JP2529475Y2 - 反射型フオトインタラプタ - Google Patents

反射型フオトインタラプタ

Info

Publication number
JP2529475Y2
JP2529475Y2 JP1990400965U JP40096590U JP2529475Y2 JP 2529475 Y2 JP2529475 Y2 JP 2529475Y2 JP 1990400965 U JP1990400965 U JP 1990400965U JP 40096590 U JP40096590 U JP 40096590U JP 2529475 Y2 JP2529475 Y2 JP 2529475Y2
Authority
JP
Japan
Prior art keywords
light emitting
organic resin
resin substrate
electrode
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990400965U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0488064U (enrdf_load_stackoverflow
Inventor
省一 近藤
眞澄 中道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1990400965U priority Critical patent/JP2529475Y2/ja
Priority to US07/808,857 priority patent/US5291038A/en
Priority to DE69111211T priority patent/DE69111211T2/de
Priority to EP91311917A priority patent/EP0493051B1/en
Publication of JPH0488064U publication Critical patent/JPH0488064U/ja
Application granted granted Critical
Publication of JP2529475Y2 publication Critical patent/JP2529475Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
JP1990400965U 1990-12-19 1990-12-19 反射型フオトインタラプタ Expired - Lifetime JP2529475Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1990400965U JP2529475Y2 (ja) 1990-12-19 1990-12-19 反射型フオトインタラプタ
US07/808,857 US5291038A (en) 1990-12-19 1991-12-18 Reflective type photointerrupter
DE69111211T DE69111211T2 (de) 1990-12-19 1991-12-19 Photoelektrisches Schaltgerät vom Reflektionstyp.
EP91311917A EP0493051B1 (en) 1990-12-19 1991-12-19 Reflective type photo-interrupter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990400965U JP2529475Y2 (ja) 1990-12-19 1990-12-19 反射型フオトインタラプタ

Publications (2)

Publication Number Publication Date
JPH0488064U JPH0488064U (enrdf_load_stackoverflow) 1992-07-30
JP2529475Y2 true JP2529475Y2 (ja) 1997-03-19

Family

ID=31879136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990400965U Expired - Lifetime JP2529475Y2 (ja) 1990-12-19 1990-12-19 反射型フオトインタラプタ

Country Status (1)

Country Link
JP (1) JP2529475Y2 (enrdf_load_stackoverflow)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100678A (en) * 1978-01-25 1979-08-08 Omron Tateisi Electronics Co Photo coupler
JPS5814106B2 (ja) * 1979-10-08 1983-03-17 日本国有鉄道 デ−タ伝送方式
JPS60221701A (ja) * 1984-04-19 1985-11-06 Sumitomo Bakelite Co Ltd 透明難燃性樹脂硬化物で被覆された光学素子
JPS61167575A (ja) * 1985-01-21 1986-07-29 Rohm Co Ltd サ−マルプリントヘツド
JPS635701U (enrdf_load_stackoverflow) * 1986-06-28 1988-01-14
JPS63274188A (ja) * 1987-05-06 1988-11-11 Sharp Corp 光結合素子

Also Published As

Publication number Publication date
JPH0488064U (enrdf_load_stackoverflow) 1992-07-30

Similar Documents

Publication Publication Date Title
JPS6328507B2 (enrdf_load_stackoverflow)
JPH0638514B2 (ja) フオトインタラプタ
JP4117868B2 (ja) 光結合素子
JP2529475Y2 (ja) 反射型フオトインタラプタ
JP2559764Y2 (ja) 反射型フォトインタラプタ
JPH04252082A (ja) 光結合装置
JPH1093132A (ja) 光結合装置
JPH08186284A (ja) 表面実装型フォトカプラ及びその製造方法
JPH05218491A (ja) 光結合装置
JP2001291893A (ja) 反射型フォトインタラプタ
JP2002118270A (ja) 光デバイス及びその製造方法
JPH11330538A (ja) 反射型センサ
JP2626760B2 (ja) 光回路基板の製造方法
JP2981371B2 (ja) 光結合装置
JP2601426Y2 (ja) 光結合装置
US20050023489A1 (en) Chip type photo coupler
JP3497971B2 (ja) 光結合装置およびその製造方法
JP3824696B2 (ja) フォトカプラ及びその製造方法
JP2534408Y2 (ja) 光学装置
JPH11345997A (ja) 半導体装置およびフォトインタラプタ
JPH05190890A (ja) 光結合装置
JPH07111342A (ja) 光送信モジュ−ル
JP2001217453A (ja) 光結合装置及びその製造方法
JP3472411B2 (ja) フォトmosリレー
JPH10154826A (ja) 光結合装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term