JP2515051Y2 - 半導体素子収納用パッケージ - Google Patents
半導体素子収納用パッケージInfo
- Publication number
- JP2515051Y2 JP2515051Y2 JP8367890U JP8367890U JP2515051Y2 JP 2515051 Y2 JP2515051 Y2 JP 2515051Y2 JP 8367890 U JP8367890 U JP 8367890U JP 8367890 U JP8367890 U JP 8367890U JP 2515051 Y2 JP2515051 Y2 JP 2515051Y2
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- metal layer
- package
- integrated circuit
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8367890U JP2515051Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8367890U JP2515051Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0442739U JPH0442739U (en:Method) | 1992-04-10 |
JP2515051Y2 true JP2515051Y2 (ja) | 1996-10-23 |
Family
ID=31631542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8367890U Expired - Lifetime JP2515051Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2515051Y2 (en:Method) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2783735B2 (ja) * | 1992-10-07 | 1998-08-06 | 京セラ株式会社 | 半導体素子収納用パッケージ |
-
1990
- 1990-08-07 JP JP8367890U patent/JP2515051Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0442739U (en:Method) | 1992-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |