JP2548549Y2 - Resin sealing molds for semiconductor devices - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin mold for a semiconductor element mounted on a lead frame, and more particularly to a resin mold suitable for multi-product production.

[0002]

2. Description of the Related Art As a mold for resin-molding a semiconductor element, as shown in a lower mold 50 in FIG. 3, a large number of cavities in which a semiconductor element mounted on a lead frame is arranged are divided into a plurality of cavity groups. It was divided into 51-54, and the molten resin was injected from the central cull portion 55 through the runners 57-60. In some cases, the cavity groups 51 to 54 have a structure in which two to four different types of semiconductor elements can be simultaneously resin-sealed.

[0003]

However, depending on the demand for the semiconductor element, if it becomes necessary to seal only a specific type of semiconductor element among the semiconductor devices that can be manufactured by the mold, the above-described method is required. Since the mold has a structure in which the resin flows into all the cavity groups 51 to 54, there is a problem that the resin is filled up to the unnecessary cavity groups, and the resin is wasted. The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a resin-sealing mold for a semiconductor device, which can use a resin with a simple operation without waste, and can be applied to a high-mix low-volume production. Aim.

[0004]

According to the present invention, there is provided a semiconductor device comprising:
The resin-sealing mold for a semiconductor device according to the present invention, a large number of cavities in which semiconductor elements to be resin-sealed are arranged, are divided into a plurality of groups according to the type of the semiconductor element to be resin-sealed,
A resin-sealing mold capable of press-fitting a resin from a cull portion into each of the cavity groups through a runner formed in a lower mold to perform resin sealing of a plurality of types of semiconductor devices, and sends the resin to each of the cavity groups. A stopper that can be opened and closed is provided at the base end of the runner, enabling selective use of only a part of the cavity group.
A circular hole formed at the base end of the runner formed in the lower mold and having an inner diameter larger than the groove width of the runner, and rotatably mounted in the circular hole. A cylindrical body having a groove through which the resin passes while being engaged with the runner; and a cylindrical body having a hole for inserting a wrench. The cylindrical body can be opened and closed by rotating the cylindrical body by 90 degrees.

[0005]

In the resin sealing mold for a semiconductor device according to the first aspect, a stopper that can be opened and closed is provided at the base end of the runner that receives the supply of the resin from the cull portion, so that the stopper can be opened and closed. Thus, a group of cavities to be resin-sealed can be selected, whereby only a specific type of semiconductor element can be resin-sealed. The stopper is formed at a base end of a runner formed in a lower mold, and has a circular hole having an inner diameter larger than a groove width of the runner, and is rotatably mounted in the circular hole. And a column with a hole for inserting a wrench, and the opening and closing can be performed by rotating the column by 90 degrees. The maintenance is easy because the structure is simple and the structure is also simple.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the accompanying drawings to facilitate understanding of the present invention. Here, FIG. 1 is a partial plan view of a lower mold constituting a resin sealing mold for a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a partial sectional view of the same. As shown in FIG. 1, a lower mold 10 constituting a resin-sealing mold for a semiconductor device according to an embodiment of the present invention has a cull portion 11 in the center, and the periphery thereof around the cull portion 11. Four cavity groups 12 to 15 are provided, and are connected to these via runners 16 to 19. In the upper mold, a portion corresponding to the cull portion 11 is a pot, and portions corresponding to the runners 16 to 19 are planar.

In the cavity groups 12 to 15, different types of semiconductor elements mounted on a lead frame are arranged, and resin is filled through the runners 16 to 19 and gates 20 to 23 connected to the runners 16 to 19. ing.

At the base ends of the runners 16 to 19 are provided stoppers 24 to 27 which can be opened and closed, respectively. As shown in FIGS. 1 and 2, the stoppers 24 to 27 are rotatably fitted into circular holes 24 a formed at the base ends of the runners 16 to 19 of the lower die 10.
8 is provided. The circular hole 24a is provided for the runners 16-1.
A groove 29 which is wider than the groove width of No. 9 and which engages with the runners 16 to 19 is provided at the center of the upper part of the cylindrical body 28 which fits therein.
A hexagonal hole 30 (hereinafter referred to as a hexagonal hole) in the center of the groove 29
Are formed. When the stopper 24 is operated, a predetermined wrench having a hexagonal cross section is inserted into the hexagonal hole 30 and the stopper 24 is opened and closed by rotating the wrench approximately 90 degrees.

Therefore, when using the resin-sealing mold for the semiconductor device, the cavities to be resin-sealed are determined by operating the stoppers 24-27 provided in the lower mold 10 in advance. . Thereby, the stoppers 24-2
When the valve 7 is closed, the resin press-fitted from the cull portion 11 stops at the closed stopper, so that the resin can be prevented from flowing into unnecessary cavities.

[0010]

In the resin sealing mold for a semiconductor device according to the present invention, since a stopper that can be opened and closed is provided at the base end of the runner, a cavity group can be selected, thereby making it unnecessary. Since the resin does not need to flow into the cavity groups, waste of the resin is eliminated. In addition, since each cavity group can be selectively arranged so as to be used for various semiconductor elements, it is possible to efficiently cope with the manufacture of a wide variety of semiconductor devices, and to reduce the manufacturing cost. And since the structure of the stopper is simple, there are few troubles, and the operation of the stopper can be performed by inserting a wrench into the wrench insertion hole from above, so that the operation is easy and the stopper is easily opened and closed, and the cavity group is opened. Can be selected.

[Brief description of the drawings]

FIG. 1 is a partial plan view of a lower mold of a resin sealing mold for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a partial sectional view of the same.

FIG. 3 is a plan view of a lower mold of a resin sealing mold for a semiconductor device according to a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Lower mold 11 Cull part 12 Cavity group 13 Cavity group 14 Cavity group 15 Cavity group 16 Runner 17 Runner 18 Runner 19 Runner 20 Gate 21 Gate 22 Gate 23 Gate 24 Stopper 24 a Circular hole 25 Stopper 26 Stopper 27 Stopper 28 Cylindrical body 29 Groove 30 hexagonal hole

Claims (1)

(57) [Scope of request for utility model registration] A plurality of cavities in which semiconductor elements to be resin-sealed are arranged are divided into a plurality of groups according to the type of the semiconductor elements to be resin-sealed, and each cavity group is formed as a lower die. A resin sealing mold capable of resin injection of a plurality of types of semiconductor devices by press-fitting a resin from a cull portion through a runner provided, and a stopper that can be opened and closed at a base end of the runner that sends the resin to each of the cavity groups. The stopper is formed at the base end of the runner formed on the lower die, and the inner diameter is larger than the groove width of the runner. A cylindrical body having a groove for rotatably mounted in the circular hole, and having a groove for engaging with the runner at the time of opening to allow the resin to pass therethrough, and a hole for inserting a wrench in the center upper part. The a, a resin-sealing mold for semiconductor device characterized by enabling its opening and closing by rotating the circular pillar 90 degrees.