JP2511973Y2 - Wafer adhesive baking device - Google Patents
Wafer adhesive baking deviceInfo
- Publication number
- JP2511973Y2 JP2511973Y2 JP7368693U JP7368693U JP2511973Y2 JP 2511973 Y2 JP2511973 Y2 JP 2511973Y2 JP 7368693 U JP7368693 U JP 7368693U JP 7368693 U JP7368693 U JP 7368693U JP 2511973 Y2 JP2511973 Y2 JP 2511973Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adhesive
- solvent
- plate
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【0001】[0001]
【産業上の利用分野】本考案は、ウエ−ハを貼付板に連
続的に貼付ける際に、該ウエ−ハに塗布した接着剤を効
率よくベ−キングできるようにしたウエ−ハ接着剤のベ
−キング装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a wafer adhesive for efficiently baking an adhesive applied to a wafer when the wafer is continuously stuck to a sticking plate. The present invention relates to a baking device.
【0002】[0002]
【従来の技術】半導体ウエ−ハその他のウエ−ハの表面
をきわめて高い平坦度に仕上げるため、ウエ−ハを接着
剤で貼付板(マウント板)に貼付け、該貼付板を研磨機
にセットして研磨処理しているが、上記貼付に使用する
接着剤はワックス等が用いられ、このワックスを溶剤に
希釈して液体状にした状態でウエ−ハ面に均一に塗布
し、その後溶剤を蒸発させて接着作用を奏するようにし
てから該ウエ−ハを貼付板に貼付けるようになってい
る。2. Description of the Related Art In order to finish the surfaces of semiconductor wafers and other wafers to a very high degree of flatness, the wafer is attached to an attachment plate (mount plate) with an adhesive, and the attachment plate is set on a polishing machine. However, wax is used as the adhesive used for the above-mentioned pasting, and this wax is diluted with a solvent to a liquid state and evenly applied to the wafer surface, after which the solvent is evaporated. The wafer is attached to the attaching plate after the adhesive action is achieved.
【0003】従来のウエ−ハ貼付作業においては、ウエ
−ハに上記液体状の接着剤を塗布する工程の後から該ウ
エ−ハの接着剤塗布面を下向きにして貼付板に貼付ける
工程までの間に赤外線ランプ等の加熱源を設け、該加熱
源からの放射光を移動中のウエ−ハに照射して溶剤を蒸
発させるようにしているが、このような移動中の照射で
はきわめて短時間しか放射光を照射することができず、
充分な蒸発効果は得られないことがあった。また、上記
放射光の照射が不均一であったり、ウエ−ハの熱伝導度
が部分的に相違するようになっていたりすると、溶剤の
蒸発がむらになり、接着剤層に微細な凹凸を生じ、貼付
板にウエ−ハを貼付けて研磨した際にウエ−ハ表面に凹
凸が表われる原因となることがあった。In the conventional wafer sticking work, from the step of applying the liquid adhesive to the wafer to the step of sticking the wafer on the sticking plate with the adhesive-coated surface of the wafer facing downward. A heating source such as an infrared lamp is provided between the two to irradiate the moving wafer with radiation emitted from the heating source to evaporate the solvent. However, such irradiation during moving is extremely short. It can only emit synchrotron light for a period of time,
In some cases, a sufficient evaporation effect could not be obtained. Further, if the irradiation of the synchrotron radiation is uneven or the thermal conductivity of the wafer is partially different, evaporation of the solvent becomes uneven, and fine irregularities are formed on the adhesive layer. When the wafer was adhered to the sticking plate and polished, the unevenness might appear on the surface of the wafer.
【0004】[0004]
【考案の解決課題】本考案は、上記のようなウエ−ハ貼
付工程において、ウエ−ハに塗布した接着剤中の溶剤を
均一に蒸発させ接着剤層にむらを生じないようにウエ−
ハ接着剤をベ−キングできるようにしたウエ−ハ接着剤
のベ−キング装置を提供することを目的とする。DISCLOSURE OF THE INVENTION In the present invention, in the wafer attaching step, the solvent in the adhesive applied to the wafer is uniformly evaporated so that the adhesive layer is not uneven.
An object of the present invention is to provide a wafer adhesive baking device capable of baking the wafer adhesive.
【0005】[0005]
【課題解決の手段】本考案によれば、回転可能に設けた
支持板の上面に耐熱性とすべり止め作用を有する有弾性
の小さな支持突起を形成し、該支持突起上にウエ−ハを
載置しヒ−タ−の下方で回転させるようにしたことを特
徴とするウエ−ハ接着剤のベ−キング装置が提供され、
上記目的が達成される。According to the present invention, a small elastic support projection having heat resistance and an anti-slip action is formed on the upper surface of a rotatably provided support plate, and a wafer is mounted on the support projection. A wafer adhesive baking device is provided, which is characterized in that it is arranged to rotate under a heater.
The above object is achieved.
【0006】[0006]
【作用】溶剤により希釈したワックス等の接着剤をスピ
ンコ−タ等により塗布したウエ−ハは、貼付板に貼付け
られる前に、本考案の上記ベ−キング装置の支持板の支
持突起上に載置され、該支持板を回転することによって
ハロゲンランプ等のヒ−タ−の下方で回転される。その
結果、ヒ−タ−の放射光はウエ−ハの全面に均一に照射
されると共に上記ウエ−ハを支持する部分が小突起であ
るため、熱伝導が少く、ウエ−ハ全体の熱分布はほぼ均
一に保たれ、温度差を生ぜず、溶剤はウエ−ハ全面にわ
たって均一に蒸発し、一様な厚さの接着剤層が形成され
る。A wafer coated with an adhesive such as wax diluted with a solvent by a spin coater is placed on the supporting projections of the supporting plate of the above-mentioned baking apparatus of the present invention before being stuck on the sticking plate. It is placed under a heater such as a halogen lamp by rotating the support plate. As a result, the radiated light of the heater is evenly applied to the entire surface of the wafer and the portion supporting the wafer is a small protrusion, so that the heat conduction is small and the heat distribution of the entire wafer is small. Are kept substantially uniform, a temperature difference is not generated, the solvent is evaporated uniformly over the entire surface of the wafer, and an adhesive layer having a uniform thickness is formed.
【0007】[0007]
【実施例】以下実施例と共に説明する。図1,図2は本
考案のベ−キング装置が使用されるウエ−ハ貼付装置の
概略的説明図を示し、該装置は、ウエ−ハ(1)を供給
する供給部(2)と、該ウエ−ハ(1)に溶剤に希釈し
たワックス等の接着剤を塗布するスピンコ−ト部(3)
と、該接着剤から溶剤を蒸発させるベ−キング部(4)
と、接着剤を塗布したウエ−ハ(1)を反転して貼付板
(5)に移送する反転チャック部(6)と、貼付板
(5)へ上記ウエ−ハを貼付ける貼付部(7)を一連に
具備し、上記供給部(2)から反転チャック部(6)へ
順次ウエ−ハを搬送するよう3ヶ所のウエ−ハ載置部
(8)を有する搬送レ−ル(9)が水平方向に往復動可
能に設けられている。EXAMPLES Examples will be described below. 1 and 2 are schematic explanatory views of a wafer sticking device in which the baking device of the present invention is used. The device includes a supply part (2) for supplying a wafer (1), Spin coat part (3) for applying an adhesive such as wax diluted in a solvent to the wafer (1)
And a baking section (4) for evaporating the solvent from the adhesive
A reversing chuck part (6) for reversing the wafer (1) coated with the adhesive and transferring it to the sticking plate (5), and a sticking part (7) for sticking the wafer to the sticking plate (5). ), And a transfer rail (9) having three wafer mounting parts (8) for sequentially transferring the wafer from the supply part (2) to the reverse chuck part (6). Are reciprocally movable in the horizontal direction.
【0008】上記搬送レ−ル(9)上のウエ−ハは、上
記スピンコ−ト部(3)へ運ばれた際、スピンチャック
に保持されて該レ−ル(9)から上昇し、上昇位置にお
いて溶剤に希釈した接着剤がスピンコ−トされ、その後
上記搬送レ−ル(9)上に載置される。When the wafer on the carrier rail (9) is carried to the spin coat section (3), it is held by a spin chuck and lifted from the rail (9) to rise. At the position, the adhesive diluted with the solvent is spin-coated and then placed on the above-mentioned transport rail (9).
【0009】上記スピンコ−ト部(3)から搬送レ−ル
(9)によりベ−キング部(4)へ運ばれた接着剤が塗
布された上記ウエ−ハ(1)は、図3に示すようなベ−
キング装置(10)で処理される。図において、支持板(11)
はモ−タ−(12)により回転され、該モ−タ−(12)を保持
するフレ−ム(13)は、エアシリンダ等のシリンダ機構(1
4)により上下動可能に設けられている。該支持板(11)の
上面には、耐熱性とすべり止め作用を有する有弾性の小
さな支持突起(15)を設けてある。図においては、該支持
突起(15)はシリコンゴム材料で構成してあるが、その他
の適宜の耐熱性ゴム材料を好適に使用することができ、
数mm程度の小径の柱状に形成され、上記支持板(11)から
の突出量は約1〜5mm、好ましくは約2〜3mm程度とす
るとよく、またその数は図においては3個設けてある
が、さらに多く設けるようにしてもよい。The wafer (1) coated with the adhesive carried from the spin coat part (3) to the baking part (4) by the carrying rail (9) is shown in FIG. Like
It is processed by the King device (10). In the figure, the support plate (11)
Is rotated by a motor (12), and a frame (13) holding the motor (12) is a cylinder mechanism (1) such as an air cylinder.
It can be moved up and down by 4). On the upper surface of the support plate (11), there are provided small elastic support projections (15) having heat resistance and anti-slip action. In the figure, the support protrusions (15) are made of a silicone rubber material, but other suitable heat resistant rubber materials can be preferably used.
It may be formed in a columnar shape with a small diameter of about several mm, and the amount of protrusion from the support plate (11) may be about 1 to 5 mm, preferably about 2 to 3 mm, and the number is three in the figure. However, more may be provided.
【0010】上記支持板(11)の上方には、接着剤塗布面
を加熱するためのヒ−タ−(16)を設けてある。該ヒ−タ
−(16)は、種々の加熱源を用いることができるが、好ま
しくは図に示すようにハロゲンランプを使用するとよ
く、該ハロゲンランプによれば、加熱に必要な短時間だ
けウエ−ハ面のみを短時間に高温にすることができる。Above the support plate (11), a heater (16) for heating the adhesive application surface is provided. Although various heat sources can be used for the heater (16), it is preferable to use a halogen lamp as shown in the figure. According to the halogen lamp, the heating is performed only for a short time required for heating. -Only the c-face can be heated to a high temperature in a short time.
【0011】上記ベ−キング装置(10)において、搬送レ
−ル(9)上のウエ−ハ(1)は、上記シリンダ機構(1
4)によって上昇する支持板(11)の支持突起(15)上に載置
され、レ−ル(9)から上昇する。その後、上記ヒ−タ
−(ハロゲンランプ)(16)の下方で、上記モ−タ−(12)
により約10数秒間回転し、接着剤中の溶剤を蒸発す
る。回転停止後、上記シリンダ機構(14)により上記支持
板(11)は降下し、上記ウエ−ハ(1)は上記レ−ル
(9)上に載置される。なお、図においては、上記ベ−
キング装置(10)はスピンコ−ト部(3)と反転チャック
部(6)の間に1台設けてあるが、1台の装置では蒸発
作用が不充分なときには数台のベ−キング装置を設ける
こともできる。In the baking device (10), the wafer (1) on the transfer rail (9) is mounted on the cylinder mechanism (1).
It is placed on the support projections (15) of the support plate (11) which is raised by 4) and rises from the rail (9). After that, below the heater (halogen lamp) (16), the motor (12)
Spins for about 10 seconds to evaporate the solvent in the adhesive. After the rotation is stopped, the support plate (11) is lowered by the cylinder mechanism (14), and the wafer (1) is placed on the rail (9). In the figure, the above
One king device (10) is provided between the spin coat part (3) and the reversing chuck part (6). However, if the evaporation effect is insufficient with one device, several baking devices are required. It can also be provided.
【0012】上記反転チャック部(6)では、上記搬送
レ−ル(9)からウエ−ハ(1)の裏面を吸着保持して
貼付板(5)にウエ−ハ(1)を反転して移送する。該
貼付板(5)上に載置されたウエ−ハ(1)はスタンプ
手段(17)で押圧される。この際、ウエ−ハと貼付板間に
気泡を混入させないよう好ましくは真空雰囲気中で行う
ようにするとよい。なお、図においては、貼付板にウエ
−ハを1枚づつ貼付けるようにしてあるが、数枚のウエ
−ハを1枚の貼付板に貼付位置を割出しながら貼付ける
ようにしてもよい。In the reversing chuck part (6), the back surface of the wafer (1) is suction-held from the carrying rail (9) and the wafer (1) is reversed on the sticking plate (5). Transfer. The wafer (1) placed on the attaching plate (5) is pressed by the stamp means (17). At this time, it is preferable to perform it in a vacuum atmosphere so that air bubbles are not mixed between the wafer and the sticking plate. In the figure, the wafers are attached to the attaching plate one by one, but several wafers may be attached to one attaching plate while determining the attaching positions. .
【0013】上記貼付板(5)は、上記貼付部(7)に
ロボット等の移送手段(18)で運ばれ、かつ運び出される
が、図2に示すように貼付板(5)及びその前段部(1
9)、後段部(20)において、接着を容易にするように適宜
の温度に加熱されており、最終段(21)において冷却する
ことにより上記接着剤を完全に固化してウエ−ハを貼付
板に接着するようにしてある。The sticking plate (5) is carried to and carried out from the sticking part (7) by a transfer means (18) such as a robot. As shown in FIG. 2, the sticking plate (5) and its pre-stage part are shown. (1
9), the latter part (20) is heated to an appropriate temperature for facilitating the adhesion, and by cooling in the last part (21), the adhesive is completely solidified to attach the wafer. It is glued to the board.
【0014】[0014]
【考案の効果】本考案は上記のように構成され、ベ−キ
ング部において支持板上に耐熱性とすべり止め作用を有
する有弾性の支持突起を設け、該支持突起に載置してウ
エ−ハを回転するようにしたから、ヒ−タ−の下方で上
下動させてもその振動が上記支持突起に吸収されてウエ
−ハが支持突起から落下したり、ずれたりすることがな
く、該ウエ−ハは支持突起によって安定状態で回転し、
ヒ−タ−からの放射光はウエ−ハ面に均等に照射され、
また上記支持突起を伝わって支持板へ逃げる熱は少ない
ので上記ウエ−ハ面に温度差を生じることがなく、均質
な厚さの接着剤層を形成することができ、したがって、
研磨した際に高い平坦度を有するウエ−ハが得られるも
のである。The present invention is constructed as described above, and in the baking portion, elastic support projections having heat resistance and anti-slip action are provided on the support plate, and are mounted on the support projections. Since the ha is rotated, even if the wafer is moved up and down below the heater, the vibration is not absorbed by the supporting projections and the wafer does not drop or shift from the supporting projections. The wafer rotates in a stable state by the support protrusions,
The radiation from the heater is evenly applied to the wafer surface,
In addition, since the heat that escapes to the support plate through the support protrusions is small, a temperature difference does not occur on the wafer surface, and an adhesive layer having a uniform thickness can be formed.
A wafer having high flatness can be obtained when polished.
【図1】本考案のベ−キング装置を使用したウエ−ハ貼
付装置の概略的説明図。FIG. 1 is a schematic explanatory view of a wafer sticking device using a baking device of the present invention.
【図2】図1に示す装置の平面図。FIG. 2 is a plan view of the device shown in FIG.
【図3】ベ−キング装置の正面図。FIG. 3 is a front view of a baking device.
1 ウエ−ハ 10 ベ−キング装置 11 支持板 15 支持突起 16 ヒ−タ− 1 Wafer 10 Baking Device 11 Support Plate 15 Support Protrusion 16 Heater
Claims (2)
ウエ−ハを加熱し、溶剤を蒸発させるようにしたベ−キ
ング装置において、回転可能に設けた支持板の上面に耐
熱性とすべり止め作用を有する有弾性の支持突起を形成
し、該支持突起上にウエ−ハを載置しヒ−タ−の下方で
回転させるようにしたことを特徴とするウエ−ハ接着剤
のベ−キング装置。1. A baking apparatus in which a wafer coated with an adhesive diluted with a solvent is heated to evaporate the solvent, and the upper surface of a rotatably provided support plate has heat resistance and slipperiness. An elastic support projection having a stopping action is formed, a wafer is placed on the support projection, and the support projection is rotated below the heater. King device.
され、上記ヒ−タ−はハロゲンランプで構成されている
請求項1に記載のウエ−ハ接着剤のベ−キング装置。2. The wafer adhesive baking device according to claim 1, wherein the support protrusion is made of a silicone rubber material, and the heater is made of a halogen lamp.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7368693U JP2511973Y2 (en) | 1993-12-27 | 1993-12-27 | Wafer adhesive baking device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7368693U JP2511973Y2 (en) | 1993-12-27 | 1993-12-27 | Wafer adhesive baking device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0742132U JPH0742132U (en) | 1995-07-21 |
JP2511973Y2 true JP2511973Y2 (en) | 1996-09-25 |
Family
ID=13525350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7368693U Expired - Lifetime JP2511973Y2 (en) | 1993-12-27 | 1993-12-27 | Wafer adhesive baking device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2511973Y2 (en) |
-
1993
- 1993-12-27 JP JP7368693U patent/JP2511973Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0742132U (en) | 1995-07-21 |
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