JP2515657Y2 - タブテープ - Google Patents
タブテープInfo
- Publication number
- JP2515657Y2 JP2515657Y2 JP1990069310U JP6931090U JP2515657Y2 JP 2515657 Y2 JP2515657 Y2 JP 2515657Y2 JP 1990069310 U JP1990069310 U JP 1990069310U JP 6931090 U JP6931090 U JP 6931090U JP 2515657 Y2 JP2515657 Y2 JP 2515657Y2
- Authority
- JP
- Japan
- Prior art keywords
- tab tape
- insulating film
- connection terminal
- external circuit
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009751 slip forming Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 230000008602 contraction Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069310U JP2515657Y2 (ja) | 1990-06-28 | 1990-06-28 | タブテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069310U JP2515657Y2 (ja) | 1990-06-28 | 1990-06-28 | タブテープ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0428440U JPH0428440U (enrdf_load_stackoverflow) | 1992-03-06 |
| JP2515657Y2 true JP2515657Y2 (ja) | 1996-10-30 |
Family
ID=31604499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069310U Expired - Lifetime JP2515657Y2 (ja) | 1990-06-28 | 1990-06-28 | タブテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515657Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW438109U (en) * | 1999-03-19 | 2001-05-28 | Hon Hai Prec Ind Co Ltd | Terminal of electrical connector |
-
1990
- 1990-06-28 JP JP1990069310U patent/JP2515657Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0428440U (enrdf_load_stackoverflow) | 1992-03-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |