JP2529366Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2529366Y2
JP2529366Y2 JP1987192376U JP19237687U JP2529366Y2 JP 2529366 Y2 JP2529366 Y2 JP 2529366Y2 JP 1987192376 U JP1987192376 U JP 1987192376U JP 19237687 U JP19237687 U JP 19237687U JP 2529366 Y2 JP2529366 Y2 JP 2529366Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
tab
lead
insulating film
outer frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987192376U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0195760U (cg-RX-API-DMAC10.html
Inventor
武久 佐藤
宏之 星本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1987192376U priority Critical patent/JP2529366Y2/ja
Publication of JPH0195760U publication Critical patent/JPH0195760U/ja
Application granted granted Critical
Publication of JP2529366Y2 publication Critical patent/JP2529366Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/884
    • H10W72/931
    • H10W74/00
    • H10W90/736
    • H10W90/756

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987192376U 1987-12-17 1987-12-17 半導体装置 Expired - Lifetime JP2529366Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987192376U JP2529366Y2 (ja) 1987-12-17 1987-12-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987192376U JP2529366Y2 (ja) 1987-12-17 1987-12-17 半導体装置

Publications (2)

Publication Number Publication Date
JPH0195760U JPH0195760U (cg-RX-API-DMAC10.html) 1989-06-26
JP2529366Y2 true JP2529366Y2 (ja) 1997-03-19

Family

ID=31483238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987192376U Expired - Lifetime JP2529366Y2 (ja) 1987-12-17 1987-12-17 半導体装置

Country Status (1)

Country Link
JP (1) JP2529366Y2 (cg-RX-API-DMAC10.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612360U (cg-RX-API-DMAC10.html) * 1979-07-04 1981-02-02
JPS5895657U (ja) * 1981-12-23 1983-06-29 日本電気株式会社 集積回路用リ−ドフレ−ム
JPS58143541A (ja) * 1982-02-22 1983-08-26 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0195760U (cg-RX-API-DMAC10.html) 1989-06-26

Similar Documents

Publication Publication Date Title
US4974057A (en) Semiconductor device package with circuit board and resin
JP3780122B2 (ja) 半導体装置の製造方法
KR100583494B1 (ko) 반도체패키지
TW579581B (en) Semiconductor device with chip separated from substrate and its manufacturing method
JPH02502323A (ja) 集積回路用支持組立体
JP2000101016A (ja) 半導体集積回路装置
TW569406B (en) Semiconductor device and the manufacturing method thereof
US6894904B2 (en) Tab package
US20130200507A1 (en) Two-sided die in a four-sided leadframe based package
TW506093B (en) Cavity down ball grid array package and its manufacturing process
US8349655B2 (en) Method of fabricating a two-sided die in a four-sided leadframe based package
JP2529366Y2 (ja) 半導体装置
TW502422B (en) Method for encapsulating thin flip-chip-type semiconductor device
CN218957727U (zh) 半导体器件
JP2516390Y2 (ja) 半導体装置
JP3103281B2 (ja) 樹脂封止型半導体装置
JPH06507276A (ja) リードフレームに接合された介在ダイ取付基板を有する集積回路パッケージ設計
TW472375B (en) Leadframe for exposed-pad type chip package structure
JP2954118B2 (ja) 半導体装置及びその製造方法
JP2001177007A (ja) 半導体装置及びその製造方法
CN100395888C (zh) 半导体封装件及其制法
JPH0547464Y2 (cg-RX-API-DMAC10.html)
JP2513044Y2 (ja) 半導体装置
JPH03105961A (ja) 樹脂封止型半導体装置
JPH0142346Y2 (cg-RX-API-DMAC10.html)