JP2528124Y2 - 電気半田ごて - Google Patents
電気半田ごてInfo
- Publication number
- JP2528124Y2 JP2528124Y2 JP1988113199U JP11319988U JP2528124Y2 JP 2528124 Y2 JP2528124 Y2 JP 2528124Y2 JP 1988113199 U JP1988113199 U JP 1988113199U JP 11319988 U JP11319988 U JP 11319988U JP 2528124 Y2 JP2528124 Y2 JP 2528124Y2
- Authority
- JP
- Japan
- Prior art keywords
- tip
- heater
- soldering iron
- temperature
- electric soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Control Of Resistance Heating (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988113199U JP2528124Y2 (ja) | 1988-08-29 | 1988-08-29 | 電気半田ごて |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988113199U JP2528124Y2 (ja) | 1988-08-29 | 1988-08-29 | 電気半田ごて |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0253870U JPH0253870U (US20090163788A1-20090625-C00002.png) | 1990-04-18 |
JP2528124Y2 true JP2528124Y2 (ja) | 1997-03-05 |
Family
ID=31352824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988113199U Expired - Lifetime JP2528124Y2 (ja) | 1988-08-29 | 1988-08-29 | 電気半田ごて |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2528124Y2 (US20090163788A1-20090625-C00002.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8274011B2 (en) | 2009-01-24 | 2012-09-25 | Hakko Corporation | Soldering device and method of making same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2525874Y2 (ja) * | 1991-03-11 | 1997-02-12 | かがつう株式会社 | ハンダこて |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56152166U (US20090163788A1-20090625-C00002.png) * | 1980-04-11 | 1981-11-14 |
-
1988
- 1988-08-29 JP JP1988113199U patent/JP2528124Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8274011B2 (en) | 2009-01-24 | 2012-09-25 | Hakko Corporation | Soldering device and method of making same |
Also Published As
Publication number | Publication date |
---|---|
JPH0253870U (US20090163788A1-20090625-C00002.png) | 1990-04-18 |
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