JP4319310B2 - Sheet adsorption device and adsorption method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a sheet suction device andAdsorption methodMore specifically, a sheet adsorbing device that easily separates a sheet from a predetermined laminate or a lower sheet, andAdsorption methodAbout.
[0002]
[Prior art]
In recent years, semiconductor wafers, which are electronic components, have a tendency to be extremely thin, and are becoming 400 to 300 μm, or even 100 μm or less, in the past. In that case, in order to prevent breakage and breakage, a predetermined number of sheets are stacked and conveyed in a dedicated box. In that case, in order to protect the circuit forming surface of the semiconductor wafer, the sheet is generally laminated with a paper cushioning material sheet laid on the circuit forming surface. Therefore, when the wafers are taken out from the stacked body of semiconductor wafers and processed one by one, the cushioning sheet must be removed one by one. In this case, it is performed by adsorbing only the buffer material sheet by a vacuum device or the like.
[0003]
[Problems to be solved by the invention]
However, the thickness of the cushioning material sheet laid on the circuit forming surface of the semiconductor wafer is as thin as about 100 to 60 μm, and the cushioning material sheet is made of special paper or resin-impregnated paper having many fine holes. It is difficult to adsorb only the buffer material sheet and separate it from the semiconductor wafer. That is, if the suction force to the buffer material sheet is increased, the semiconductor wafer located below the buffer material sheet is also sucked by the thinness and fine holes of the buffer material sheet, and the buffer material sheet cannot be removed from the semiconductor wafer. . Therefore, if the suction force to the buffer material sheet is weakened, the buffer material sheet cannot be sucked. Therefore, it is difficult to adjust the adsorption force to the cushioning material sheet. In this case, it is not possible to mechanically perform the operation of taking out the stacked semiconductor wafers one by one and removing the cushioning material sheet laid on the semiconductor wafers. There is an inconvenience that work is troublesome.
[0004]
  The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to provide a sheet suction device capable of easily removing a sheet from a predetermined laminated body or a lower sheet.Adsorption methodIs to provide.
[0005]
[Means for Solving the Problems]
  In order to achieve the above object, the present invention can adsorb sheets laminated on a predetermined laminate.And can be separated from each other by rotatingA sheet suction device provided with a suction part,
  The posture of the suction partIncludes rotation axis to change eachA posture changing unit, and the posture changing unitTheAdsorb sheets stacked on the laminateBy moving in the rotational direction around the rotation axis from the suction position, the suction part floats away from the laminate together with the sheet, and the space between the suction partsSheetFlexDeformThe sheetThe structure which isolate | separates from the said laminated body is taken. According to such a structure, it is prevented that the laminated body located in the lower layer of the sheet is adsorbed together with the sheet, and the sheet can be easily removed from the laminated body. Also, the top of the stacked sheetsTheCan absorbAnd can be separated from each other by rotatingA sheet suction device provided with a suction part,
  The posture of the suction partIncludes rotation axis to change eachA posture changing unit, and the posture changing unitOf the laminated sheetTopTheAdsorptionBy moving the suction portion in the rotation direction about the rotation axis, the suction portion isTopAlong with the sheet, it floats away from the sheet located below it, and between the suction partsTopTheTheFlexDeformPosition the topmost sheet belowEven if the configuration of separating from the sheet is adopted, the uppermost sheet can be easily removed from the lower sheet as described above.Furthermore, a pseudo operation can be given to separating the sheet from the laminated body by hand, and the sheet can be reliably separated.
[0006]
  Further, the present invention is a sheet suction method provided with a suction portion that is provided so as to be capable of sucking sheets stacked on a predetermined laminate, and that can rotate and move away from each other.
A posture changing unit including a rotation axis for changing the posture of each of the suction units, and the posture changing unit is configured so that the suction unit is centered on the rotation axis from a suction position where the sheets stacked on the stacked body are sucked. The adsorbing part floats away from the laminated body together with the sheet by moving in the rotating direction, and the sheet between the adsorbing parts is bent and deformed to separate the sheet from the laminated body. ing.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment in which a sheet suction device of the present invention is applied to an electronic component processing device will be described with reference to the drawings.
[0009]
FIG. 1 is a schematic perspective view of an electronic component processing apparatus 10 according to the present embodiment. In this figure, an electronic component processing apparatus 10 includes a semiconductor wafer (hereinafter simply referred to as “wafer”) as an electronic component (laminated body 21) in which a buffer material sheet (hereinafter simply referred to as “sheet” S) is laid and laminated. "W") is held in a stacked state, a transfer device 12 that takes out one wafer W from the first hold portion 11 and reversely transfers it to the next process, and the transfer device 12 makes the wafer W The sheet suction device 14 for removing the sheet S laid on the wafer W, the alignment device 15 for positioning the wafer W from which the sheet S has been removed, and the identification of the wafer W positioned by the alignment device 15 Means 16, a robot transfer device 18 (transfer device) for transferring the identified wafer W, and a wafer W from the robot transfer device 18 And a second holding part 19 in which are sequentially stored. Here, each device is fixed to the frame 5. Note that the wafer W of the stacked body 21 held by the first holding unit 11 is stacked such that the circuit forming surface W1 that is a protected surface is on the lower side, as shown in an exploded state in FIG. The sheet S is laid on the circuit forming surface W1 side, so that the circuit forming surface W1 side is protected from scratches, breakage, and the like due to contact between the wafers W.
[0010]
As shown in an enlarged view in FIG. 3, the first holding unit 11 includes a wafer box 22 that holds a laminated body 21 in which substantially disk-shaped wafers W and sheets S are alternately laminated, and the wafer box 22. A wafer box elevating device 23 that elevates and lowers at a predetermined timing is provided. In this wafer box lifting / lowering device 23, a feed screw shaft 25 is engaged with a nut (not shown) formed on an arm 24 to which the wafer box 22 is fixed, and when the lifting motor 26 is driven, the feed screw shaft 25 rotates and the wafer box 22 moves up and down.
[0011]
As shown in an enlarged view in FIG. 4, the transfer device 12 includes a first suction transfer unit 28 that reverses and transfers the wafer W taken out from the first holding unit 11 (see FIG. 3) by approximately 180 degrees, The second suction transfer unit 29 receives the wafer W from the first suction transfer unit 28 and transfers the wafer W to the alignment device 15.
[0012]
The first suction transfer unit 28 is provided so as to be movable up and down by the cylinder 30, a first suction pad 31 capable of sucking the wafer W, and a shaft member 32 to which the first suction pad 31 is fixed. A reversing cylinder 33 that rotates the shaft member 32, a support bracket 35 to which the reversing cylinder 33 is fixed, and the support bracket 35 is attached, and the first transfer that extends toward the second suction transfer unit 29. And a cylinder 36. Here, the support bracket 35 is provided to be slidable in the extending direction by the operation of the first transfer cylinder 36.
Of course, a spring may be provided in place of the cylinder 30 and the same effect may be obtained by utilizing its elasticity.
[0013]
By the first holding unit 11 and the first suction transfer unit 28 configured as described above, the wafer W is transferred to the second suction transfer unit 29 side as follows.
[0014]
That is, the wafer box lifting / lowering device 23 shown in FIG. 3 raises the wafer box 22 holding the stacked body 21 in which the wafers W and the sheets S are alternately stacked, and the uppermost layer stacked and held in the wafer box 22. When the wafer W reaches a predetermined position, the lifting / lowering motor 26 of the wafer box lifting / lowering device 23 stops. Then, the first suction pad 31 shown in FIG. 4 is lowered by the cylinder 30 and sucks the upper surface of the uppermost wafer W, that is, the opposite side (back surface) of the circuit formation surface W1 (four places in FIG. 4). After completion, when the cylinder 30 is raised, the uppermost wafer W1 is taken out from the wafer box 22. That is, the sheet S laid under the attracted wafer W is separated from the wafer W and left in the wafer box 22. Then, the wafer W sucked and held by the first suction pad 31 operates the reversing cylinder 33 to rotate the shaft member 32 and the first suction pad 31, and the wafer W is reversed by approximately 180 degrees to form a circuit. The surface W1 is on the upper side. Here, when the wafer W is reversed, the wafer box 22 stands by at a height position that does not interfere with the wafer W. Thereafter, the first transfer cylinder 36 is operated, and the wafer W held by the first suction pad 31 is transferred toward the second suction transfer unit 29.
[0015]
As shown in the enlarged view of FIG. 4, the second suction transfer unit 29 is configured to raise and lower the second suction pad 38 that can suck the wafer W transferred by the first suction transfer unit 28. The lifting / lowering cylinder 39 is attached, and the lifting / lowering cylinder 39 is attached, and the second transfer cylinder 40 extends toward the alignment device 15. The second transfer cylinder 40 can slide the second suction pad 38 and the elevating cylinder 39 in the extending direction.
[0016]
The second suction transfer unit 29 configured as described above transfers the wafer W from the first suction transfer unit 28 to the alignment device 15 side as follows.
[0017]
That is, as described above, the wafer W from the first suction transfer unit 28 is inverted by about 180 degrees by the first suction transfer unit 28 and becomes the circuit forming surface W1 on the upper side. 2 The height position of the suction pad 38 is waited at a position lower than the height position of the wafer W transferred from the first suction transfer section 28 by the elevating cylinder 39. When the wafer W reaches the second suction pad 38 side by the first suction transfer unit 28, the operation of the first transfer cylinder 36 is stopped, and the slide cylinder 37 disposed in the second transfer cylinder 40 is used. The second suction pad 38 is inserted between the first suction pads 31 and 31 for sucking and holding the wafer W, and the second suction pad 38 sucks the lower surface (back surface) of the wafer W as the elevating cylinder 39 rises. At this time, the second suction pad 38 sucks the wafer W and moves up by the lift cylinder 39, and at the same time, the first suction pad 31 stops sucking the wafer W, and the operation of the first transfer cylinder 36 causes the sheet suction device 14 to stop. Is confirmed to be stopped on the side of a sheet storage box 70 (see FIG. 3), which will be described later, and then returns to the original position of the first holding unit 11 and waits, and the above-described operation is repeated. Then, the wafer W sucked by the second suction pad 38 is transferred to the alignment device 15 by the operation of the second transfer cylinder 40, and the second suction pad 38 is lowered by the operation of the elevating cylinder 39. It is placed on the receiving portions 79A and 79B. Here, after the suction is released, the slide cylinder 37 returns to the second suction pad 38 after being transferred to the alignment device 15, and returns to the standby position on the first suction transfer unit 28 side by the operation of the second transfer cylinder 40.
[0018]
As shown in FIGS. 3, 5, and 6, the sheet suction device 14 includes a pair of suction portions 42 </ b> A and 42 </ b> B that can suck the sheet S, and a posture changing unit 44 that changes these postures. Yes.
[0019]
The posture changing unit 44 includes a fixed plate 50 having notches 48 and 49 formed on both left and right sides in FIG. 6, rotary shafts 55 and 56 that are rotatably attached to both ends of the fixed plate 50, and one end. The arm 58 and the link arm 59A fixed to the rotary shaft 55 of the head portion, the link arm 59B fixed to the rotary shaft 56 of the opposite end, the cylinder 63 that rotates the arm 58, and the link arms 59A and 59B And a connecting rod 64 (see FIG. 5) that is pivotally connected to connect them.
[0020]
A suction portion support block 68 (FIG. 6) having a suction cylinder 60A and the like is fixed to the rotation shaft 55 to which the arm 58 and the link arm 59A are respectively attached, while the suction cylinder 60B is attached to the other rotation shaft 56. The suction part support block 69 having the above is fixed. Further, the suction portions 42A and 42B are attached to the suction portion support blocks 68 and 69 at the rod ends of the suction cylinders 60A and 60B, respectively. Accordingly, when the arm 58 is rotated by the operation of the cylinder 63 (in the direction of the arrow in FIG. 5), the rotation shaft 55 is rotated according to the rotation angle, thereby the suction portion support block 68, the suction portion 42A and the link arm 59A. Is rotated counterclockwise, and is linked to the other link arm 59B by the connecting rod 64, so that the rotating shaft 56 and the suction portion support block 69 rotate in the clockwise direction, and the pair of suction portions 42A and 42B are Each will rotate in the opposite direction. For this reason, these adsorption | suction parts 42A and 42B can mutually space apart.
Here, the adsorbing portions 42A and 42B are moved up and down by the adsorbing cylinders 60A and 60B, but a spring is provided in place of the adsorbing cylinders 60A and 60B, and the same effect is obtained by using the elasticity. Of course.
[0021]
Further, as shown in FIG. 3, a transfer cylinder 71 for transferring the sheet S sucked by the suction portions 42 </ b> A and 42 </ b> B to the sheet storage box 70 is attached to the sheet suction device 14. By the operation of the transfer cylinder 71, the connecting piece 72 fixed to the substantially central portion of the upper surface of the fixing plate 50 of the sheet suction device 14 is moved between the upper position of the first holding part 11 and the upper position of the sheet storage box 70. The sheet S provided so as to be movable and sucked and held by the suction portions 42A and 42B can be transferred from the wafer box 22 to the sheet storage box 70.
[0022]
The sheet storage box 70 is provided in a shape that can store the sheet S, and can be moved up and down by a box lifting and lowering device 73. The box lifting device 73 has a feed screw shaft 75 engaged with a nut (not shown) formed on an arm 74 to which the sheet storage box 70 is fixed. When the lifting motor 76 is driven, the feed screw shaft is driven. 75 is rotated so that the sheet storage box 70 is moved up and down.
[0023]
The sheet suction device 14 configured as described above takes out the sheet S from the wafer box 22 by the transfer cylinder 71 and stores it in the sheet storage box 70 as follows.
[0024]
That is, after the wafer W is taken out from the wafer box 22 by the first suction transfer section 28, the suction sections 42A and 42B attached to the rod tip portions of the cylinders 60A and 60B are used as shown in FIG. The sheet S left in the box 22 is lowered to a position where it is adsorbed. Then, the cylinder 63 is operated to extend the rod 63A, and the arm 58 is rotated counterclockwise in FIG. Then, one rotating shaft 55 rotates, and the other rotating shaft 56 rotates in the opposite direction via the link 64 connecting the link arms 59A and 59B, thereby being fixed to the rotating shafts 55 and 56. The adsorbing portions 42A and 42B that are rotating rotate closer to each other. At this time, the adsorbing portions 42A and 42B move along the substantially plane direction while adsorbing the sheet S, and as a result, as shown in FIGS. 5 and 7A, the sheet S is partially bent and deformed. Then, the sheet S is separated from the wafer W positioned therebelow. Then, the suction portions 42A and 42B are lifted by the operation of the cylinders 60A and 60B, and the sheet S is taken out from the wafer box 22 while being sucked. The operation of the transfer cylinder 71 (see FIG. 3) causes the sheet S to be moved to the suction portions 42A and 42B. When the sheet S is placed above the sheet storage box 70 (see FIG. 3) as shown in FIG. 7B, the cylinder 60A is sucked and held. , 60B lowers the suction portions 42A, 42B, stops the suction of the sheets S, stores the sheets S in the sheet storage box 70, and after completion, the piston 63A of the cylinder 63 returns. Thereafter, the suction portions 42A and 42B are raised by the operation of the cylinders 60A and 60B, and the suction portions 42A and 42B stand by at the positions. Thereafter, as described above, after confirming that the first suction pad 31 for sucking the wafer W has moved to the position of the second suction pad 38, the sheet suction device 14 constituted by the suction portions 42A, 42B and the like is transferred. The operation of the cylinder 71 returns to the first holding unit 11 to repeat the above-described operation.
[0025]
As shown in FIG. 4, the alignment apparatus 15 includes a pair of wafer receiving portions 79A and 79B for setting the wafer W transferred from the second suction transfer portion 29, and a lower portion of the wafer receiving portions 79A and 79B. And a turntable 82 that can rotate the wafer W set in the wafer receiving portions 79A and 79B, and a motor 83 that rotates the turntable 82.
[0026]
The wafer receiving portions 79A and 79B are disposed at a position lower than the height position of the second suction transfer portion 29 and are provided along the surface direction of the wafer W to be placed. The wafer receiving portions 79A and 79B are provided so as to be separated from each other by a driving device (not shown) so that the wafer W can be sandwiched and held while being centered. Specifically, the wafer receivers 79A and 79B are configured such that the wafer W sucked and held by the second suction pad 38 installed in the second transfer cylinder 40 of the second suction transfer unit 29 is moved by the lift cylinder 39 to the wafer receiver 79A. , 79B, the width of the wafer W is such that the wafer W does not drop downward, and thereafter, the wafer W is sandwiched. On the other hand, when the wafer W is unloaded by the robot transfer device 18 (see FIG. 1), the wafer receiving portions 79A and 79B are separated so that the wafer W can be unloaded smoothly.
[0027]
The turntable 82 is set to have a diameter smaller than the diameter of the wafer W, and the upper surface thereof can adsorb the wafer W. The motor 83 is provided so as to be lifted and lowered by a lifting device (not shown).
[0028]
As shown in FIG. 1, the identification unit 16 includes a camera 84 that reads character information C as an information recording unit provided on the wafer W held by the alignment device 15, and the first and second holding units 11. , 19 are provided with barcode readers 85, 86 (FIG. 1) for reading barcode labels L1, L2 (label information), and barcode labels L1 attached to the first and second holding portions 11, 19, respectively. , L2 and the character information C of the wafer W positioned by the alignment device 15 are compared, and the information is communicated with a host computer.
[0029]
Although the detailed structure of the robot transfer device 18 is omitted here, the robot 88 is taught so that the arm 88 can perform a certain operation. Further, a suction hole (not shown) is provided at the tip of the arm 88 so that the wafer W can be sucked.
[0030]
As shown in FIG. 8, the second holding unit 19 includes a carrier box 89 that stores only the wafer W after the character information of the wafer W is identified by the identification unit 16, and the carrier box 89. A carrier box lifting / lowering device 90 that moves up and down at a predetermined timing is provided. The carrier box 89 is dimensioned so that the wafers W do not contact each other in the vertical direction, and grooves are formed at both ends of the carrier box 89 so that the wafers W can be accommodated. Further, in the carrier box elevating device 90, a feed screw shaft 93 is engaged with a nut (not shown) formed on an arm 92 (FIG. 8) to which the carrier box 89 is fixed, and the elevating motor 94 is driven. Then, the feed screw shaft 93 rotates and the carrier box 89 moves up and down.
[0031]
The wafer W transferred from the first suction transfer unit 28 by the alignment device 15, the identification unit 16, and the second holding unit 19 configured as described above is stored in the carrier box 89 as follows. .
[0032]
First, as shown in FIG. 4, the wafer W transferred by the second suction transfer unit 29 is centered by the wafer receiving units 79 </ b> A and 79 </ b> B, and then the turntable 82 is raised, and the circuit of the wafer W is moved. With the formation surface W1 as the upper surface, the lower surface side of the opposite surface is adsorbed. Then, the motor 83 rotates to rotate the wafer W adsorbed on the turntable 82, and alignment is performed so that the character information C stamped on the wafer W comes to a predetermined position. In this alignment, the position of the V notch N formed on the wafer W is confirmed by the camera 84 of the identification means 16. Then, the information on the bar code labels L1 and L2 attached to the wafer box 22 and the carrier box 89 of the first and second holding parts 11 and 19 and the wafer W positioned by the alignment device 15 were imprinted by a laser or the like. The character information C is compared, and if it matches, the character information C is attracted to the arm 88 of the robot transfer device 18 shown in FIG. 8 to be transferred and stored in the carrier box 89, and the compared information is transferred to the upper computer. It is possible to manage the day's production management with a host computer.
[0033]
Therefore, according to such an embodiment, the uppermost wafer W or sheet is formed from the laminated body 21 in which the wafer W and the sheet S are alternately laminated on the circuit forming surface W1 side of the wafer W. By taking out S alternately, it is possible to easily separate and convey the wafer W to the carrier box 89 and the sheet S to the sheet storage box 70.
[0034]
Further, since the sheet suction device 14 separates the sheet S from the wafer W while being partially bent and deformed, the sheet S can be removed from the wafer W regardless of the material and thickness of the sheet S and the wafer W.
[0035]
In the above embodiment, the sheet suction device 14 is attached to the electronic component processing apparatus 10 that removes the sheet S from the wafer box 22 on which the wafers W laid with the sheet S are stacked and transports only the wafer W to the carrier box 89. Although applied, in this embodiment, the present invention can also be applied to an apparatus for transporting the wafer W from the second holding unit 19 to the first holding unit 11 which is the reverse operation of the above-described operation. In that case, contrary to the above, in the sheet adsorbing device 14, the pair of adsorbing portions 42 </ b> A and 42 </ b> B adsorbs the uppermost sheet S stacked in the sheet storage box 70 and flexes and deforms the uppermost sheet S. Then, the lower sheet S is separated from the lower sheet S and transferred to the upper surface of the wafer W stacked on the wafer box 22 to form the stacked body 21.
[0036]
Moreover, in the said Example, although a pair of adsorption | suction part 42A, 42B was provided, this invention is not limited to this, You may provide many adsorption | suction parts. In short, as the sheet adsorbing device 14, the adsorbing portion is provided so as to be movable in the substantially plane direction of the sheet including the buffer material sheet S, and the sheet W is partially bent and deformed, while the wafer W, the lower buffer material sheet S, etc. Any structure can be used as long as it can be separated from the laminate 21. Here, as the laminated body 21, in addition to the wafer W and the buffer material sheet S, other electronic components and base materials on which the sheets are laminated may be used. In short, as long as the sheets are laminated. anything is fine.
[0037]
Furthermore, the structure of the electronic component processing apparatus 10 that performs the above-described processes is not limited to the illustrated configuration example, and can be appropriately changed in design as long as it can perform substantially the same operation. it can.
[0038]
  As explained above, the bookExampleAccording to the present invention, the sheet suction device is provided with a posture changing unit that changes the posture of the suction unit, and the posture changing unit is in a state in which the suction unit sucks the upper sheet stacked on the laminated body or the lower sheet. Since the suction portion is provided so as to be movable substantially in the direction of the surface of the uppermost sheet, and the uppermost sheet is partially bent and deformed, it is separated from the laminate or the lower sheet. It is possible to prevent the laminated body or sheet positioned from being adsorbed together with the uppermost sheet, and the sheet can be easily removed.
[0039]
Further, since at least a pair of the suction portions are provided, the pair of suction portions are provided so as to be separated from each other, and the suction portions move in a direction in which the suction portions approach each other, thereby causing the bending deformation. Can be more effectively performed.
[0040]
Furthermore, the sheet suction device holds the electronic component whose surface to be protected is covered with a sheet in a stacked state, and takes out one electronic component from the first holding unit and transfers it to the next process. An electronic component processing apparatus comprising: a transfer device; a second holding unit that sequentially stores electronic components from which sheets have been removed; and a sheet storage box that stores a sheet taken out from the first holding unit by the sheet suction device. Since it is applied, even when the electronic component holding mode is changed from the state in which the sheet is laid to the state in which the sheet is removed, the process can be performed continuously and mechanically, and the processing efficiency of the electronic component is improved. Can be greatly improved.
[0041]
In addition, since the identification means capable of comparing the information of the bar code label attached to the first and second holding units and the information recording unit of the electronic component positioned by the alignment device is provided, the stacked electronic components Even if different types are mixed, the check can be automatically performed in the transporting process to the second holding unit.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of an electronic component processing apparatus showing an overall configuration according to an embodiment.
FIG. 2 is a schematic exploded perspective view schematically showing a stacked state of wafers W held in a wafer box.
3 is an enlarged perspective view of a part of FIG.
4 is an enlarged perspective view of another part of FIG. 1. FIG.
FIG. 5 is an enlarged side view of the sheet suction device.
6 is a plan view of FIG. 5. FIG.
7A is a schematic diagram for explaining an operation of taking out the buffer material sheet adsorbed by the adsorption unit from the wafer, and FIG. 7B shows the buffer material sheet adsorbed by the adsorption unit; The schematic diagram for demonstrating the operation | movement accommodated in a sheet | seat storage box.
8 is an enlarged perspective view of still another part of FIG.
[Explanation of symbols]
10 Electronic component processing equipment
11 First holding part
12 Transfer device
13 Control unit
14 Sheet adsorption device
15 Alignment device
16 Identification means
18 Robotic transfer device (transfer device)
19 Second holding part
21 Laminate
29 Second adsorption transfer device
40 Second transfer cylinder
42A adsorption part
42B adsorption part
44 Posture change unit
70 sheet storage box
71 Transfer cylinder
79A, 79B Wafer receiving part (centering device)
82 Turntable
C Character information (information recording part)
L1, L2 Barcode label (label information)
S Buffer material sheet (sheet)
W Semiconductor wafer (electronic parts)
W1 Circuit forming surface (protected surface)
N V notch

Claims (3)

A sheet adsorbing device provided with an adsorbing portion that is provided so as to be capable of adsorbing sheets stacked on a predetermined laminate and that can rotate apart from each other ,
Includes a posture changing section including the rotation axis to change each position of the suction portion, the posture changing section includes a center of the rotation shaft of the suction portion, the suction position with adsorbed laminated sheets to the laminate by moving in the rotational direction of a feature in that the suction unit is separated emerging from the laminate together with the sheet, said by looking deformed wrinkles sheet between the suction unit separates the sheet from the stack Sheet suction device. A sheet adsorption device having a spaced accessible adsorption unit rotates together with providing a sheet over bets the uppermost of the stacked sheets to be adsorbed,
The includes a posture changing section including the rotation axis to change each position of the suction portion, the posture changing unit, the rotary shaft of the suction portion, the suction position with adsorbed sheet over bets the uppermost of the stacked sheets by moving the rotating direction around the said spaced while adsorbing portion floats from the sheet located on the lower together with the sheet of the uppermost, is seen deformed flexures shea over bets uppermost between the suction unit And separating the uppermost sheet from the lower sheet. A sheet adsorbing method including an adsorbing portion that is provided so as to adsorb sheets stacked in a predetermined laminated body and that can rotate apart from each other,
  A posture change unit including a rotation axis for changing the posture of each of the suction units, and the posture change unit is configured to center the rotation axis from the suction position where the suction unit sucks the sheets stacked on the stacked body. By moving in the rotating direction, the suction part floats away from the laminate together with the sheet, and the sheet between the suction parts is bent and deformed to separate the sheet from the laminate. Sheet adsorption method.

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