JP2521880C - - Google Patents

Info

Publication number

JP2521880C

JP2521880C JP2521880C JP 2521880 C JP2521880 C JP 2521880C JP 2521880 C JP2521880 C JP 2521880C

Authority

JP

Japan

Prior art keywords

alloy

strength

present

plating

solder joint

Prior art date

1998-05-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 239000010949 copper Substances 0.000 claims description 11
• 229910052804 chromium Inorganic materials 0.000 claims description 6
• 229910052719 titanium Inorganic materials 0.000 claims description 6
• 229910052726 zirconium Inorganic materials 0.000 claims description 6
• 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
• 229910045601 alloy Inorganic materials 0.000 description 23
• 239000000956 alloy Substances 0.000 description 23
• 229910000679 solder Inorganic materials 0.000 description 13
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 12
• 238000007747 plating Methods 0.000 description 8
• 229910000906 Bronze Inorganic materials 0.000 description 7
• OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
• 239000010974 bronze Substances 0.000 description 7
• 230000000694 effects Effects 0.000 description 7
• 229910052718 tin Inorganic materials 0.000 description 7
• 230000000052 comparative effect Effects 0.000 description 6
• 229910017755 Cu-Sn Inorganic materials 0.000 description 5
• 229910017927 Cu—Sn Inorganic materials 0.000 description 5
• 229910052802 copper Inorganic materials 0.000 description 5
• 238000005336 cracking Methods 0.000 description 5
• 239000000203 mixture Substances 0.000 description 5
• 238000001556 precipitation Methods 0.000 description 5
• 238000005452 bending Methods 0.000 description 4
• 230000007423 decrease Effects 0.000 description 4
• 239000000463 material Substances 0.000 description 4
• 239000004065 semiconductor Substances 0.000 description 4
• 238000001816 cooling Methods 0.000 description 3
• 230000007547 defect Effects 0.000 description 3
• 238000005098 hot rolling Methods 0.000 description 3
• 229910001369 Brass Inorganic materials 0.000 description 2
• 229910020816 Sn Pb Inorganic materials 0.000 description 2
• 229910020922 Sn-Pb Inorganic materials 0.000 description 2
• 229910008783 Sn—Pb Inorganic materials 0.000 description 2
• 239000000654 additive Substances 0.000 description 2
• 230000000996 additive effect Effects 0.000 description 2
• 230000032683 aging Effects 0.000 description 2
• 238000000137 annealing Methods 0.000 description 2
• 239000010951 brass Substances 0.000 description 2
• 238000006243 chemical reaction Methods 0.000 description 2
• 238000009792 diffusion process Methods 0.000 description 2
• 238000010438 heat treatment Methods 0.000 description 2
• 230000001771 impaired effect Effects 0.000 description 2
• 229910052742 iron Inorganic materials 0.000 description 2
• 238000002844 melting Methods 0.000 description 2
• 230000008018 melting Effects 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 239000002244 precipitate Substances 0.000 description 2
• 238000005204 segregation Methods 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 238000005482 strain hardening Methods 0.000 description 2
• 230000035882 stress Effects 0.000 description 2
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• 229910017827 Cu—Fe Inorganic materials 0.000 description 1
• 229910017888 Cu—P Inorganic materials 0.000 description 1
• 229910001128 Sn alloy Inorganic materials 0.000 description 1
• 229910009038 Sn—P Inorganic materials 0.000 description 1
• 229910052787 antimony Inorganic materials 0.000 description 1
• 230000004888 barrier function Effects 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 238000005266 casting Methods 0.000 description 1
• 239000003610 charcoal Substances 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• 150000001875 compounds Chemical class 0.000 description 1
• 239000012141 concentrate Substances 0.000 description 1
• 230000007797 corrosion Effects 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 229910002804 graphite Inorganic materials 0.000 description 1
• 239000010439 graphite Substances 0.000 description 1
• 229910000765 intermetallic Inorganic materials 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 229910052748 manganese Inorganic materials 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 229910000510 noble metal Inorganic materials 0.000 description 1
• 238000004881 precipitation hardening Methods 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 229910052761 rare earth metal Inorganic materials 0.000 description 1
• 230000000630 rising effect Effects 0.000 description 1
• 230000035945 sensitivity Effects 0.000 description 1
• 239000006104 solid solution Substances 0.000 description 1
• 229910052720 vanadium Inorganic materials 0.000 description 1
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
• 229910052725 zinc Inorganic materials 0.000 description 1