JP2530272Y2 - 電子部品用パッケージの封止性検知装置 - Google Patents
電子部品用パッケージの封止性検知装置Info
- Publication number
- JP2530272Y2 JP2530272Y2 JP1990079718U JP7971890U JP2530272Y2 JP 2530272 Y2 JP2530272 Y2 JP 2530272Y2 JP 1990079718 U JP1990079718 U JP 1990079718U JP 7971890 U JP7971890 U JP 7971890U JP 2530272 Y2 JP2530272 Y2 JP 2530272Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- sensor
- pressure
- outside air
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 title claims description 27
- 238000001514 detection method Methods 0.000 title description 13
- 239000001301 oxygen Substances 0.000 claims description 30
- 229910052760 oxygen Inorganic materials 0.000 claims description 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 29
- 238000013459 approach Methods 0.000 claims description 6
- 230000001133 acceleration Effects 0.000 description 16
- 239000007789 gas Substances 0.000 description 13
- 230000001771 impaired effect Effects 0.000 description 12
- 230000005856 abnormality Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Examining Or Testing Airtightness (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990079718U JP2530272Y2 (ja) | 1990-07-30 | 1990-07-30 | 電子部品用パッケージの封止性検知装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990079718U JP2530272Y2 (ja) | 1990-07-30 | 1990-07-30 | 電子部品用パッケージの封止性検知装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0438047U JPH0438047U (enrdf_load_stackoverflow) | 1992-03-31 |
| JP2530272Y2 true JP2530272Y2 (ja) | 1997-03-26 |
Family
ID=31624130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990079718U Expired - Lifetime JP2530272Y2 (ja) | 1990-07-30 | 1990-07-30 | 電子部品用パッケージの封止性検知装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530272Y2 (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007248416A (ja) * | 2006-03-20 | 2007-09-27 | Musashino Kiki Kk | 液面計 |
| JP5132211B2 (ja) * | 2007-07-11 | 2013-01-30 | 大陽日酸株式会社 | リークテスターおよびリークテスト法 |
| JP5194243B2 (ja) * | 2007-09-28 | 2013-05-08 | アキム株式会社 | センサ用リーク検査装置およびセンサのリーク検査方法 |
| JP2011021964A (ja) * | 2009-07-15 | 2011-02-03 | Mtc:Kk | 密封性能測定装置 |
| JP5749510B2 (ja) * | 2011-02-09 | 2015-07-15 | 株式会社アルバック | 密閉型デバイス |
| DE102013020388A1 (de) * | 2012-12-13 | 2014-06-18 | Tesat-Spacecom Gmbh & Co. Kg | Verfahren zur Dichteprüfung eines Gehäuses |
| US10466201B2 (en) * | 2018-02-01 | 2019-11-05 | FPG Industries Ohio, Inc. | Complex impedance moisture sensor and sensing method |
| WO2020100208A1 (ja) * | 2018-11-13 | 2020-05-22 | 三菱電機株式会社 | 半導体装置、半導体装置のリーク検査方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279376A (ja) * | 1985-10-02 | 1987-04-11 | Hitachi Ltd | 半導体装置の耐湿性評価方法 |
| JPS634651A (ja) * | 1986-06-25 | 1988-01-09 | Hitachi Ltd | 半導体装置 |
-
1990
- 1990-07-30 JP JP1990079718U patent/JP2530272Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438047U (enrdf_load_stackoverflow) | 1992-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6272928B1 (en) | Hermetically sealed absolute and differential pressure transducer | |
| US7436037B2 (en) | Moisture resistant pressure sensors | |
| US6293154B1 (en) | Vibration compensated pressure sensing assembly | |
| US7597005B2 (en) | Pressure sensor housing and configuration | |
| US6826966B1 (en) | Flow sensor package | |
| EP1921445A1 (en) | Hydrogen gas sensor | |
| JP2530272Y2 (ja) | 電子部品用パッケージの封止性検知装置 | |
| JPH07280681A (ja) | センサ・ダイを保護するため気密封止された応力分離プラットフォームを有する圧力センサ | |
| AU2001284789A1 (en) | Fluid-tight differential pressure flow sensor | |
| KR20160088111A (ko) | 복합 센서와 이를 구비하는 패키지 및 그 제조 방법 | |
| JPS6153873B2 (enrdf_load_stackoverflow) | ||
| JPS61155931A (ja) | 電気的な圧力発生器 | |
| US10908041B2 (en) | Device for measuring characteristics of a fluid | |
| JP4281200B2 (ja) | 圧力検出装置 | |
| US12013412B2 (en) | Inertial measurement unit | |
| JPH10148593A (ja) | 圧力センサ及び静電容量型圧力センサチップ | |
| US6986278B2 (en) | Capped microsensor | |
| US3906426A (en) | Humidity sensor | |
| JPH0694555A (ja) | 圧力センサ | |
| JP3089853B2 (ja) | 半導体感圧素子 | |
| Sparjs | Packaging of microsystems for harsh environments | |
| JP3358684B2 (ja) | 熱依存性検出装置 | |
| JP3620184B2 (ja) | 圧力センサ | |
| US20240035823A1 (en) | Inertial Measurement Device And Method For Manufacturing Inertial Measurement Device | |
| JPH1114479A (ja) | 半導体圧力検出装置 |