JPS61191238U - - Google Patents
Info
- Publication number
- JPS61191238U JPS61191238U JP7626585U JP7626585U JPS61191238U JP S61191238 U JPS61191238 U JP S61191238U JP 7626585 U JP7626585 U JP 7626585U JP 7626585 U JP7626585 U JP 7626585U JP S61191238 U JPS61191238 U JP S61191238U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- drive circuit
- circuit board
- substrate
- heating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルヘツドの一実施例の
要部を示す側面図、第２図は第１図の主要部を示
す拡大斜視図、第３図は本考案のサーマルヘツド
の他の実施例の要部を示す側面図、第４図は従来
のサーマルヘツドを示す側面図である。
１……発熱抵抗体、２……発熱抵抗体基板、３
……支持板、４……駆動回路基板、８……ボンデ
イングワイヤ、１２……接続リード電極。
Fig. 1 is a side view showing the main parts of one embodiment of the thermal head of the present invention, Fig. 2 is an enlarged perspective view showing the main parts of Fig. 1, and Fig. 3 is another embodiment of the thermal head of the present invention. FIG. 4 is a side view showing the main parts of the example, and FIG. 4 is a side view showing a conventional thermal head. 1...Heating resistor, 2...Heating resistor substrate, 3
... Support plate, 4 ... Drive circuit board, 8 ... Bonding wire, 12 ... Connection lead electrode.
Claims (1)
板が支持板の隣り合う一方の平面に配置され、こ
の支持板の他方の平面に前記発熱抵抗体を駆動す
る駆動回路基板が配置されたサーマルヘツドにお
いて、前記発熱抵抗体基板と前記駆動回路基板と
が、これらの基板の配置されたいずれか一方の平
面に配置されかつ両平面にまたがる導電面を有す
る基板の各基板の配置された同じ側の導電面にボ
ンデイングワイヤによつて電気的に接続されてな
ることを特徴とするサーマルヘツド。 (2) 基板は、水平方向から厚さ方向に導出され
た接続リード電極を備えた駆動回路基板である実
用新案登録請求の範囲第１項記載のサーマルヘツ
ド。[Claims for Utility Model Registration] (1) A heating resistor substrate having a plurality of heating resistors is disposed on one adjacent plane of a support plate, and the heating resistor is placed on the other plane of the support plate. In a thermal head in which a drive circuit board to be driven is arranged, the heating resistor board and the drive circuit board are arranged on one of the planes on which these boards are arranged, and have a conductive surface spanning both planes. 1. A thermal head characterized in that the thermal head is electrically connected to a conductive surface on the same side of a substrate by a bonding wire. (2) The thermal head according to claim 1, wherein the substrate is a drive circuit board having connection lead electrodes extending from the horizontal direction to the thickness direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7626585U JPS61191238U (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7626585U JPS61191238U (en) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61191238U true JPS61191238U (en) | 1986-11-28 |
Family
ID=30618249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7626585U Pending JPS61191238U (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61191238U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6469360A (en) * | 1987-09-10 | 1989-03-15 | Rohm Co Ltd | Compact thermal head |
| JPH01165248U (en) * | 1988-05-12 | 1989-11-17 |
-
1985
- 1985-05-22 JP JP7626585U patent/JPS61191238U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6469360A (en) * | 1987-09-10 | 1989-03-15 | Rohm Co Ltd | Compact thermal head |
| JPH01165248U (en) * | 1988-05-12 | 1989-11-17 |
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