JP2515051Y2 - 半導体素子収納用パッケージ - Google Patents

Info

Publication number

JP2515051Y2

JP2515051Y2 JP8367890U JP8367890U JP2515051Y2 JP 2515051 Y2 JP2515051 Y2 JP 2515051Y2 JP 8367890 U JP8367890 U JP 8367890U JP 8367890 U JP8367890 U JP 8367890U JP 2515051 Y2 JP2515051 Y2 JP 2515051Y2

Authority

JP

Japan

Prior art keywords

brazing material

metal layer

package

integrated circuit

insulating substrate

Prior art date

1990-08-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 239000004065 semiconductor Substances 0.000 title claims description 44
• 229910052751 metal Inorganic materials 0.000 claims description 69
• 239000002184 metal Substances 0.000 claims description 69
• 238000005219 brazing Methods 0.000 claims description 45
• 239000000463 material Substances 0.000 claims description 38
• 239000000758 substrate Substances 0.000 claims description 28
• 229910052709 silver Inorganic materials 0.000 claims description 16
• 239000004332 silver Substances 0.000 claims description 16
• PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 12
• 229910052738 indium Inorganic materials 0.000 claims description 6
• APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
• 238000000151 deposition Methods 0.000 claims description 3
• 239000010410 layer Substances 0.000 description 36
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 15
• 230000035882 stress Effects 0.000 description 10
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
• 229910001128 Sn alloy Inorganic materials 0.000 description 7
• 229910000833 kovar Inorganic materials 0.000 description 7
• JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 6
• WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
• 239000010949 copper Substances 0.000 description 5
• 239000003566 sealing material Substances 0.000 description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
• 239000000919 ceramic Substances 0.000 description 4
• 229910052802 copper Inorganic materials 0.000 description 4
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
• 229910052737 gold Inorganic materials 0.000 description 4
• 239000010931 gold Substances 0.000 description 4
• 229910052759 nickel Inorganic materials 0.000 description 4
• 239000000843 powder Substances 0.000 description 4
• 238000009864 tensile test Methods 0.000 description 4
• 230000008646 thermal stress Effects 0.000 description 4
• 229910052721 tungsten Inorganic materials 0.000 description 4
• 239000010937 tungsten Substances 0.000 description 4
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
• 229910052787 antimony Inorganic materials 0.000 description 3
• WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
• 239000011247 coating layer Substances 0.000 description 3
• 238000011156 evaluation Methods 0.000 description 3
• 229910052732 germanium Inorganic materials 0.000 description 3
• GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
• 238000005304 joining Methods 0.000 description 3
• 238000000034 method Methods 0.000 description 3
• ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 229910045601 alloy Inorganic materials 0.000 description 2
• 239000000956 alloy Substances 0.000 description 2
• JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
• 239000000292 calcium oxide Substances 0.000 description 2
• 235000012255 calcium oxide Nutrition 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 239000012467 final product Substances 0.000 description 2
• 239000003960 organic solvent Substances 0.000 description 2
• SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
• 238000007747 plating Methods 0.000 description 2
• 239000010802 sludge Substances 0.000 description 2
• 239000002904 solvent Substances 0.000 description 2
• ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
• 230000000052 comparative effect Effects 0.000 description 1
• 230000007797 corrosion Effects 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 238000000280 densification Methods 0.000 description 1
• 230000008021 deposition Effects 0.000 description 1
• 238000010292 electrical insulation Methods 0.000 description 1
• 239000012777 electrically insulating material Substances 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• 230000010354 integration Effects 0.000 description 1
• 238000010030 laminating Methods 0.000 description 1
• 230000007257 malfunction Effects 0.000 description 1
• WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
• 238000002156 mixing Methods 0.000 description 1
• 229910052750 molybdenum Inorganic materials 0.000 description 1
• 239000011733 molybdenum Substances 0.000 description 1
• TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 239000000047 product Substances 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• 239000003870 refractory metal Substances 0.000 description 1
• 238000005096 rolling process Methods 0.000 description 1
• 238000005245 sintering Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 230000003685 thermal hair damage Effects 0.000 description 1
• 230000007704 transition Effects 0.000 description 1
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1