JP2519504Y2 - 発光ダイオード - Google Patents

発光ダイオード

Info

Publication number
JP2519504Y2
JP2519504Y2 JP1989128382U JP12838289U JP2519504Y2 JP 2519504 Y2 JP2519504 Y2 JP 2519504Y2 JP 1989128382 U JP1989128382 U JP 1989128382U JP 12838289 U JP12838289 U JP 12838289U JP 2519504 Y2 JP2519504 Y2 JP 2519504Y2
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
emitting chip
base
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989128382U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0367461U (OSRAM
Inventor
勝英 真部
彰 馬淵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP1989128382U priority Critical patent/JP2519504Y2/ja
Publication of JPH0367461U publication Critical patent/JPH0367461U/ja
Application granted granted Critical
Publication of JP2519504Y2 publication Critical patent/JP2519504Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1989128382U 1989-10-31 1989-10-31 発光ダイオード Expired - Fee Related JP2519504Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH0367461U JPH0367461U (OSRAM) 1991-07-01
JP2519504Y2 true JP2519504Y2 (ja) 1996-12-04

Family

ID=31676090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128382U Expired - Fee Related JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Country Status (1)

Country Link
JP (1) JP2519504Y2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790347B1 (ko) * 2006-10-27 2008-01-02 주식회사 대목환경건설 수생식물용 식생블록
JP5174630B2 (ja) * 2008-11-26 2013-04-03 Ｔｏｗａ株式会社 光学成形品の圧縮成形方法
JP6454698B2 (ja) * 2013-06-28 2019-01-16 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光ダイオードデバイス
CN105340090B (zh) * 2013-06-28 2018-11-09 亮锐控股有限公司 发光二极管器件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884U (OSRAM) * 1973-05-18 1975-01-29
JPS587364U (ja) * 1981-07-07 1983-01-18 スタンレー電気株式会社 発光ダイオ−ドランプ
JPS6315483A (ja) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd 発光ダイオ−ド用リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element

Also Published As

Publication number Publication date
JPH0367461U (OSRAM) 1991-07-01

Similar Documents

Publication Publication Date Title
US7161187B2 (en) Light emitting diode and manufacturing method thereof
US9401467B2 (en) Light emitting device package having a package body including a recess and lighting system including the same
JP6176101B2 (ja) 樹脂パッケージ及び発光装置
US20020163001A1 (en) Surface mount light emitting device package and fabrication method
US20060054912A1 (en) Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
JP4182784B2 (ja) 発光装置およびその製造方法
JP2922977B2 (ja) 発光ダイオード
US7126163B2 (en) Light-emitting diode and its manufacturing method
JPS62229883A (ja) フオトインタラプタ
JP2001230453A (ja) Ｌｅｄランプ及びその製造方法
JP2519504Y2 (ja) 発光ダイオード
US8007136B2 (en) Light emitting diode
JP4239564B2 (ja) 発光ダイオードおよびｌｅｄライト
CN109509827A (zh) 一种深紫外半导体发光二极管器件及其制备方法
JPH0410671A (ja) 発光ダイオード
KR20040024747A (ko) 고휘도 발광다이오드 및 그 제조방법
JPH0550754U (ja) 発光装置
KR20180034929A (ko) 광학 렌즈, 광원 모듈 및 이를 구비한 라이트 유닛
JP2921451B2 (ja) 半導体発光モジュール
JP4677653B2 (ja) 光半導体素子
JP3332809B2 (ja) 光素子
JP4280973B2 (ja) 半導体発光装置及びその製法
JPH11177145A (ja) 反射型発光ダイオード
JPH02234478A (ja) 発光ダイオード
JP4226338B2 (ja) 発光ダイオードおよびｌｅｄライト

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees