JP2509579Y2 - Rom内蔵集積回路装置 - Google Patents
Rom内蔵集積回路装置Info
- Publication number
- JP2509579Y2 JP2509579Y2 JP1990023289U JP2328990U JP2509579Y2 JP 2509579 Y2 JP2509579 Y2 JP 2509579Y2 JP 1990023289 U JP1990023289 U JP 1990023289U JP 2328990 U JP2328990 U JP 2328990U JP 2509579 Y2 JP2509579 Y2 JP 2509579Y2
- Authority
- JP
- Japan
- Prior art keywords
- rom
- package
- integrated circuit
- built
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012467 final product Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 241001071864 Lethrinus laticaudis Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Volatile Memory (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990023289U JP2509579Y2 (ja) | 1990-03-08 | 1990-03-08 | Rom内蔵集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990023289U JP2509579Y2 (ja) | 1990-03-08 | 1990-03-08 | Rom内蔵集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03113851U JPH03113851U (enrdf_load_stackoverflow) | 1991-11-21 |
| JP2509579Y2 true JP2509579Y2 (ja) | 1996-09-04 |
Family
ID=31526279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990023289U Expired - Lifetime JP2509579Y2 (ja) | 1990-03-08 | 1990-03-08 | Rom内蔵集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509579Y2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6278761U (enrdf_load_stackoverflow) * | 1985-11-06 | 1987-05-20 | ||
| JPS63147831U (enrdf_load_stackoverflow) * | 1987-03-18 | 1988-09-29 | ||
| JPH0186247U (enrdf_load_stackoverflow) * | 1987-11-28 | 1989-06-07 |
-
1990
- 1990-03-08 JP JP1990023289U patent/JP2509579Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03113851U (enrdf_load_stackoverflow) | 1991-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100246587B1 (ko) | 볼 그리드 어레이 반도체 팩키지 | |
| EP0095391B1 (en) | Mounting leadless chip-carriers | |
| JP2509579Y2 (ja) | Rom内蔵集積回路装置 | |
| US5440451A (en) | Memory Assembly | |
| JPH06302638A (ja) | 半導体装置 | |
| TW459315B (en) | Stack-up chip packaging | |
| US6798051B2 (en) | Connection of packaged integrated memory chips to a printed circuit board | |
| KR100338225B1 (ko) | 반도체장치 | |
| JPS6283196A (ja) | Icカ−ド | |
| JPH09223036A (ja) | エミュレータ用マイクロコンピュータユニット | |
| JP2002110889A5 (enrdf_load_stackoverflow) | ||
| CN1998078A (zh) | 集成电路芯片的单排焊垫结构 | |
| JPH03205859A (ja) | 半導体装置 | |
| JP2786047B2 (ja) | 樹脂封止型半導体装置 | |
| JPH04216653A (ja) | 半導体集積回路用パッケージおよびその実装方法 | |
| JPS6127183Y2 (enrdf_load_stackoverflow) | ||
| JPS62163351A (ja) | Icソケツト | |
| KR0142978B1 (ko) | 수직표면실장 패키지장치 | |
| KR20060079428A (ko) | 칩 온 보드 패키지용 인쇄 회로 기판 및 이를 이용한 칩온 보드 패키지 | |
| KR20000009154U (ko) | 적층이 가능한 핀 그리드 어레이 패키지 | |
| EP0069733A1 (en) | Integrated circuit package | |
| JPS60112089U (ja) | 半導体装置用ソケツト | |
| JPS59136956A (ja) | 半導体装置 | |
| JPH06196612A (ja) | 半導体チップ用パッケージ | |
| JPS60218864A (ja) | 電子部品パツケ−ジの実装方法、及び、電子部品パツケ−ジの構造 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |