JP2537739Y2 - 静電吸着装置 - Google Patents
静電吸着装置Info
- Publication number
- JP2537739Y2 JP2537739Y2 JP1989135585U JP13558589U JP2537739Y2 JP 2537739 Y2 JP2537739 Y2 JP 2537739Y2 JP 1989135585 U JP1989135585 U JP 1989135585U JP 13558589 U JP13558589 U JP 13558589U JP 2537739 Y2 JP2537739 Y2 JP 2537739Y2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- plate
- insulator
- wafer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012212 insulator Substances 0.000 claims description 39
- 239000011261 inert gas Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 230000005684 electric field Effects 0.000 description 5
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135585U JP2537739Y2 (ja) | 1989-11-22 | 1989-11-22 | 静電吸着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135585U JP2537739Y2 (ja) | 1989-11-22 | 1989-11-22 | 静電吸着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0373453U JPH0373453U (enrdf_load_stackoverflow) | 1991-07-24 |
| JP2537739Y2 true JP2537739Y2 (ja) | 1997-06-04 |
Family
ID=31682846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135585U Expired - Lifetime JP2537739Y2 (ja) | 1989-11-22 | 1989-11-22 | 静電吸着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2537739Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4504174B2 (ja) * | 2004-12-15 | 2010-07-14 | 大日本印刷株式会社 | マチ付き封筒 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115047U (enrdf_load_stackoverflow) * | 1979-02-06 | 1980-08-13 | ||
| JPS5922340A (ja) * | 1982-07-29 | 1984-02-04 | Toshiba Corp | 静電チヤツク装置 |
| JPH0622213B2 (ja) * | 1983-11-28 | 1994-03-23 | 株式会社日立製作所 | 試料の温度制御方法及び装置 |
| JPH0719831B2 (ja) * | 1986-10-13 | 1995-03-06 | 日本電信電話株式会社 | 静電チヤツク |
| JPH01200625A (ja) * | 1988-02-05 | 1989-08-11 | Toshiba Corp | 半導体ウェーハ処理装置 |
| JPH01135585U (enrdf_load_stackoverflow) * | 1988-03-09 | 1989-09-18 | ||
| JP2680338B2 (ja) * | 1988-03-31 | 1997-11-19 | 株式会社東芝 | 静電チャック装置 |
| JP2900709B2 (ja) * | 1992-07-03 | 1999-06-02 | 日本電気株式会社 | 動画像フィルタ |
-
1989
- 1989-11-22 JP JP1989135585U patent/JP2537739Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0373453U (enrdf_load_stackoverflow) | 1991-07-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |