JP2508409Y2 - 発光表示装置 - Google Patents

発光表示装置

Info

Publication number
JP2508409Y2
JP2508409Y2 JP10656090U JP10656090U JP2508409Y2 JP 2508409 Y2 JP2508409 Y2 JP 2508409Y2 JP 10656090 U JP10656090 U JP 10656090U JP 10656090 U JP10656090 U JP 10656090U JP 2508409 Y2 JP2508409 Y2 JP 2508409Y2
Authority
JP
Japan
Prior art keywords
light emitting
wiring conductor
emitting diode
wiring
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10656090U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0463661U (enrdf_load_html_response
Inventor
明 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP10656090U priority Critical patent/JP2508409Y2/ja
Publication of JPH0463661U publication Critical patent/JPH0463661U/ja
Application granted granted Critical
Publication of JP2508409Y2 publication Critical patent/JP2508409Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP10656090U 1990-10-12 1990-10-12 発光表示装置 Expired - Lifetime JP2508409Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10656090U JP2508409Y2 (ja) 1990-10-12 1990-10-12 発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10656090U JP2508409Y2 (ja) 1990-10-12 1990-10-12 発光表示装置

Publications (2)

Publication Number Publication Date
JPH0463661U JPH0463661U (enrdf_load_html_response) 1992-05-29
JP2508409Y2 true JP2508409Y2 (ja) 1996-08-21

Family

ID=31852700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10656090U Expired - Lifetime JP2508409Y2 (ja) 1990-10-12 1990-10-12 発光表示装置

Country Status (1)

Country Link
JP (1) JP2508409Y2 (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3400958B2 (ja) * 1999-07-07 2003-04-28 株式会社シチズン電子 多色発光ダイオード
JP3798195B2 (ja) * 1999-08-12 2006-07-19 ローム株式会社 チップ型発光装置
JP4565723B2 (ja) * 2000-09-26 2010-10-20 ローム株式会社 半導体発光装置
JP4572312B2 (ja) * 2004-02-23 2010-11-04 スタンレー電気株式会社 Ｌｅｄ及びその製造方法
JP2009135484A (ja) * 2007-11-09 2009-06-18 Hitachi Chem Co Ltd 光半導体装置
JP5226829B2 (ja) * 2011-05-16 2013-07-03 シチズン電子株式会社 チップ型発光ダイオード

Also Published As

Publication number Publication date
JPH0463661U (enrdf_load_html_response) 1992-05-29

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