JP2513472Y2 - ワイヤ―ボンディング装置 - Google Patents

ワイヤ―ボンディング装置

Info

Publication number
JP2513472Y2
JP2513472Y2 JP1991005074U JP507491U JP2513472Y2 JP 2513472 Y2 JP2513472 Y2 JP 2513472Y2 JP 1991005074 U JP1991005074 U JP 1991005074U JP 507491 U JP507491 U JP 507491U JP 2513472 Y2 JP2513472 Y2 JP 2513472Y2
Authority
JP
Japan
Prior art keywords
section
ball
monitor
semiconductor chip
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1991005074U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0497341U (enrdf_load_stackoverflow
Inventor
勉 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1991005074U priority Critical patent/JP2513472Y2/ja
Publication of JPH0497341U publication Critical patent/JPH0497341U/ja
Application granted granted Critical
Publication of JP2513472Y2 publication Critical patent/JP2513472Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP1991005074U 1991-01-17 1991-01-17 ワイヤ―ボンディング装置 Expired - Lifetime JP2513472Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991005074U JP2513472Y2 (ja) 1991-01-17 1991-01-17 ワイヤ―ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991005074U JP2513472Y2 (ja) 1991-01-17 1991-01-17 ワイヤ―ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0497341U JPH0497341U (enrdf_load_stackoverflow) 1992-08-24
JP2513472Y2 true JP2513472Y2 (ja) 1996-10-09

Family

ID=31735348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991005074U Expired - Lifetime JP2513472Y2 (ja) 1991-01-17 1991-01-17 ワイヤ―ボンディング装置

Country Status (1)

Country Link
JP (1) JP2513472Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0497341U (enrdf_load_stackoverflow) 1992-08-24

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