JP2518721Y2 - 半導体素子収納用パッケージ - Google Patents
半導体素子収納用パッケージInfo
- Publication number
- JP2518721Y2 JP2518721Y2 JP7565590U JP7565590U JP2518721Y2 JP 2518721 Y2 JP2518721 Y2 JP 2518721Y2 JP 7565590 U JP7565590 U JP 7565590U JP 7565590 U JP7565590 U JP 7565590U JP 2518721 Y2 JP2518721 Y2 JP 2518721Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- organic resin
- resin adhesive
- container
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7565590U JP2518721Y2 (ja) | 1990-07-16 | 1990-07-16 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7565590U JP2518721Y2 (ja) | 1990-07-16 | 1990-07-16 | 半導体素子収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0434747U JPH0434747U (US20090163788A1-20090625-C00002.png) | 1992-03-23 |
JP2518721Y2 true JP2518721Y2 (ja) | 1996-11-27 |
Family
ID=31616422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7565590U Expired - Lifetime JP2518721Y2 (ja) | 1990-07-16 | 1990-07-16 | 半導体素子収納用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2518721Y2 (US20090163788A1-20090625-C00002.png) |
-
1990
- 1990-07-16 JP JP7565590U patent/JP2518721Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0434747U (US20090163788A1-20090625-C00002.png) | 1992-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2518721Y2 (ja) | 半導体素子収納用パッケージ | |
JP2962939B2 (ja) | 半導体素子収納用パッケージ | |
JP2750237B2 (ja) | 電子部品収納用パッケージ | |
JP2685083B2 (ja) | 半導体素子収納用パッケージの製造方法 | |
JPH0629330A (ja) | 半導体装置 | |
JP3318449B2 (ja) | 半導体素子収納用パッケージ | |
JP3292609B2 (ja) | 半導体素子収納用パッケージ | |
JP2931481B2 (ja) | 半導体素子収納用パッケージ | |
JP3176267B2 (ja) | 半導体素子収納用パッケージ | |
JP2555178Y2 (ja) | 半導体素子収納用パッケージ | |
JP4514355B2 (ja) | 電子部品収納用容器 | |
JP2552554Y2 (ja) | 半導体素子収納用パッケージ | |
JP2740604B2 (ja) | 半導体装置 | |
JP2545400Y2 (ja) | 半導体素子収納用パッケージ | |
JP2577088Y2 (ja) | 半導体素子収納用パッケージ | |
JP2545402Y2 (ja) | 半導体素子収納用パッケージ | |
JP2997367B2 (ja) | 半導体素子収納用パッケージ | |
JPH11163190A (ja) | 半導体素子収納用パッケージ | |
JP2842716B2 (ja) | 半導体素子収納用パッケージ | |
JP2545401Y2 (ja) | 半導体素子収納用パッケージ | |
JP2510571Y2 (ja) | ガラス封止型半導体素子収納用パッケ―ジ | |
JP2002289725A (ja) | 電子部品収納用容器 | |
JPH05121581A (ja) | 半導体素子収納用パツケージ | |
JP2002289726A (ja) | 電子部品収納用容器 | |
JPH05326738A (ja) | 半導体素子収納用パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |