JP2508525Y2 - 圧接形コンデンサ - Google Patents
圧接形コンデンサInfo
- Publication number
- JP2508525Y2 JP2508525Y2 JP1990063955U JP6395590U JP2508525Y2 JP 2508525 Y2 JP2508525 Y2 JP 2508525Y2 JP 1990063955 U JP1990063955 U JP 1990063955U JP 6395590 U JP6395590 U JP 6395590U JP 2508525 Y2 JP2508525 Y2 JP 2508525Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- core
- electrode
- pressure contact
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 57
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000012212 insulator Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013642 negative control Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063955U JP2508525Y2 (ja) | 1990-06-19 | 1990-06-19 | 圧接形コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063955U JP2508525Y2 (ja) | 1990-06-19 | 1990-06-19 | 圧接形コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0423124U JPH0423124U (enrdf_load_stackoverflow) | 1992-02-26 |
| JP2508525Y2 true JP2508525Y2 (ja) | 1996-08-28 |
Family
ID=31594468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990063955U Expired - Fee Related JP2508525Y2 (ja) | 1990-06-19 | 1990-06-19 | 圧接形コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508525Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4006824B2 (ja) * | 1998-05-12 | 2007-11-14 | 株式会社デンソー | 筒形コンデンサ装置及びその製造方法 |
| US8837166B2 (en) * | 2011-10-28 | 2014-09-16 | Hamilton Sundstrand Corporation | Vertically mounted capacitor assembly |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55149938U (enrdf_load_stackoverflow) * | 1979-04-13 | 1980-10-29 | ||
| JPS6336671Y2 (enrdf_load_stackoverflow) * | 1981-05-08 | 1988-09-28 |
-
1990
- 1990-06-19 JP JP1990063955U patent/JP2508525Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423124U (enrdf_load_stackoverflow) | 1992-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |