JP2526469Y2 - 混成集積回路の封止構造 - Google Patents

混成集積回路の封止構造

Info

Publication number
JP2526469Y2
JP2526469Y2 JP12291388U JP12291388U JP2526469Y2 JP 2526469 Y2 JP2526469 Y2 JP 2526469Y2 JP 12291388 U JP12291388 U JP 12291388U JP 12291388 U JP12291388 U JP 12291388U JP 2526469 Y2 JP2526469 Y2 JP 2526469Y2
Authority
JP
Japan
Prior art keywords
wire
integrated circuit
hybrid integrated
semiconductor element
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12291388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244339U (https=
Inventor
則明 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP12291388U priority Critical patent/JP2526469Y2/ja
Publication of JPH0244339U publication Critical patent/JPH0244339U/ja
Application granted granted Critical
Publication of JP2526469Y2 publication Critical patent/JP2526469Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12291388U 1988-09-20 1988-09-20 混成集積回路の封止構造 Expired - Lifetime JP2526469Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12291388U JP2526469Y2 (ja) 1988-09-20 1988-09-20 混成集積回路の封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12291388U JP2526469Y2 (ja) 1988-09-20 1988-09-20 混成集積回路の封止構造

Publications (2)

Publication Number Publication Date
JPH0244339U JPH0244339U (https=) 1990-03-27
JP2526469Y2 true JP2526469Y2 (ja) 1997-02-19

Family

ID=31371291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12291388U Expired - Lifetime JP2526469Y2 (ja) 1988-09-20 1988-09-20 混成集積回路の封止構造

Country Status (1)

Country Link
JP (1) JP2526469Y2 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49109147U (https=) * 1973-01-12 1974-09-18
JPS5821850A (ja) * 1981-08-03 1983-02-08 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH0422692Y2 (https=) * 1985-06-21 1992-05-25

Also Published As

Publication number Publication date
JPH0244339U (https=) 1990-03-27

Similar Documents

Publication Publication Date Title
US4908685A (en) Magnetoelectric transducer
US8890310B2 (en) Power module package having excellent heat sink emission capability and method for manufacturing the same
US6215175B1 (en) Semiconductor package having metal foil die mounting plate
US5710695A (en) Leadframe ball grid array package
US4862245A (en) Package semiconductor chip
CN102136469B (zh) 功率半导体模块以及操作功率半导体模块的方法
US4924291A (en) Flagless semiconductor package
US20050056918A1 (en) Power module package having improved heat dissipating capability
HK56594A (en) Packaged semiconductor chip
KR100902766B1 (ko) 절연성 세라믹 히트 싱크를 갖는 디스크리트 패키지
US4924351A (en) Recessed thermally conductive packaged semiconductor devices
US5317194A (en) Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink
JP2526469Y2 (ja) 混成集積回路の封止構造
JP2905609B2 (ja) 樹脂封止型半導体装置
JPH0645504A (ja) 半導体装置
JPS59207646A (ja) 半導体装置およびリ−ドフレ−ム
JP2682307B2 (ja) 半導体集積回路の実装方法
JP2904154B2 (ja) 半導体素子を含む電子回路装置
JP2982182B2 (ja) 樹脂封止型半導体装置
JPH0411761A (ja) 樹脂封止型半導体装置
KR900001833B1 (ko) 수지봉합형 반도체장치
KR102228938B1 (ko) 커플드 반도체 패키지
KR102378171B1 (ko) 커플드 반도체 패키지
JP2000031194A (ja) ボンディングワイヤおよび半導体装置
JPS60167432A (ja) 半導体装置