JP2511973Y2 - Wafer adhesive baking device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a wafer adhesive for efficiently baking an adhesive applied to a wafer when the wafer is continuously stuck to a sticking plate. The present invention relates to a baking device.

[0002]

2. Description of the Related Art In order to finish the surfaces of semiconductor wafers and other wafers to a very high degree of flatness, the wafer is attached to an attachment plate (mount plate) with an adhesive, and the attachment plate is set on a polishing machine. However, wax is used as the adhesive used for the above-mentioned pasting, and this wax is diluted with a solvent to a liquid state and evenly applied to the wafer surface, after which the solvent is evaporated. The wafer is attached to the attaching plate after the adhesive action is achieved.

In the conventional wafer sticking work, from the step of applying the liquid adhesive to the wafer to the step of sticking the wafer on the sticking plate with the adhesive-coated surface of the wafer facing downward. A heating source such as an infrared lamp is provided between the two to irradiate the moving wafer with radiation emitted from the heating source to evaporate the solvent. However, such irradiation during moving is extremely short. It can only emit synchrotron light for a period of time,
In some cases, a sufficient evaporation effect could not be obtained. Further, if the irradiation of the synchrotron radiation is uneven or the thermal conductivity of the wafer is partially different, evaporation of the solvent becomes uneven, and fine irregularities are formed on the adhesive layer. When the wafer was adhered to the sticking plate and polished, the unevenness might appear on the surface of the wafer.

[0004]

DISCLOSURE OF THE INVENTION In the present invention, in the wafer attaching step, the solvent in the adhesive applied to the wafer is uniformly evaporated so that the adhesive layer is not uneven.
An object of the present invention is to provide a wafer adhesive baking device capable of baking the wafer adhesive.

[0005]

According to the present invention, a small elastic support projection having heat resistance and an anti-slip action is formed on the upper surface of a rotatably provided support plate, and a wafer is mounted on the support projection. A wafer adhesive baking device is provided, which is characterized in that it is arranged to rotate under a heater.
The above object is achieved.

[0006]

A wafer coated with an adhesive such as wax diluted with a solvent by a spin coater is placed on the supporting projections of the supporting plate of the above-mentioned baking apparatus of the present invention before being stuck on the sticking plate. It is placed under a heater such as a halogen lamp by rotating the support plate. As a result, the radiated light of the heater is evenly applied to the entire surface of the wafer and the portion supporting the wafer is a small protrusion, so that the heat conduction is small and the heat distribution of the entire wafer is small. Are kept substantially uniform, a temperature difference is not generated, the solvent is evaporated uniformly over the entire surface of the wafer, and an adhesive layer having a uniform thickness is formed.

[0007]

EXAMPLES Examples will be described below. 1 and 2 are schematic explanatory views of a wafer sticking device in which the baking device of the present invention is used. The device includes a supply part (2) for supplying a wafer (1), Spin coat part (3) for applying an adhesive such as wax diluted in a solvent to the wafer (1)
And a baking section (4) for evaporating the solvent from the adhesive
A reversing chuck part (6) for reversing the wafer (1) coated with the adhesive and transferring it to the sticking plate (5), and a sticking part (7) for sticking the wafer to the sticking plate (5). ), And a transfer rail (9) having three wafer mounting parts (8) for sequentially transferring the wafer from the supply part (2) to the reverse chuck part (6). Are reciprocally movable in the horizontal direction.

When the wafer on the carrier rail (9) is carried to the spin coat section (3), it is held by a spin chuck and lifted from the rail (9) to rise. At the position, the adhesive diluted with the solvent is spin-coated and then placed on the above-mentioned transport rail (9).

The wafer (1) coated with the adhesive carried from the spin coat part (3) to the baking part (4) by the carrying rail (9) is shown in FIG. Like
It is processed by the King device (10). In the figure, the support plate (11)
Is rotated by a motor (12), and a frame (13) holding the motor (12) is a cylinder mechanism (1) such as an air cylinder.
It can be moved up and down by 4). On the upper surface of the support plate (11), there are provided small elastic support projections (15) having heat resistance and anti-slip action. In the figure, the support protrusions (15) are made of a silicone rubber material, but other suitable heat resistant rubber materials can be preferably used.
It may be formed in a columnar shape with a small diameter of about several mm, and the amount of protrusion from the support plate (11) may be about 1 to 5 mm, preferably about 2 to 3 mm, and the number is three in the figure. However, more may be provided.

Above the support plate (11), a heater (16) for heating the adhesive application surface is provided. Although various heat sources can be used for the heater (16), it is preferable to use a halogen lamp as shown in the figure. According to the halogen lamp, the heating is performed only for a short time required for heating. -Only the c-face can be heated to a high temperature in a short time.

In the baking device (10), the wafer (1) on the transfer rail (9) is mounted on the cylinder mechanism (1).
It is placed on the support projections (15) of the support plate (11) which is raised by 4) and rises from the rail (9). After that, below the heater (halogen lamp) (16), the motor (12)
Spins for about 10 seconds to evaporate the solvent in the adhesive. After the rotation is stopped, the support plate (11) is lowered by the cylinder mechanism (14), and the wafer (1) is placed on the rail (9). In the figure, the above
One king device (10) is provided between the spin coat part (3) and the reversing chuck part (6). However, if the evaporation effect is insufficient with one device, several baking devices are required. It can also be provided.

In the reversing chuck part (6), the back surface of the wafer (1) is suction-held from the carrying rail (9) and the wafer (1) is reversed on the sticking plate (5). Transfer. The wafer (1) placed on the attaching plate (5) is pressed by the stamp means (17). At this time, it is preferable to perform it in a vacuum atmosphere so that air bubbles are not mixed between the wafer and the sticking plate. In the figure, the wafers are attached to the attaching plate one by one, but several wafers may be attached to one attaching plate while determining the attaching positions. .

The sticking plate (5) is carried to and carried out from the sticking part (7) by a transfer means (18) such as a robot. As shown in FIG. 2, the sticking plate (5) and its pre-stage part are shown. (1
9), the latter part (20) is heated to an appropriate temperature for facilitating the adhesion, and by cooling in the last part (21), the adhesive is completely solidified to attach the wafer. It is glued to the board.

[0014]

The present invention is constructed as described above, and in the baking portion, elastic support projections having heat resistance and anti-slip action are provided on the support plate, and are mounted on the support projections. Since the ha is rotated, even if the wafer is moved up and down below the heater, the vibration is not absorbed by the supporting projections and the wafer does not drop or shift from the supporting projections. The wafer rotates in a stable state by the support protrusions,
The radiation from the heater is evenly applied to the wafer surface,
In addition, since the heat that escapes to the support plate through the support protrusions is small, a temperature difference does not occur on the wafer surface, and an adhesive layer having a uniform thickness can be formed.
A wafer having high flatness can be obtained when polished.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of a wafer sticking device using a baking device of the present invention.

FIG. 2 is a plan view of the device shown in FIG.

FIG. 3 is a front view of a baking device.

[Explanation of symbols]

 1 Wafer 10 Baking Device 11 Support Plate 15 Support Protrusion 16 Heater

Claims (2)

(57) [Scope of utility model registration request] 1. A baking apparatus in which a wafer coated with an adhesive diluted with a solvent is heated to evaporate the solvent, and the upper surface of a rotatably provided support plate has heat resistance and slipperiness. An elastic support projection having a stopping action is formed, a wafer is placed on the support projection, and the support projection is rotated below the heater. King device. 2. The wafer adhesive baking device according to claim 1, wherein the support protrusion is made of a silicone rubber material, and the heater is made of a halogen lamp.