JP2531461Y2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JP2531461Y2 JP2531461Y2 JP1988062544U JP6254488U JP2531461Y2 JP 2531461 Y2 JP2531461 Y2 JP 2531461Y2 JP 1988062544 U JP1988062544 U JP 1988062544U JP 6254488 U JP6254488 U JP 6254488U JP 2531461 Y2 JP2531461 Y2 JP 2531461Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- thermal head
- conductive member
- insulating substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【考案の詳細な説明】 （イ）産業上の利用分野 この考案は、放熱板を備えたサーマルヘッドに関す
る。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a thermal head having a heat sink.
（ロ）従来の技術 第２図は、従来のサーマルヘッドを示す側面図であ
る。(B) Conventional technology FIG. 2 is a side view showing a conventional thermal head.
従来のサーマルヘッドは、アルミ放熱板71の上面に、
配線パターン72を備えたセラミック基板73と補強板74と
を載置し、上記セラミック基板73の配線パターン72上に
発熱ドット（発熱素子）75及びドライブ用IC76を実装し
ている。そして、前記補強板74の上面に、一端部が上記
配線パターン72の端部に重合する外部回路接続用のフレ
キシブル基板77を配備し、このフレキシブル基板77を上
記補強板74の下面に備えるコネクタ79に接続している。
更に、前記セラミック基板73、配線パターン72及びフレ
キシブル基板77の重合部に対し圧接手段78を配備して構
成している。この圧接手段78は、上記補強板74に対し脱
着可能に螺着された平板状カバー体78aの内面に、内方
向へ窪む断面半円形状穴部78bを形成し、この穴部78bに
圧接用棒状シリコンゴム78cを適嵌着させて構成してい
る。このカバー体78aは、補強板（放熱板71を含む）74
に対し、ネジ78d止めされた状態において、圧接用棒状
シリコンゴム78cの下半周部（突出部）が、セラミック
基板73、配線パターン72及びフレキシブル基板77の重合
部に対応位置するように設定されている。上記重合部の
圧接は、ネジ部78dの締めつけにより圧接用棒状シリコ
ンゴム78cの下半周部（突出部）が、重合部を押圧、圧
接することで、セラミック基板73の配線パターン72とフ
レキシブル基板77が電気的に接続される。The conventional thermal head, on the upper surface of the aluminum heat sink 71,
A ceramic substrate 73 having a wiring pattern 72 and a reinforcing plate 74 are placed, and a heating dot (heating element) 75 and a drive IC 76 are mounted on the wiring pattern 72 of the ceramic substrate 73. Then, on the upper surface of the reinforcing plate 74, a flexible board 77 for connecting an external circuit, one end of which is overlapped with the end of the wiring pattern 72, is provided, and a connector 79 including the flexible board 77 on the lower surface of the reinforcing plate 74 is provided. Connected to
Further, a pressure contact means 78 is provided for the overlapping portion of the ceramic substrate 73, the wiring pattern 72 and the flexible substrate 77. The press-contact means 78 forms a semicircular cross-section hole 78b which is depressed inward on the inner surface of a flat cover 78a detachably screwed to the reinforcing plate 74, and press-contacts the hole 78b. The rod-shaped silicon rubber 78c is appropriately fitted. The cover body 78a includes a reinforcing plate (including a heat sink 71) 74
On the other hand, in the state where the screw 78d is fixed, the lower half peripheral portion (projection) of the pressure-contacting rod-shaped silicon rubber 78c is set so as to correspond to the overlapping portion of the ceramic substrate 73, the wiring pattern 72, and the flexible substrate 77. I have. The press-contact of the overlapping portion is performed by pressing and pressing the lower half peripheral portion (projecting portion) of the pressure-contacting rod-shaped silicone rubber 78c by tightening the screw portion 78d, thereby pressing the wiring pattern 72 of the ceramic substrate 73 and the flexible substrate 77. Are electrically connected.
（ハ）考案が解決しようとする課題 上記、従来のサーマルヘッドは、放熱板の幅長さを長
く設定している。つまり、放熱板は印字走査方向に直角
方向の長さ（記録紙長手方向）を長く設定し、この放熱
板の上面に配線パターンを備えるセラミック基板とフレ
キシブル基板を備える補強板とを記録紙長手方向へ載置
している。(C) Problems to be solved by the invention In the above-described conventional thermal head, the width of the heat radiating plate is set to be long. In other words, the length of the heat radiating plate in the direction perpendicular to the print scanning direction (longitudinal direction of the recording paper) is set to be long, and the ceramic substrate having the wiring pattern and the reinforcing plate having the flexible substrate on the upper surface of the heat radiating plate are arranged in the longitudinal direction of the recording paper Is placed on
このため、この構造のサーマルヘッドでは、第２図で
示すように転写リボンＡを搬送する一対の搬送用ローラ
Ｃ間の距離が長くなり（通常、約35ミリ）、本来は不要
な記録紙副走査方向（走査方向に直角な方向・記録紙Ｂ
長手方向）に大きなスペースを要し、小型化を達成し得
ない等の不利があった。For this reason, in the thermal head having this structure, as shown in FIG. 2, the distance between the pair of transport rollers C for transporting the transfer ribbon A becomes longer (normally, about 35 mm), and the recording paper auxiliary which is originally unnecessary is not required. Scan direction (direction perpendicular to the scan direction, recording paper B
There is a disadvantage that a large space is required in the longitudinal direction) and miniaturization cannot be achieved.
この考案は、上記課題を解消させ、走査方向に直角な
副走査方向のスペースを小さくし、小型化を達成するサ
ーマルヘッドを提供することを目的とする。An object of the present invention is to provide a thermal head which solves the above-mentioned problem, reduces the space in the sub-scanning direction perpendicular to the scanning direction, and achieves miniaturization.
（ニ）課題を解決するための手段及び作用 この考案のサーマルヘッドは次のような構成としてい
る。(D) Means and action for solving the problem The thermal head of the present invention has the following configuration.
サーマルヘッドは、上面に発熱ドット（22）、この発
熱ドットの駆動用IC（23）及び配線パターン（21）を設
けた絶縁基板（２）の下面に、前記絶縁基板の横幅と略
同幅の放熱板（１）を取付ける一方、フィルム状の絶縁
材の少なくとも片面に配線パターンを設けた導電部材
（３）を、前記絶縁基板に対し、互いに端部を接合して
直角方向に配置し、この導電部材の配線パターンの一端
を折り曲げて前記絶縁基板の回路端部に重合させて電気
的に接続するとともに、この導電部材の配線パターンの
他端をコネクタ（５）に電気的に接続して構成してい
る。The thermal head has a heating dot (22) on the upper surface, an IC (23) for driving the heating dot, and a wiring pattern (21) on the lower surface of the insulating substrate (2) having a width substantially equal to the width of the insulating substrate. While attaching the heat radiating plate (1), a conductive member (3) provided with a wiring pattern on at least one surface of a film-like insulating material is disposed at right angles to the insulating substrate by joining their ends to each other. One end of the wiring pattern of the conductive member is bent and overlapped with the circuit end of the insulating substrate to be electrically connected, and the other end of the wiring pattern of the conductive member is electrically connected to the connector (5). doing.
このような構成を有するサーマルヘッドでは、放熱板
の幅長さと絶縁基板の幅長さ、つまり副走査方向の長さ
がほぼ同一長さに設定してある。そして、導電部材は放
熱板の上面に載置するのではなく、放熱板、絶縁基板に
対し直接方向へ配置し、この導電部材の内面側（放熱板
の下方向）にコネクタ、外面に配線パターンを配備す
る。更に、絶縁基板に対し垂直方向に位置する導電部材
の配線パターンの一端と絶縁基板の配線パターン端等の
回路部とは、ハンダ接着（熱圧着）等により電気的に接
続する。In the thermal head having such a configuration, the width of the radiator plate and the width of the insulating substrate, that is, the length in the sub-scanning direction, are set to be substantially the same. The conductive member is not placed on the upper surface of the radiator plate, but is disposed directly in the direction of the radiator plate and the insulating substrate. A connector is provided on the inner side (downward of the radiator plate) of the conductive member, and a wiring pattern is provided on the outer surface. Deploy. Further, one end of the wiring pattern of the conductive member positioned in the vertical direction with respect to the insulating substrate is electrically connected to a circuit portion such as an end of the wiring pattern of the insulating substrate by solder bonding (thermocompression bonding) or the like.
従って、このサーマルヘッドでは、副走査方向の長さ
が略絶縁基板の横幅のみでよく、従来の長さに比して約
半分の短さとすることが出来るため、副走査方向の余分
なスペースをとらず、小型化を達成し得る。Accordingly, in this thermal head, the length in the sub-scanning direction may be substantially only the width of the insulating substrate, and can be made about half as short as the conventional length, so that extra space in the sub-scanning direction is reduced. It is possible to achieve downsizing without taking.
（ホ）実施例 第１図は、この考案に係るサーマルヘッドの具体的な
一実施例を示す側面図である。(E) Embodiment FIG. 1 is a side view showing a specific embodiment of the thermal head according to the present invention.
このサーマルヘッドは、アルミ放熱板１と、この放熱
板１の上面に載置される配線パターン21、発熱ドット
（発熱素子）22及び駆動用ICチップ23を備えるセラミッ
ク（絶縁）基板２と、上記配線パターン21に接続するフ
レキシブル基板（フィルム状の絶縁材の少なくとも片面
に配線パターンを設けた導電部材）３を備える補強板４
と、このフレキシブル基板３の端部を接続するコネクタ
５と、上記配線パターン、フレキシブル基板３の接続重
合部を保護するアルミ等の保護カバー６とから成る。The thermal head includes an aluminum heat radiating plate 1, a ceramic (insulating) substrate 2 having a wiring pattern 21, heat generating dots (heating elements) 22, and a driving IC chip 23 mounted on the upper surface of the heat radiating plate 1. A reinforcing plate 4 having a flexible substrate (conductive member having a wiring pattern provided on at least one surface of a film-like insulating material) 3 connected to the wiring pattern 21
And a connector 5 for connecting the ends of the flexible board 3 and a protective cover 6 made of aluminum or the like for protecting the wiring pattern and the connection overlapping portion of the flexible board 3.
この実施例の特徴は、放熱板１をセラミック基板２と
ほぼ同じ横幅にしたこと、上面にセラミック基板２を載
置する放熱板１に対し、フレキシブル基板３を備える補
強板４を直角方向に配置したことであり、サーマルヘッ
ドの副走査方向（印字走査方向に直交する記録紙Ｂの長
手方向）のスペースを小さく設定した点にある。The feature of this embodiment is that the heat radiating plate 1 has substantially the same width as the ceramic substrate 2 and the reinforcing plate 4 provided with the flexible substrate 3 is arranged at right angles to the heat radiating plate 1 on which the ceramic substrate 2 is placed. That is, the space in the sub-scanning direction of the thermal head (the longitudinal direction of the recording paper B orthogonal to the printing scanning direction) is set small.
放熱板１とセラミック基板２は、幅長さ、つまり副走
査方向の長さをほぼ同一に設定し、放熱板１の上面にセ
ラミック基板２を載置している。一方、補強板（金属
板）４は、放熱板１に対し直角方向、つまり放熱板１の
一端面に平行状に配置固定し、内面側（放熱板１の下方
側）にコネクタ５を固定すると共に、外面側にフレキシ
ブル基板３を配備している。フレキシブル基板３の先端
部は屈曲（内方向へ折り曲げ）し、セラミック基板２の
配線パターン21の端部に重合している。配線パターン21
とフレキシブル基板３の重合部は、配線パターン21に施
すAgPd半田メッキ層（図示せず）を介してフレキシブル
基板３の端子を熱圧着し、電気的に接続している。そし
て、フレキシブル基板３の基端（下端）は、上記コネク
タ５に電気的に接続してある。また、補強板４の外側に
は、上記駆動用ICチップ23、配線パターン21とフレキシ
ブル基板３との重合部（熱圧着部）を覆うアルミ等の保
護カバー６を配備し、この保護カバー６は補強板４に対
しビス61止着している。The width of the heat radiating plate 1 and the length of the ceramic substrate 2, that is, the length in the sub-scanning direction are set to be substantially the same, and the ceramic substrate 2 is placed on the upper surface of the heat radiating plate 1. On the other hand, the reinforcing plate (metal plate) 4 is disposed and fixed in a direction perpendicular to the heat sink 1, that is, in parallel with one end surface of the heat sink 1, and the connector 5 is fixed on the inner surface side (the lower side of the heat sink 1). In addition, a flexible substrate 3 is provided on the outer surface side. The distal end of the flexible substrate 3 is bent (bent inward) and overlaps the end of the wiring pattern 21 of the ceramic substrate 2. Wiring pattern 21
The overlapping portion of the flexible substrate 3 is electrically connected to the terminals of the flexible substrate 3 by thermocompression bonding via an AgPd solder plating layer (not shown) applied to the wiring pattern 21. The base end (lower end) of the flexible board 3 is electrically connected to the connector 5. A protective cover 6 made of aluminum or the like is provided outside the reinforcing plate 4 to cover the driving IC chip 23 and the overlapping portion (thermocompression bonding portion) of the wiring pattern 21 and the flexible substrate 3. A screw 61 is fixed to the reinforcing plate 4.
このような構成を有するサーマルヘッドでは、放熱板
１の幅長さ（副走査方向の長さ）が短く、セラミック基
板２のみが上面に載置してある。そして、フレキシブル
基板３は放熱板１に対し直角に配置した補強板４に配備
され、セラミック基板（配線パターン21）２に対し直角
方向に位置している。従って、このサーマルヘッドで
は、副走査方向の長さ（記録紙Ｂの長手方向の長さ）
が、従来の長さに比し、約半分の長さ（約16ミリ）とな
る。これにより、転写リボンＡを搬送する一対の搬送ロ
ーラＣ間の間隔を狭めることが出来、本来余分な副走査
方向のスペースを小さくし得、小型化を達成し得る。ま
た、配線パターン21とフレキシブル基板３との接続は、
半田による簡易な熱圧着方式を使用しているから、従来
のような圧接手段が不要であり、ビス止めによる複雑な
構造及び圧接不備に基づく各種の不利が解消される。In the thermal head having such a configuration, the width of the heat radiating plate 1 (the length in the sub-scanning direction) is short, and only the ceramic substrate 2 is mounted on the upper surface. The flexible substrate 3 is provided on a reinforcing plate 4 arranged at right angles to the heat radiating plate 1, and is located at right angles to the ceramic substrate (wiring pattern 21) 2. Therefore, in this thermal head, the length in the sub-scanning direction (the length in the longitudinal direction of the recording paper B)
However, the length is about half (about 16 mm) compared to the conventional length. Thereby, the interval between the pair of transport rollers C that transport the transfer ribbon A can be narrowed, and an extra space in the sub-scanning direction can be originally reduced, and downsizing can be achieved. The connection between the wiring pattern 21 and the flexible substrate 3 is as follows.
Since a simple thermocompression bonding method using solder is used, there is no need for conventional pressure contact means, and various disadvantages due to a complicated structure and insufficient pressure contact due to screws are eliminated.
（ヘ）考案の効果 この考案では、以上説明したように、上面に絶縁基板
を載置した放熱板に対し、フィルム状の絶縁材の少なく
とも片面に配線パターンを設けた導電部材を直角方向へ
配置することとしたから、サーマルヘッドの印字走査方
向に直交する副走査方向の長さ（記録紙長手方向）を短
く設定し得る。従って、本来は不要な副走査方向の余分
なスペースが小さくなり、転写紙を搬送する一対のロー
ラ間の中心距離を短くすることができ、小型化を実現し
得る。(F) Effect of the Invention In the invention, as described above, the conductive member having the wiring pattern provided on at least one surface of the film-like insulating material is arranged in the direction perpendicular to the heat sink on which the insulating substrate is mounted on the upper surface. Therefore, the length of the thermal head in the sub-scanning direction orthogonal to the print scanning direction (the longitudinal direction of the recording paper) can be set short. Therefore, an unnecessary space in the sub-scanning direction, which is originally unnecessary, is reduced, and the center distance between the pair of rollers for transporting the transfer paper can be shortened, so that downsizing can be realized.
又、フレキシブル基板等の可撓性の導電部材を用い、
この導電部材の配線パターンの一端を折り曲げて絶縁基
板の回路端部に重合させて電気的に接続してあるため、
絶縁基板と導電部材との熱膨張係数の違いによる伸縮
は、フィルム状の絶縁材で吸収することが可能となり、
絶縁基板と導電部材との接続部（重合部）での断線や接
触不良を防止することができる。Also, using a flexible conductive member such as a flexible substrate,
Since one end of the wiring pattern of the conductive member is bent and overlapped with the circuit end of the insulating substrate to be electrically connected,
Expansion and contraction due to the difference in thermal expansion coefficient between the insulating substrate and the conductive member can be absorbed by the film-like insulating material,
It is possible to prevent disconnection and poor contact at a connection portion (overlapping portion) between the insulating substrate and the conductive member.
更に、発熱ドット及び配線パターンを設けた絶縁基板
に駆動用ICも実装してあるので、駆動用ICから発熱ドッ
ト側に導出される端子数は、ドットピッチに対応して非
常に多いが、駆動用ICから導電部材（外部接続基板）側
に導出される端子数は、入力系、つまり電源とその他の
信号用の端子だけで発熱ドット側の端子数より少なくな
る。従って、絶縁基板と導電部材との間にわたる配線数
が少なくて済み、絶縁基板の回路端部と導電部材の配線
パターンとの接続が容易になるだけでなく、配線パター
ン等が印字時の熱による熱膨張の影響を受け難くなる。Furthermore, since the driving IC is also mounted on the insulating substrate on which the heating dots and the wiring patterns are provided, the number of terminals led out to the heating dots from the driving IC is very large according to the dot pitch. The number of terminals led out from the IC to the conductive member (external connection board) side is smaller than the number of terminals on the heating dot side in only the input system, that is, the power supply and other signal terminals. Therefore, the number of wires extending between the insulating substrate and the conductive member can be reduced, which facilitates the connection between the circuit end of the insulating substrate and the wiring pattern of the conductive member, and also causes the wiring pattern and the like to be heated by printing. Be less susceptible to thermal expansion.
第１図は、実施例サーマルヘッドを示す側面図、第２図
は、従来のサーマルヘッドを示す側面図である。 1:放熱板、2:セラミック基板、3:フレキシブル基板、4:
補強板、5:コネクタ、21:配線パターン、22:発熱ドッ
ト、23:駆動用ICチップ、FIG. 1 is a side view showing a thermal head according to an embodiment, and FIG. 2 is a side view showing a conventional thermal head. 1: Heat sink, 2: Ceramic board, 3: Flexible board, 4:
Reinforcement plate, 5: Connector, 21: Wiring pattern, 22: Heating dot, 23: Driving IC chip,
Claims (1)
用IC及び配線パターンを設けた絶縁基板の下面に、前記
絶縁基板の横幅と略同幅の放熱板を取付ける一方、フィ
ルム状の絶縁材の少なくとも片面に配線パターンを設け
た導電部材を、前記絶縁基板に対し、互いに端部を接合
して直角方向に配置し、この導電部材の配線パターンの
一端を折り曲げて前記絶縁基板の回路端部に重合させて
電気的に接続するとともに、この導電部材の配線パター
ンの他端をコネクタに電気的に接続してなるサーマルヘ
ッド。1. A heat-dissipating plate having a width substantially equal to the width of the insulating substrate is mounted on a lower surface of the insulating substrate provided with the heating dots on the upper surface, a driving IC for the heating dots, and a wiring pattern. A conductive member provided with a wiring pattern on at least one surface thereof is disposed at right angles to the insulating substrate by joining ends thereof, and one end of the wiring pattern of the conductive member is bent to form a circuit end of the insulating substrate. A thermal head, which is electrically connected by being superposed on the substrate and electrically connected to the connector at the other end of the wiring pattern of the conductive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988062544U JP2531461Y2 (en) | 1988-05-12 | 1988-05-12 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988062544U JP2531461Y2 (en) | 1988-05-12 | 1988-05-12 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01165248U JPH01165248U (en) | 1989-11-17 |
| JP2531461Y2 true JP2531461Y2 (en) | 1997-04-02 |
Family
ID=31288149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988062544U Expired - Lifetime JP2531461Y2 (en) | 1988-05-12 | 1988-05-12 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531461Y2 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59188452A (en) * | 1983-04-12 | 1984-10-25 | Tdk Corp | Thermal head |
| JPS6019549A (en) * | 1983-07-13 | 1985-01-31 | Matsushita Electric Ind Co Ltd | Thermal head for thermosensitive recording |
| JPS6068974A (en) * | 1983-09-27 | 1985-04-19 | Toshiba Corp | Thermal head |
| JPS6147082A (en) * | 1984-08-11 | 1986-03-07 | 東北電気工事株式会社 | Method of clamping connector with temporary wiring unit and device therefor |
| JPS61191238U (en) * | 1985-05-22 | 1986-11-28 | ||
| JPS62150147U (en) * | 1986-03-18 | 1987-09-22 |
-
1988
- 1988-05-12 JP JP1988062544U patent/JP2531461Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01165248U (en) | 1989-11-17 |
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