JP2535628Y2 - Wafer suction device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a wafer suction device provided in a wafer transfer device or the like.

[Prior Art] A wafer suction device provided in a conventional wafer transfer device is as shown in FIGS. 3 (a) and 3 (b). That is, in FIG. 3 (b), the suction unit 28 is connected to the wire mounting holder 25 and the suction unit mounting holder 27 by the wire 26 having spring properties.
Have a rotational displacement and a torsional displacement effect. The suction unit 28 has a function of vacuum-sucking the wafer W.

[Problem to be solved by the invention] However, in the above-described conventional technology, in FIG.
When the suction portion of the wafer W is sucked by contacting the wafer W, deformation and the like occur in the holder of the wafer W, and when the wafer W is held in a tilted state, contact in a planar state cannot be performed. A gap is generated between the suction unit 28 and the wafer W, and a state where vacuum suction cannot be performed is obtained.

In addition, it is expected to have a rotational displacement and a torsional displacement effect for preventing a gap from being generated by the wire 26.However, it is necessary to make the rigidity low, in which case, the life becomes short, or , Resulting in no stable retention. Furthermore, even when vacuum suction is performed in a state where there is no gap due to the rotational displacement and torsional displacement effects, when the wafer W is taken out of the holder by the wafer transfer device, the original action is performed by the spring action of the wire 26. In order for the force to return to the state to work, the wafer W
There was a problem that would be repelled.

The present invention solves such a problem of the prior art, and an object of the present invention is to provide an apparatus in which a wafer can be reliably vacuum-sucked and conveyed regardless of the state of a holder.

[Means for Solving the Problems] In order to solve the above problems, a wafer suction device of the present invention includes a suction unit, a first pin holder that holds the suction unit, and a first pin holder that supports the first pin holder. A first shaft that supports the first pin holder via the first shaft
A holder, a second holder holding the first holder and attached to a transfer device, a second pin holder fixed to the second holder with a second shaft, and a second pin holder fixed to the second holder. A wafer suction device comprising a holding device, wherein the first pin holder is rotatably supported on the first holder by a first shaft, and the second pin holder is rotatable on the second holder. And a second shaft, and the holding device holds the second pin holder at an arbitrary rotation position.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 (a) is a side view of one embodiment of the present invention, and FIG. 1 (b) is a front view of FIG. 1 (a). In the drawing, reference numeral 1 denotes a suction unit which has two suction pipes and is attached to a first pin holder 3 having a pusher pin 4 supported on a first shaft 5. The rotating body 6 supported on the shaft 7 is pressurized by the spring 8 and is kept in balance by the stopper 9. The rotating body 6 has two independent members. The stoppers 9 and the springs 8 are alternately arranged. One of them is a mechanism capable of rotating clockwise, and the other is capable of rotating counterclockwise. By contacting the pusher pin 4 with the rotating body 6, the first pin holder 3 can rotate with a constant pressure in both the clockwise and counterclockwise directions of rotation of the first shaft 5. When no force acts in the rotation direction, the stationary state can be maintained at a predetermined position. Side plate 1
0, the side plate 11 holds the first shaft 5 and the shaft 7, and the first holder
Attached to 12.

Second pin holder 13 with pusher pin 14
Are fixed to the second shaft 15. The rotating body 16 supported on the shaft 17 is pressurized by a spring 18,
Keep balance by 19. The rotating body 16 has two independent members, each having a stopper 19 and a spring.
18 are alternately arranged so that one direction can rotate clockwise and one can rotate counterclockwise. This allows the second pin holder 13 to rotate with a constant pressure in both the clockwise and counterclockwise directions of rotation of the second shaft 15 by bringing the pusher pin 14 into contact with the rotating body 16. When no force acts in the rotation direction, the stationary state can be maintained at a predetermined position. The shaft 17 is fixed to the side plates 20 and 21, and the second shaft 15 is supported so as to be rotatable with respect to the side plates 20 and 21. The side plate 20 and the side plate 21 are attached to a second holder 22 and attached to a transport device. An electromagnetic brake 23 as a holding device is partially attached to the side plate 20 and partially
The shaft 15 is attached to the
The second shaft 15 can be held at an arbitrary rotation position with respect to 20.
Further, the second shaft 15 is fixed to the first holder 12.

As described above, when a force is applied to the suction unit 1, it has a degree of freedom in the rotation direction of the first shaft 5 and the rotation direction of the second shaft 15, and Can be held at any rotational position. When no force is applied to the suction unit 1, the stationary state can be maintained.

FIG. 2 (a) is a front view of the holder 24 for the wafer W, and FIG. 2 (b) is a side view of FIG. 2 (a). In the drawing, θ ₁ and θ ₂ indicate directions of inclination of the wafer W due to deformation of the holder 24 and the like.

The operation will be described below with reference to FIGS. 2 (a) and 2 (b).
When the wafer W is held inclined by the holder 24 as shown in FIG.
By horizontally moving the inserted wafer W direction adsorption unit 1 of FIG. (B), with respect to the inclination theta ₂ of FIG. 2 (b) the rotation direction of the first axis 5 in FIG. 1 (a) You can tilt the suction unit 1 only theta ₂ by rotating. For the inclination theta ₁ of FIG. 2 (a) second axis of FIG. 1 (a) 15
The suction unit 1 can be tilted only theta ₁ by rotating in the direction of rotation of the. Here for the theta ₁ of the inclination of the second view (a), to hold the suction portion 1 to the inclination theta ₁ by the electromagnetic brake 23 of FIG. 1 (a). Fig. 1 (a)
Is moved horizontally and returned to the insertion direction, so that the force of the spring 8 is not applied to the first pin holder 3 in FIG. 1 (a). Then, it is possible to reliably take out the wafer W from the holder 24 shown in FIG.

[Effects of the Invention] As described above, according to the present invention, when a wafer is held by a wafer transfer device, the wafer can be freely rotated in two independent directions even when the wafer is held with a tilt due to deformation of the wafer holder. There is an effect that the wafer can be surely sucked and transported by holding the supporting mechanism and an arbitrary rotation position.

[Brief description of the drawings]

FIG. 1A is a side view of a wafer suction device according to an embodiment of the present invention. FIG. 1 (b) is a front view of FIG. 1 (a). FIG. 2A is a front view of the wafer holder. FIG. 2 (b) is a side view of FIG. 2 (a). FIG. 3A is a side view of a conventional wafer suction device. FIG. 3 (b) is a front view of FIG. 3 (a). DESCRIPTION OF SYMBOLS 1 ... Suction part 2 ... Suction pipe 3 ... First pin holder 4,14 ... Pusher pin 5 ... First shaft 6,16 ... Rotating body 7,17 ... Shaft 8,18 ... Spring 9,19 Stopper 10,11,20,21 Side plate 12 First holder 13 Second pin holder 15 Second shaft 22 Second holder 23 Electromagnetic Brake 24… Cage 25… Wire holder 26… Wire 27… Suction unit holder 28… Suction unit W… Wafer θ ₁ , θ ₂ … Tilt

Claims (1)

(57) [Scope of request for utility model registration] A first pin holder for holding the suction portion; a first shaft for supporting the first pin holder; and a support for the first pin holder via the first shaft. A first holder, a second holder holding the first holder and attached to a transfer device, a second pin holder fixed to the second holder with a second shaft, and the second holder A wafer suction device comprising a holding device fixed to the first holder, wherein the first pin holder is rotatably supported on the first holder by a first shaft, and the second pin holder is supported by the second holder. A wafer holding device, wherein the holding device holds the second pin holder at an arbitrary rotation position.