JP2978855B2 - Lead frame, semiconductor device using this lead frame, and apparatus for manufacturing this semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame, a semiconductor device using the lead frame, and an apparatus for manufacturing the semiconductor device. More particularly, the present invention relates to a multiple lead frame for mounting a thin resin-sealed package and a lead frame. The present invention relates to a semiconductor device used and a manufacturing apparatus for resin molding of the semiconductor device.

[0002]

2. Description of the Related Art In recent years, a plurality of pots and plungers have been provided in a single mold, and a sealing resin has been transferred from each pot to each cavity through a short runner as a means for rationalizing a resin sealing process of a semiconductor. The multi-spot molding method is widespread.

FIG. 4 is a plan view of a conventional lead frame described in, for example, Japanese Patent Application Laid-Open No. Sho 62-122136, which is compatible with this type of molding method. In this example, a plurality of cavities including an island portion for mounting a semiconductor chip are arranged vertically and horizontally by receiving the supply, and a plurality of cavities including an island portion for mounting a semiconductor chip are taken. Are cavities 5, 6, and 7, and a relatively narrow gate 8 that forms a resin injection path is provided between the cavities 5, 6 and between the cavities 6, 7 in a runner portion.

Next, FIG. 4 and FIGS. 5A to 5C are schematic cross-sectional views showing a resin sealing step together with a semiconductor device manufacturing apparatus.
The operation of a conventional lead frame and an apparatus for manufacturing a semiconductor device using the lead frame will be described with reference to FIG. The lead frame 1 in which the semiconductor chips 101 are mounted on the cavities 5, 6, and 7 is sandwiched. At this time, the cavities 5, 6, and 7 of the lead frame are formed in the cavity mold 5 formed by the upper mold 181 and the lower mold 191.
1, 61, 71 are arranged.

[0005] Next, the tablet-like resin 14 is put in the pot 31, and the plunger 16 is pressed down to pressurize it.
The resin 14 is injected into each of the cavity molds 51, 61 and 71 at a high temperature. At this time, the resin 14 passes through the first runner 9 and enters the first cavity mold 51 through the second runner 10 and the second cavity mold 61.
Then, similarly, it is injected into the third cavity mold 71 through the third runner 11.

[0006]

In the conventional lead frame described above, the gate provided in the runner portion between the cavities is narrow, so that the smooth flow of the sealing resin, which is not so good in flowability, is prevented. There is a drawback that it is difficult to uniformly inject resin into these cavity molds.

An object of the present invention is to manufacture a lead frame capable of uniformly injecting a sealing resin into each cavity of a multiple lead frame for mounting a thin resin-sealed package, and manufacturing a semiconductor device using this lead frame. It is to provide a device.

[0008]

According to the present invention, there is provided a lead frame which receives a supply of the resin from a plurality of pots for pressing and supplying a sealing resin arranged at predetermined positions. forming a plurality of cavity portions arranged in series island for mounting a semiconductor chip on unrealized longitudinally
Are arranged in a plurality of rows in the horizontal direction, the resin injection path is provided between the pot and the cavity portion and between the plurality of cavity portions adjacent to each other in the resin passage portion. And a wide cutout portion which is largely cutout so as to form a space for temporarily storing the resin.

The apparatus for manufacturing a semiconductor device according to the present invention includes a plurality of pods for pressing and supplying a sealing resin into a mold, and each of the plurality of pods is provided with an independent resin passage. A plurality of runners are provided, a plurality of cavity types are provided in series at the end of the runner, and a cavity portion of a lead frame is disposed in the cavity type, and the plurality of cavity types are formed from each of the plurality of pods. A semiconductor device manufacturing apparatus configured to press-supply the resin, wherein the runner includes a shut-off mechanism to shut off injection of the resin when the predetermined amount of the resin is injected into the cavity mold. ing.

[0010]

FIG. 4 shows an embodiment of the present invention.
Referring to FIG. 1 also shown in a plan view with common reference characters / numerals attached to common components, a lead frame 1A of this embodiment shown in FIG. The cavities receiving the supply of the stopping resin are arranged vertically and horizontally to take a multiple form. For convenience of explanation, the first to third cavities are provided.
In addition to the cavities 5, 6, and 7 which are the cavities common to the conventional tiers, the conventional narrow gate 8 is provided between the cavities 5 and 6 and between the cavities 6 and 7 at the respective runner portions. Instead of this, a wide cutout portion 2 is formed which is notched so as to form a wide space for forming a resin injection path and temporarily storing the resin.

FIG. 2 is a plan view showing a mold constituting a semiconductor device manufacturing apparatus of the present embodiment for resin-sealing a semiconductor device using the lead frame 1A of the present embodiment.
Referring to (A), this mold is provided with a pot 31 in the center, and a first runner 41 and a cavity mold 5 for the first-stage cavity 5 symmetrically with respect to the pot 31.
1, a second runner 42, a cavity mold 61 for the second cavity 6, a third runner 43, and a cavity mold 71 for the third cavity 7 are sequentially arranged. Hereinafter, the right side of the pot 31 will be described for convenience of description.

FIG. 2 is a schematic cross-sectional view showing the resin sealing step of the lead frame 1A of the present embodiment together with the semiconductor device manufacturing apparatus using the semiconductor device manufacturing apparatus of the present embodiment.
As shown in (B) to (E), this mold includes first runners 41, 41 corresponding to cutouts 2 of lead frame 1A.
The upper die 81 and the lower die 91 of the second runners 42,...
Each of the second and third plungers 76 movable up and down,
77 has a notch 2 corresponding to the runner portion to secure a large flow path of the sealing resin to improve the fluidity of the resin, and to secure the product separation by the shut-off operation of the movable plunger. I do.

Next, the operation of the semiconductor device manufacturing apparatus according to the present embodiment using the lead frame according to the present embodiment will be described with reference to FIGS. 1 and 2A to 2E. The central pot 31 is filled with a tablet-shaped sealing resin 14, and the first plunger 16 is pushed up and pressurized as in the conventional case. The resin 14 that has begun to be press-fitted by the plunger 16 passes through the first-stage cavity mold 51, passes through the second runner 42 and the notch 2, and flows into the second cavity mold 61. At this time, the second plunger 76 of the upper die 81 is moving upward so as to secure a resin flow path, while the third plunger 77 of the lower die 91 is moving upward so as to be in contact with the lead frame 1A. ing. (Figure 2
(C)) Next, the resin 14 reaches the final stage in this example, the third cavity mold 71, and the plunger 76 descends immediately before the injection is completed, and at the same time, the plunger 77 also descends. (Figure 2
(D), (E)) First cavity mold 51 and plunger 7
6, 77A and FIG. 3B which show the details of the arrangement of the second cavity mold 61 in a plan view and FIG. 3B which shows a sectional view thereof, show a first cavity mold 51 and a second cavity mold 61. FIG.
Each of the pots has an upper die 81 portion larger and a lower die 91 portion smaller.

When the plunger 76 is lowered as shown in FIG. 3B, the cavity mold 5 is moved by the plunger 76.
The space between 1 and 61 is cut off and separated. Since the lower die 91 is provided with a partition for each cavity, when the plunger 77 descends, the cavities 51, 6 are separated by the partition.
One is separated.

In this embodiment, two cavities have been described. However, the same operation is performed when three or more cavities are used.

[0016]

As described above, the lead frame of the present invention, the semiconductor device using the lead frame, and the apparatus for manufacturing the semiconductor device are provided with a plurality of cavity portions between the pot and the cavity portion and adjacent to each other. Forming an injection path in the runners between each other and having a wide notch to form a space for temporarily accumulating this resin, the manufacturing apparatus includes a shutoff mechanism in the runner,
The flow path of the resin is increased when the resin flows through the runner, and the flow path is shut off when the flow is completed. Therefore, the flow resistance of the resin is small, the resin can be smoothly injected, and the individual semiconductor device products can be separated well.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a lead frame of the present invention.

FIG. 2 is a partial plan view showing one embodiment of a semiconductor device manufacturing apparatus using a lead frame of the present embodiment, and a schematic cross-sectional view showing a resin sealing step of the semiconductor device using the lead frame of the present embodiment. FIG.

3 is a plan view and a sectional view showing details of the arrangement of the two cavities and plungers of FIG. 2;

FIG. 4 is a plan view showing an example of a conventional lead frame.

FIG. 5 is a schematic cross-sectional view illustrating a resin sealing step of a semiconductor device using a conventional lead frame.

[Explanation of symbols]

 1, 1A Lead frame 2 Notch 5-7 Cavity 8, Gate 9-11, 41-43 Runner 14 Resin 16, 76, 77 Plunger 31 Pot 51, 61, 71 Cavity mold 81, 181 Upper mold 91, 191 Lower Type

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 23/50 B29C 45/02 B29C 45/14 B29C 45/26 H01L 21/56

Claims (4)

(57) [Claims] An individual semiconductor device is formed by receiving a supply of the resin from each of a plurality of pots for pressing and supplying a sealing resin arranged at a predetermined position to form an individual semiconductor device. In a multiple lead frame in which a plurality of cavities arranged in series in a vertical direction are arranged in a plurality of rows in a horizontal direction, a plurality of cavities between the pot and the cavities and between the plurality of cavities adjacent to each other are provided. An injection path for the resin is formed in a passage portion of the resin between
A lead frame comprising a wide cutout portion that is largely cut out so as to form a space for temporal storage. 2. A semiconductor device using the lead frame according to claim 1. A plurality of pods for pressing and supplying a sealing resin into the mold; and a plurality of runners each being an independent resin passage provided in each of the plurality of pods. A plurality of cavity molds are provided in series at the tip of the runner, and a cavity portion of a lead frame is arranged in the cavity mold so that the resin is pressed and supplied from each of the plurality of pods to the plurality of cavity molds. The semiconductor device manufacturing apparatus according to claim 1, wherein the runner includes a shut-off mechanism for shutting off injection of the resin when a predetermined amount of the resin is injected into the cavity mold. 4. The apparatus according to claim 3, wherein the lead frame is the lead frame according to claim 1.