JP2527644B2 - PCB mounting device - Google Patents
PCB mounting deviceInfo
- Publication number
- JP2527644B2 JP2527644B2 JP2301736A JP30173690A JP2527644B2 JP 2527644 B2 JP2527644 B2 JP 2527644B2 JP 2301736 A JP2301736 A JP 2301736A JP 30173690 A JP30173690 A JP 30173690A JP 2527644 B2 JP2527644 B2 JP 2527644B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- holding
- diameter hole
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 （イ）産業上の利用分野 本発明は、電子機器に利用されるプリント基板への各
種電子部品の中で、耐熱性のないQFP（Quad Flat Packa
ge）と呼ばれる集積度の高いLSI等の保護を図った部品
の取付装置に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention is intended to provide a heat-resistant QFP (Quad Flat Packa) among various electronic components for printed circuit boards used in electronic devices.
ge) related to a mounting device for parts that protects highly integrated LSIs and the like.
（ロ）従来の技術 一般に電子機器は小型化が進み、更に部品の小型化も
急激に進んで来て、モジュール化が提案され、複合電子
部品としてセラミックの容器を用いた技術が特開平２−
20100号に提案されている。(B) Conventional Technology In general, electronic devices have been downsized, and further miniaturization of parts has been rapidly advanced, so that modularization has been proposed, and a technique using a ceramic container as a composite electronic part is disclosed in Japanese Patent Laid-Open No. HEI 2-.
Proposed in No. 20100.
一方前記部品の小型化に伴って小電力用はチップ部品
化即ちリードレスの部品が多くなり、表面実装に用いら
れるチップマウンタにより、特に両面基板を用いてリフ
ローを行い、各種の電子部品（抵抗、コンデンサ、ダイ
オード、トランジスタ等）を取付けることが多く行われ
ている。ところが前記電子部品の中には、耐熱特性の乏
しい所謂非耐熱部品が含まれ、これらの取付けには、温
度上での配慮が必要となっている。On the other hand, with the miniaturization of the above-mentioned components, there are more chip components for low power use, that is, leadless components, and a chip mounter used for surface mounting particularly performs reflow by using a double-sided substrate and various electronic components (resistors). , Capacitors, diodes, transistors, etc.) are often used. However, the electronic parts include so-called non-heat resistant parts having poor heat resistance, and it is necessary to consider the temperature when mounting them.
そこで従来は、非耐熱性部品はフロー半田面リフロー
時には実装せず、フロー半田後に手付け又は専用機を用
いて半田付けする方法が多く採用されている。Therefore, conventionally, a non-heat resistant component is often not mounted at the time of reflow soldering on the flow soldering surface, but is often soldered by hand or using a dedicated machine after the flow soldering.
（ハ）発明が解決しようとする課題 前記従来例では、作業能率も悪く、近年の自動化にお
いては、１つの障害になっており、本発明は非耐熱部品
をリフロー後に、他の部品のフロー半田を可能にした新
規な技術を提供するものである。(C) Problems to be Solved by the Invention In the above-mentioned conventional example, the work efficiency is poor, and this is one obstacle in automation in recent years. It provides a new technology that enables
（ニ）課題を解決するための手段 本発明は、フロー半田時に非耐熱部品をディックカバ
ーを取付けて、該非耐熱部品を高熱から保護する構成で
ある。(D) Means for Solving the Problems The present invention has a configuration in which a non-heat-resistant component is attached to a dick cover during flow soldering to protect the non-heat-resistant component from high heat.
（ホ）作 用 本発明のプリント基板の部品取付装置においては、非
耐熱部品を半田面リフローに実装し、フロー半田では保
護用のディップカバーを取付ける構成であり、取付作業
が簡便化され、自動化に即した作業手順が実施できる。(E) Operation In the printed circuit board component mounting device of the present invention, the non-heat-resistant component is mounted on the solder surface reflow, and the dip cover for protection is mounted by flow soldering, which simplifies the mounting work and makes it automated. It is possible to carry out work procedures according to.
（ヘ）実施例 図面に従って本発明を説明すると、第１図は本発明装
置の部品取付装置を示す要部断面側面図、第２図は同装
置に用いる保持用バネの平面図、第３図は同装置に用い
るディップカバーの要部断面図を示す。(F) Embodiments The present invention will be described with reference to the drawings. FIG. 1 is a sectional side view of an essential part showing a component mounting device of the device of the present invention, FIG. 2 is a plan view of a holding spring used in the device, and FIG. Shows a cross-sectional view of a main part of a dip cover used in the device.
図面において、（１）は銅箔（２）が設けられたプリ
ント基板、（３）は段部（４）を有する保持脚（５）が
固定されたディップカバー、（６）は折曲部（７）、保
持孔としての大径部（８）及び小径部（９）を有する保
持用バネ、（10）は非耐熱部品としてのQFPタイプのLSI
を示す。In the drawings, (1) is a printed circuit board provided with a copper foil (2), (3) is a dip cover to which a holding leg (5) having a stepped portion (4) is fixed, and (6) is a bent portion ( 7), a holding spring having a large diameter portion (8) and a small diameter portion (9) as holding holes, and (10) a QFP type LSI as a non-heat resistant component.
Indicates.
次に本発明装置の作業順序について説明すると、先ず
耐熱部品、例えばチップ抵抗、チップコンデンサ、各種
コイル等は予めプリント基板（１）表面実装機、自動挿
入機によって装着又は挿入され、これらは通常のフロー
半田によりディッピングされる。Next, the operation sequence of the device of the present invention will be described. First, heat-resistant parts such as chip resistors, chip capacitors, and various coils are mounted or inserted in advance by the printed board (1) surface mounter and automatic inserter, and these are the usual ones. Dipped by flow soldering.
この場合半田面リフロー及び部品面リフローの作業を
行っておき、その後図面に示すようにプリント基板
（１）上に実装された非耐熱部品としてのLSI（９）は
リード線（11）が前記プリント基板（１）上の銅箔
（２）に接続された状態になっており、プリント基板
（１）の貫通孔（12）を通して保持脚（５）を下方から
挿入する。保持脚（５）の先端に対して保持用バネ
（６）を矢印方向の力を加えてたるませ、前記保持用バ
ネ（６）の大径部に保持脚の先端の大径部分を挿入し、
その後前記力をゆるめ、保持脚（５）の小径部分となっ
ている段部（４）を保持用バネ（６）の小径部（９）に
嵌合させれば、ディップカバー（３）はプリント基板
（１）に一体化され、第１図図示の状態となる。該ディ
ップカバー（３）の取外し作業は保持用バネ（６）をた
るませて行う。この状態でフロー半田時、前記ディップ
カバー（３）によって内部に収納されている非耐熱部品
であるLSI、特にQFPタイプの半導体素子は熱から保護で
きる。In this case, the solder surface reflow process and the component surface reflow process are performed, and then the lead wire (11) is printed on the LSI (9) as a non-heat resistant component mounted on the printed circuit board (1) as shown in the drawing. It is in a state of being connected to the copper foil (2) on the board (1), and the holding leg (5) is inserted from below through the through hole (12) of the printed board (1). The holding spring (6) is slackened by applying a force in the direction of the arrow to the tip of the holding leg (5), and the large diameter portion of the tip of the holding leg is inserted into the large diameter portion of the holding spring (6). ,
Then, the force is released, and the stepped portion (4), which is the small diameter portion of the holding leg (5), is fitted into the small diameter portion (9) of the holding spring (6), and the dip cover (3) is printed. It is integrated with the substrate (1) to be in the state shown in FIG. The removal work of the dip cover (3) is performed by slackening the holding spring (6). In this state, during flow soldering, the LSI, which is a non-heat-resistant component housed inside by the dip cover (3), especially the semiconductor device of QFP type, can be protected from heat.
なお本発明のプリント基板の部品取付装置において、
ディップカバー（３）としての材料は錆等に強いステン
レスを用い、種々の厚さについて実験したところ、約20
0℃の加熱に伴う該ディップカバー（３）の歪みに対し
て、その歪み矯正が容易なことから、0.3〜0.5mm厚が最
適であった。In the printed circuit board component mounting device of the present invention,
As a material for the dip cover (3), stainless steel that is resistant to rust and the like was used.
With respect to the distortion of the dip cover (3) that accompanies heating at 0 ° C., it is easy to correct the distortion, so that the thickness of 0.3 to 0.5 mm was optimal.
これはステンレスの温度特性により、例えば少し厚目
の1.5mm厚を用いた場合に反りによる歪みを手で矯正し
ようとすると極めて困難で、厚さを増したとしても反り
による歪みは未然に防止できないので、上記厚さが適当
と考えられる。Due to the temperature characteristics of stainless steel, it is extremely difficult to correct the distortion due to warpage by hand when using a slightly thicker 1.5 mm thickness, and even if the thickness is increased, the distortion due to warpage cannot be prevented in advance. Therefore, the above thickness is considered appropriate.
（ト）発明の効果 前述の構成によれば、プリント基板の半田面に装着
（実装）するチップ部品についてはフロー半田とし、デ
ィップ半田（溶融半田に浸漬）工程では、非耐熱部品は
ディップカバーの取付けで、熱破壊から防止され、更に
その取付作業がバネの使用によって能率良く行えるの
で、作業能率の向上につながり、その効果は極めて大き
い。(G) Effect of the Invention According to the above-mentioned configuration, the chip component mounted (mounted) on the solder surface of the printed circuit board is the flow solder, and the non-heat resistant component is the dip cover in the dip solder (immersed in the molten solder) process. By mounting, it can be prevented from thermal damage, and the mounting work can be done efficiently by using a spring, which leads to improvement of work efficiency and its effect is extremely large.
第１図は本発明のプリント基板の部品取付装置を示す要
部断面図、第２図は同装置に用いる保持用バネの平面
図、第３図は同装置に用いるディップカバーの縦断面図
を示す。 （１）……プリント基板、（３）……ディップカバー、
（４）……段部、（５）……保持脚、（６）……保持用
バネ、（８）……大径部、（９）……小径部。FIG. 1 is a cross-sectional view of an essential part showing a component mounting device for a printed circuit board according to the present invention, FIG. 2 is a plan view of a holding spring used in the device, and FIG. 3 is a vertical cross-sectional view of a dip cover used in the device. Show. (1) …… Printed circuit board, (3) …… Dip cover,
(4) ... step, (5) ... holding leg, (6) ... holding spring, (8) ... large diameter part, (9) ... small diameter part.
フロントページの続き (72)発明者 酒本 豊 大阪府守口市京阪本通２丁目18番地 三 洋電機株式会社内 (56)参考文献 特開 平１−290294（ＪＰ，Ａ) 特開 平１−93102（ＪＰ，Ａ) 特開 昭59−96792（ＪＰ，Ａ)Front page continued (72) Inventor Yutaka Sakamoto 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (56) Reference JP-A-1-290294 (JP, A) JP-A-1-290294 93102 (JP, A) JP 59-96792 (JP, A)
Claims (1)
の電子部品を取付けるプリント基板の部品取付装置にお
いて、非耐熱部品を予め前記プリント基板に取付けた
後、該非耐熱部品の保護カバー用のディップカバーに固
定した保持脚と、大径孔と小径孔とを備えた保持用バネ
より構成され、前記保持脚の先端を前記保持用バネの大
径孔を貫通させ、前記保持脚に設けた段部に前記保持用
バネの小径孔を装着して前記ディップカバーを前記プリ
ント基板に一体化し、フロー半田を行うことを特徴とし
たプリント基板の部品取付装置。1. A printed circuit board component mounting apparatus for mounting various electronic components on a printed circuit board having a copper foil pattern, wherein after a non-heat resistant component is previously mounted on the printed circuit board, a dip cover for a protective cover of the non-heat resistant component. A holding leg fixed to the holding leg and a holding spring having a large-diameter hole and a small-diameter hole, and the tip of the holding leg penetrates the large-diameter hole of the holding spring, and a step portion provided on the holding leg. A component mounting apparatus for a printed circuit board, characterized in that a small diameter hole of the holding spring is mounted on the printed circuit board, the dip cover is integrated with the printed circuit board, and flow soldering is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301736A JP2527644B2 (en) | 1990-11-06 | 1990-11-06 | PCB mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301736A JP2527644B2 (en) | 1990-11-06 | 1990-11-06 | PCB mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04171992A JPH04171992A (en) | 1992-06-19 |
| JP2527644B2 true JP2527644B2 (en) | 1996-08-28 |
Family
ID=17900546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2301736A Expired - Lifetime JP2527644B2 (en) | 1990-11-06 | 1990-11-06 | PCB mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527644B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157762A (en) * | 2005-11-30 | 2007-06-21 | Mitsumi Electric Co Ltd | Method of manufacturing packaging printed circuit board and solder masking cap used therefor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5996792A (en) * | 1982-11-25 | 1984-06-04 | キヤノン株式会社 | Electronic device |
| JPH0193102A (en) * | 1987-10-05 | 1989-04-12 | Alps Electric Co Ltd | Soldering method for electronic parts |
| JPH01290294A (en) * | 1988-05-18 | 1989-11-22 | Matsushita Electric Ind Co Ltd | Soldering mask plate |
-
1990
- 1990-11-06 JP JP2301736A patent/JP2527644B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04171992A (en) | 1992-06-19 |
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