会社 Electronic component mounting device
JPH0464297A (en) * 1990-07-04 1992-02-28 Matsushita Electric Ind Co Ltd Board holding and securing device
JPH04127500A (en) * 1990-09-18 1992-04-28 Fujitsu Ltd Automatic selection backup device for printed wiring board

Also Published As

Publication number Publication date
JPH0629200U (en) 1994-04-15

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