JP2529475Y2 - 反射型フオトインタラプタ - Google Patents
反射型フオトインタラプタInfo
- Publication number
- JP2529475Y2 JP2529475Y2 JP1990400965U JP40096590U JP2529475Y2 JP 2529475 Y2 JP2529475 Y2 JP 2529475Y2 JP 1990400965 U JP1990400965 U JP 1990400965U JP 40096590 U JP40096590 U JP 40096590U JP 2529475 Y2 JP2529475 Y2 JP 2529475Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- organic resin
- resin substrate
- electrode
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 description 16
- 230000008878 coupling Effects 0.000 description 11
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- 238000007747 plating Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990400965U JP2529475Y2 (ja) | 1990-12-19 | 1990-12-19 | 反射型フオトインタラプタ |
US07/808,857 US5291038A (en) | 1990-12-19 | 1991-12-18 | Reflective type photointerrupter |
DE69111211T DE69111211T2 (de) | 1990-12-19 | 1991-12-19 | Photoelektrisches Schaltgerät vom Reflektionstyp. |
EP91311917A EP0493051B1 (en) | 1990-12-19 | 1991-12-19 | Reflective type photo-interrupter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990400965U JP2529475Y2 (ja) | 1990-12-19 | 1990-12-19 | 反射型フオトインタラプタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0488064U JPH0488064U (enrdf_load_stackoverflow) | 1992-07-30 |
JP2529475Y2 true JP2529475Y2 (ja) | 1997-03-19 |
Family
ID=31879136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990400965U Expired - Lifetime JP2529475Y2 (ja) | 1990-12-19 | 1990-12-19 | 反射型フオトインタラプタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2529475Y2 (enrdf_load_stackoverflow) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54100678A (en) * | 1978-01-25 | 1979-08-08 | Omron Tateisi Electronics Co | Photo coupler |
JPS5814106B2 (ja) * | 1979-10-08 | 1983-03-17 | 日本国有鉄道 | デ−タ伝送方式 |
JPS60221701A (ja) * | 1984-04-19 | 1985-11-06 | Sumitomo Bakelite Co Ltd | 透明難燃性樹脂硬化物で被覆された光学素子 |
JPS61167575A (ja) * | 1985-01-21 | 1986-07-29 | Rohm Co Ltd | サ−マルプリントヘツド |
JPS635701U (enrdf_load_stackoverflow) * | 1986-06-28 | 1988-01-14 | ||
JPS63274188A (ja) * | 1987-05-06 | 1988-11-11 | Sharp Corp | 光結合素子 |
-
1990
- 1990-12-19 JP JP1990400965U patent/JP2529475Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0488064U (enrdf_load_stackoverflow) | 1992-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |