JP2550904B2 - Wire chucking mechanism - Google Patents
Wire chucking mechanismInfo
- Publication number
- JP2550904B2 JP2550904B2 JP5335682A JP33568293A JP2550904B2 JP 2550904 B2 JP2550904 B2 JP 2550904B2 JP 5335682 A JP5335682 A JP 5335682A JP 33568293 A JP33568293 A JP 33568293A JP 2550904 B2 JP2550904 B2 JP 2550904B2
- Authority
- JP
- Japan
- Prior art keywords
- chucking mechanism
- claws
- rotary
- claw
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48092—Helix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、２本の微細ワイヤを半
導体チップのパタン面にボンディングするために、高精
度に平行であって、かつ正確な位置決めを行うワイヤチ
ャッキング機構に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire chucking mechanism for performing parallel positioning with high accuracy and for accurate positioning for bonding two fine wires to a pattern surface of a semiconductor chip.
【０００２】[0002]
【従来の技術】従来、２本の微細ワイヤを半導体チップ
のパタン面にボンディングする方法として、図４に示す
ように、２本の微細ワイヤ１３を１本ずつピンセット１
６等で把持し、顕微鏡等を用いて半導体チップ１４のパ
タン面へ前記微細ワイヤ１３の被覆部分を位置決めして
いた。2. Description of the Related Art Conventionally, as a method for bonding two fine wires to a pattern surface of a semiconductor chip, as shown in FIG.
The fine wire 13 was gripped with 6 or the like, and the coated portion of the fine wire 13 was positioned on the pattern surface of the semiconductor chip 14 using a microscope or the like.
【０００３】[0003]
【発明が解決しようとする課題】微細ペアー線の位置決
めは、単線を位置決めする場合と異なり、人手による熟
練作業に頼るしかなく、作業効率が非常に悪く、また、
位置決めの精度も不安定であった。Unlike the case of positioning a single wire, the positioning of a fine pair wire depends on a skilled manual work, resulting in very poor work efficiency.
The positioning accuracy was also unstable.
【０００４】[0004]
【課題を解決するための手段】上記問題点を解決するた
めに、本発明のワイヤチャッキング機構は、所定の間隔
を開けて固定され、２本のワイヤを内側から支える複数
の内爪と、前記内爪の外側に配置され、前記２本のワイ
ヤを外側から支える外爪と、前記外爪を同時に開閉駆動
させる駆動手段とを有する。In order to solve the above problems, the wire chucking mechanism of the present invention has a plurality of inner claws which are fixed at a predetermined interval and support two wires from the inside. It has an outer claw that is arranged outside the inner claw and supports the two wires from the outer side, and a driving unit that simultaneously drives the outer claw to open and close.
【０００５】[0005]
【実施例】次に、本発明のワイヤチャッキング機構の一
実施例について図面を参照して詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, one embodiment of the wire chucking mechanism of the present invention will be described in detail with reference to the drawings.
【０００６】図１は、本発明の一実施例の構成を示す平
面図であり、図２は、その正面図である。Ｔ字形をした
内爪１、２は、それぞれ装置台に所定の間隔で固定さ
れ、平行な２本の微細ワイヤを内側から支える。外爪
３、４は、前記微細ワイヤを外側から支える。外爪用ガ
イドプレート５、６は、前記外爪３または外爪４に固定
され、この外爪３および外爪４を開閉駆動する。ガイド
レール７は、前記外爪用ガイドプレート５および外爪用
ガイドプレート６を平行に移動させる。板カム９は、図
示せぬ駆動手段により回転する回転アクチュエータ８の
回転軸に連結され、この回転アクチュエータ８の回転と
ともに回転する。回転ベアリング１０は、前記板カム９
に連接されるとともに外爪用ガイドプレート５に設置さ
れ、前記板カム９が回転することによりこの外爪用ガイ
ドプレート５を移動させる。回転ベアリング１１は、前
記板カム９における前記回転ベアリング１０が連接され
た位置と対称な位置に連接されるとともに前記外爪用ガ
イドプレート６に設置され、前記板カム９が回転するこ
とによりこの外爪用ガイドプレート６を移動させる。ば
ね１２は、前記外爪用ガイドプレート５および前記外爪
用ガイドプレート６の間に取り付けられ前記外爪３、４
が閉まる方向にテンションを与える。FIG. 1 is a plan view showing the structure of an embodiment of the present invention, and FIG. 2 is a front view thereof. The T-shaped inner claws 1 and 2 are fixed to the device stand at predetermined intervals, and support two parallel fine wires from the inside. The outer claws 3 and 4 support the fine wire from the outside. The outer claw guide plates 5 and 6 are fixed to the outer claw 3 or the outer claw 4 and drive the outer claw 3 and the outer claw 4 to open and close. The guide rail 7 moves the outer claw guide plate 5 and the outer claw guide plate 6 in parallel. The plate cam 9 is connected to a rotary shaft of a rotary actuator 8 which is rotated by a driving unit (not shown), and rotates with the rotation of the rotary actuator 8. The rotary bearing 10 is the plate cam 9
Is installed on the outer nail guide plate 5 and is rotated by the plate cam 9 to move the outer nail guide plate 5. The rotary bearing 11 is connected to the plate cam 9 at a position symmetrical to the position where the rotary bearing 10 is connected and is installed on the outer claw guide plate 6, and the plate cam 9 rotates to rotate the rotary bearing 11. The guide plate 6 for nails is moved. The spring 12 is attached between the outer claw guide plate 5 and the outer claw guide plate 6, and the outer claws 3, 4 are attached.
Apply tension in the direction of closing.
【０００７】次に、本発明の一実施例の動作について図
１および図２を用いて説明する。Next, the operation of the embodiment of the present invention will be described with reference to FIGS. 1 and 2.
【０００８】装置台に所定の間隔で内爪１、２が固定さ
れており、その内爪１および内爪２の幅は同一寸法Ａと
なっている。この内爪１、２に対し、外側から平行な２
本の微細ワイヤの先端部分を取り付ける。ここで、前記
内爪１および２がＴ字形であるためにこの内爪１および
２に取り付けられた部分においては前記微細ワイヤは上
部からもカバーされているが、この内爪１および２は所
定の間隔で固定されているために、この内爪１および２
の間の部分においては前記微細ワイヤは上部に現れてい
る。The inner claws 1 and 2 are fixed to the apparatus base at a predetermined interval, and the widths of the inner claw 1 and the inner claw 2 are the same size A. 2 parallel to the inner claws 1 and 2 from the outside
Attach the tip of the fine wire of the book. Here, since the inner claws 1 and 2 are T-shaped, the fine wire is also covered from above in the portion attached to the inner claws 1 and 2, but the inner claws 1 and 2 are predetermined. The inner claws 1 and 2 are fixed because they are fixed at the intervals of
In the portion between the above, the fine wire is exposed at the top.
【０００９】次に、前記内爪１、２の両側に取り付けら
れた平行な２本の前記微細ワイヤを両側から外爪３およ
び４により押さえる。Next, the two parallel fine wires attached to both sides of the inner claws 1 and 2 are pressed by the outer claws 3 and 4 from both sides.
【００１０】ここで、平行な２本の前記微細ワイヤを両
側から押さえる外爪３、４の開閉動作について説明す
る。The opening / closing operation of the outer claws 3 and 4 for pressing the two parallel fine wires from both sides will be described.
【００１１】外爪３、４にはそれぞれ外爪用ガイドプレ
ート５、６が取り付けられており、この外爪用ガイドプ
レートにはそれぞれ回転ベアリング１０、１１が取り付
けられている。図示しない駆動手段により回転する回転
アクチュエータ８の回転軸には板カム９が連結されてお
り、この板カム９の中心に対し対称な位置には前記回転
ベアリング１０および１１が連接されている。前記回転
アクチュエータ８が回転することにより前記板カム９が
回転し、その板カム９の回転に合わせて前記回転ベアリ
ング１０および１１が直線的に駆動する。この回転ベア
リング１０および１１が駆動することにより、その回転
ベアリング１０および１１に取り付けられた外爪用ガイ
ドプレート５および６も移動し、それにともなって前記
外爪３および４も移動する。前記板カム９は自身が回転
することで、前記外爪３および４が同時に開閉駆動する
ように形成されている。External claw guide plates 5 and 6 are attached to the outer claws 3 and 4, respectively, and rotary bearings 10 and 11 are attached to the outer claw guide plates, respectively. A plate cam 9 is connected to a rotary shaft of a rotary actuator 8 which is rotated by a driving means (not shown), and the rotary bearings 10 and 11 are connected to a position symmetrical with respect to the center of the plate cam 9. When the rotary actuator 8 rotates, the plate cam 9 rotates, and the rotary bearings 10 and 11 are linearly driven according to the rotation of the plate cam 9. When the rotary bearings 10 and 11 are driven, the outer claw guide plates 5 and 6 attached to the rotary bearings 10 and 11 also move, and the outer claws 3 and 4 also move accordingly. The plate cam 9 is formed so that the outer claws 3 and 4 are simultaneously opened and closed by rotating itself.
【００１２】前記回転アクチュエータ８が回転するにつ
れて、前記外爪３および４が閉められていくが、ここ
で、前記平行な２本の微細ワイヤを外側から押さえる時
点では、前記板カム９による駆動力は前記外爪３および
４には加わらず、前記外爪用ガイドプレート５および外
爪用ガイドプレート６の間に取り付けられたばね１２に
よる圧力のみが前記微細ワイヤに加わる。前記外爪３お
よび４の解放時には前記回転アクチュエータ８の回転に
よる前記板カム９の駆動力により前記ばね１２の張力に
逆らって押し広げられる。As the rotary actuator 8 rotates, the outer claws 3 and 4 are closed. Here, at the time of pressing the two parallel fine wires from the outside, the driving force of the plate cam 9 is applied. Does not apply to the outer claws 3 and 4, but only the pressure by the spring 12 mounted between the outer claw guide plate 5 and the outer claw guide plate 6 is applied to the fine wire. When the outer claws 3 and 4 are released, the driving force of the plate cam 9 caused by the rotation of the rotary actuator 8 pushes the outer claw 3 against the tension of the spring 12.
【００１３】また、前記内爪１および２をその幅Ａの異
なるものに付け変えることにより、微細ワイヤ間のピッ
チを所望の間隔に高精度に保持、位置決めをすることが
できる。Further, by changing the inner claws 1 and 2 to those having different widths A, the pitch between the fine wires can be accurately maintained and positioned at a desired interval.
【００１４】次に平行な２本の微細ワイヤが内爪１およ
び２と外爪３および４によりチャッキングされたのちの
作業について図３を用いて説明する。Next, the work after two parallel fine wires are chucked by the inner claws 1 and 2 and the outer claws 3 and 4 will be described with reference to FIG.
【００１５】前記内爪１および２は所定の間隔で取り付
けられており、その隙間部分の下部にボンディングされ
るべき半導体チップ１４を配置する。また、その隙間部
分においては高精度に位置決めされてチャッキングされ
た微細ワイヤ１３が外部に現れており、この隙間部分に
ボンディングツール１５等を挿入して前記半導体チップ
１４のパタン面に前記微細ワイヤ１３をボンディングす
る。The inner claws 1 and 2 are attached at a predetermined interval, and the semiconductor chip 14 to be bonded is arranged below the clearance. Further, in the gap portion, the fine wire 13 which is positioned and chucked with high precision is exposed to the outside, and the bonding tool 15 or the like is inserted into the gap portion to form the fine wire on the pattern surface of the semiconductor chip 14. Bond 13 together.
【００１６】[0016]
【発明の効果】以上説明したように、本発明のワイヤチ
ャッキング機構は、平行な２本の微細ワイヤを内側から
支える２つの内爪を所定の間隔をもって固定するため
に、その２つの内爪の隙間に作業空間ができる。その作
業空間の下方に配置された半導体チップのパタン面に対
し、ボンディングツール等をその作業空間に挿入してボ
ンディングを行うことができるためにボンディング作業
が非常に正確かつ簡単になる。As described above, in the wire chucking mechanism of the present invention, the two inner claws that support two parallel fine wires from the inside are fixed at a predetermined interval, so that the two inner claws are fixed. There is a working space in the gap. Since the bonding tool or the like can be inserted into the work space for bonding to the pattern surface of the semiconductor chip arranged below the work space, the bonding work becomes very accurate and easy.
【００１７】また、２つの内爪の幅を同一寸法とするた
めに、２本の微細ワイヤは高精度に平行にチャッキング
される。さらに、この２つの内爪を幅の異なる他の２つ
の内爪に交換することにより、所望の間隔の平行チャッ
キングが可能となる。Further, in order to make the widths of the two inner claws the same, the two fine wires are chucked in parallel with high precision. Further, by exchanging the two inner claws with another two inner claws having different widths, parallel chucking with a desired spacing becomes possible.
【００１８】また、２つの外爪を駆動する２つの外爪用
ガイドプレートの間にばねを設け、微細ワイヤをチャッ
キングする際に外爪が閉じる方向に働く力をそのばねに
よる力のみとすることにより、チャッキングが原因によ
る微細ワイヤのつぶれおよびキズ等の発生を防ぐことが
できる。Further, a spring is provided between the two outer claw guide plates for driving the two outer claws, and the force acting in the closing direction of the outer claw when chucking the fine wire is limited to the force of the spring. As a result, it is possible to prevent the fine wire from being crushed and scratched due to the chucking.
【図１】本発明のワイヤチャッキング機構の一実施例の
構成を示す平面図。FIG. 1 is a plan view showing the configuration of an embodiment of a wire chucking mechanism of the present invention.
【図２】図１に示した一実施例の正面図。FIG. 2 is a front view of the embodiment shown in FIG.
【図３】本発明のワイヤチャッキング部分の構成を示す
図。FIG. 3 is a diagram showing a configuration of a wire chucking portion of the present invention.
【図４】従来のワイヤチャッキング方法を示す図。FIG. 4 is a diagram showing a conventional wire chucking method.
１、２ 内爪 ３、４ 外爪 ５、６ 外爪用ガイドプレート ７ ガイドレール ８ 回転アクチュエータ ９ 板カム １０、１１ 回転ベアリング １２ ばね １３ 微細ワイヤ １４ 半導体チップ １５ ボンディングツール １６ ピンセット 1, 2 Inner claw 3, 4 Outer claw 5, 6 Outer claw guide plate 7 Guide rail 8 Rotating actuator 9 Plate cam 10, 11 Rotating bearing 12 Spring 13 Fine wire 14 Semiconductor chip 15 Bonding tool 16 Tweezers
Claims (5)
イヤを内側から支える複数の内爪と、 前記内爪の外側に配置され、前記２本のワイヤを外側か
ら支える外爪と、 前記外爪を同時に開閉駆動させる駆動手段とを有するこ
とを特徴とするワイヤチャッキング機構。1. A plurality of inner claws fixed at a predetermined interval to support two wires from the inside, and an outer claw arranged outside the inner claw to support the two wires from the outside. A wire chucking mechanism comprising: a driving unit that simultaneously drives the outer claws to open and close.
ることを特徴とする前記請求項１に記載のワイヤチャッ
キング機構。2. The wire chucking mechanism according to claim 1, wherein the plurality of inner claws have the same width.
する前記請求項１または２に記載のワイヤチャッキング
機構。3. The wire chucking mechanism according to claim 1, wherein the inner claw is T-shaped.
アクチュエータとともに回転する板カムと、 前記板カムに対し対称的な位置に外接し、その板カムが
回転にあわせて移動する２つの回転ベアリングと、 一端が前記回転ベアリングに取り付けられるとともに他
端が前記外爪に取り付けられ、前記回転ベアリングの移
動にあわせて前記外爪を同時に開閉移動させる２つのガ
イドプレートとを有することを特徴とする前記請求項１
または２または３に記載のワイヤチャッキング機構。4. The drive means includes a rotary actuator that is rotationally driven, a plate cam that is connected to a rotary shaft of the rotary actuator, and rotates together with the rotary actuator, and is circumscribed at a symmetrical position with respect to the plate cam. Two rotary bearings whose plate cams move according to the rotation, and one end attached to the rotary bearing and the other end attached to the outer pawl, and the outer pawl is simultaneously opened and closed according to the movement of the rotary bearing. The two guide plates which make it exist, The said 1 characterized by the above-mentioned.
Alternatively, the wire chucking mechanism according to 2 or 3.
けられ前記外爪に対し閉方向の張力を与えるばねを有す
ることを特徴とする前記請求項４に記載のワイヤチャッ
キング機構。5. The wire chucking mechanism according to claim 4, further comprising a spring mounted between the two guide plates to apply a tension in a closing direction to the outer claw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5335682A JP2550904B2 (en) | 1993-12-28 | 1993-12-28 | Wire chucking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5335682A JP2550904B2 (en) | 1993-12-28 | 1993-12-28 | Wire chucking mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07201905A JPH07201905A (en) | 1995-08-04 |
| JP2550904B2 true JP2550904B2 (en) | 1996-11-06 |
Family
ID=18291327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5335682A Expired - Lifetime JP2550904B2 (en) | 1993-12-28 | 1993-12-28 | Wire chucking mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2550904B2 (en) |
-
1993
- 1993-12-28 JP JP5335682A patent/JP2550904B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07201905A (en) | 1995-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960625 |