JP2522461Y2 - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置Info
- Publication number
- JP2522461Y2 JP2522461Y2 JP1990120526U JP12052690U JP2522461Y2 JP 2522461 Y2 JP2522461 Y2 JP 2522461Y2 JP 1990120526 U JP1990120526 U JP 1990120526U JP 12052690 U JP12052690 U JP 12052690U JP 2522461 Y2 JP2522461 Y2 JP 2522461Y2
- Authority
- JP
- Japan
- Prior art keywords
- heater
- heater plate
- stocker
- claw
- heater block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 210000000078 claw Anatomy 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120526U JP2522461Y2 (ja) | 1990-11-16 | 1990-11-16 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120526U JP2522461Y2 (ja) | 1990-11-16 | 1990-11-16 | ワイヤボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0477239U JPH0477239U (Direct) | 1992-07-06 |
| JP2522461Y2 true JP2522461Y2 (ja) | 1997-01-16 |
Family
ID=31868428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990120526U Expired - Fee Related JP2522461Y2 (ja) | 1990-11-16 | 1990-11-16 | ワイヤボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2522461Y2 (Direct) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0225045A (ja) * | 1988-07-13 | 1990-01-26 | Oki Electric Ind Co Ltd | 半導体装置 |
-
1990
- 1990-11-16 JP JP1990120526U patent/JP2522461Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0477239U (Direct) | 1992-07-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |