JP2507066Y2 - Flux diffusion prevention device in automatic soldering equipment - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux diffusion preventing device in a device for soldering a circuit element to a printed board used in various electronic devices.

[0002]

2. Description of the Related Art Conventionally, when soldering a circuit element to a printed circuit board, a preliminary work of applying flux is performed as a pretreatment for soldering. Along with covering the terminals by attaching a masking tape or the like to the particularly inconvenient terminals, that is, the edges of the printed circuit board on which many terminals are arranged,
By arranging the end edge portion on the holding portion of the transport chain, consideration is given to avoid flux adhesion as much as possible.

[0003]

However, the conventional means for preventing the adhesion of flux by using the masking tape described above is intended for all printed circuit boards, and the masking tape is peeled off after the work of attaching the masking tape and soldering. There is work, and even if it is done manually or if a dedicated device is installed inside, it requires an additional two steps, the workability is poor, and more masking tape is spent, resulting in higher costs. There was a problem. Therefore, the present invention is intended to improve the work problems, the cost, and the quality of the product when the masking tape is used to prevent the adhesion of the flux as in the above-mentioned conventional example.

[0004]

In a printed circuit board which is fed by supporting an end portion between opposite conveying belts on both sides,
One end edge of a shield plate is provided above and below an end edge portion of the printed circuit board supported by the transfer belt, and air feed nozzles are provided on the transfer belt side partitioned by the shield plate. .

[0005]

The flux is directly applied by adhering the shield plate to the upper and lower surfaces of the edge of the printed circuit board so as to isolate the portion of the printed circuit board where the terminals are provided from the space of the flux coating section and increase the internal pressure on the side of the carrier. It is possible to prevent the product from being covered with, or getting on the air current and adhering.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to an embodiment shown in the drawings. Since it is constructed symmetrically as shown in FIG. 2, the construction of the left half enlarged view in FIG. 1 will be described. A carrier band, that is, a chain in this case, is formed by a hanging edge of the support member 1 attached to the side surface of the support frame rod 3 extending in the direction of the line and one end edge of the support member 2 attached to the lower surface of the support frame rod 3. A chain guide for horizontally moving the (endless chain band) 4 is constructed, and further, a pin protruding from the lower end of the supporting member 2 via the mounting member 8 to the hanging piece 5 of the link of the chain 4 6 is fixed on the lower side, and the pin edge 7 of the printed circuit board can be received above the protrusions 6'protruding on the outer ends of many pins 6 via the brim. Board restraint plate with a lower edge 14 'corresponding to it with a certain interval 14 is attached to the side surface of the support member 1, and a shield plate 13 is provided while maintaining a certain space with respect to the restraint plate 14.
Is attached to the upper surface of the support member 1 by a screw or the like, and the seal plate 15 attached to the outer surface of the shield plate 13 has a lower end supported by the projection 6'at the tip of the pin 6 and the upper surface of the edge of the printed circuit board. For example, a material such as natural rubber or synthetic rubber that is flexible to some extent and has elasticity so as not to damage the terminals even when it comes into contact with the printed circuit board is selected. Further, a shield plate 9 whose end portion is bent obliquely upward is attached to the lower surface of the pin receiver 7, and a seal plate 10 made of the same material as the seal plate 15 is freely attached to and detached from the inside of the shield plate 9. The upper end is lightly contacted with the lower surface of the printed board at a position substantially opposite to the lower end of the seal plate 15. Further, in the above structure, the air inlet nozzles 16 and 11 are provided so as to face the space between the shield plate 13 and the printed circuit board restraining plate 14 and the space formed by the pin receiver 7 and the shield plate 9,
During operation, a constant pressure of compressed air is constantly fed. Although the lower edge 14 'of the restraining plate 14 is lightly regulated so as not to float the edge of the printed circuit board in the above description, the invention is not limited to this, and it is also possible to regulate by a roller or the like. The compressed air from the room shall be kept to some extent inside. Further, the chain 4 is adapted to turn horizontally at both ends of the support frame rod 3.

Next, a series of operations of the above configuration will be described. When the soldering work is started, the chain 4 is supported by the supporting member 2
Circulates along the outer circumference of. In this case, the chain 4 is moved between the one end edge of the support member 2 and the hooking edge of the support member 1 and moves horizontally on the inner side, that is, on the running side of the printed circuit board, and the hanging piece attached to the link of the chain 4 is moved. Pin 6 of 5
Is supported by the pin receiver 7 so that the
Of the printed circuit board A is supported by the projections 6'at the front end and the end portion of the printed circuit board A is prevented from floating.
While being held by the pin 6 in a stable state regulated by the lower edge 14 ′, the chain 4 moves to convey the inside of the fluxer from one end to the other end. In the thus-moved printed circuit board A, the seal plates 10 and 15 attached to the upper and lower shield plates 9 and 13 isolate portions of the printed wiring terminals at the ends from the flux coating atmosphere, and the flux mist ejected from the flux nozzle B is generated. The end portion of the printed circuit board, that is, the terminal portion will not be splashed. Further, even if there is a slight gap between the shield plates 9 and 13 and the printed circuit board A , compressed air is sent from the nozzles 11 and 16 to the traveling path side of the chain 4 from the shield plates 9 and 13. As a result, the pressure on the side of the chain traveling road is slightly increased, so that the air flow does not enter the end A ′ of the printed circuit board A,
As a result, the flux is completely prevented from adhering to the terminals of the printed circuit board A. As described above, the end portions A'on which the terminals of the printed circuit board A are arranged in a row are shielded from the flux coating atmosphere by the shield plates 9 and 13 and the seal plates 10 and 15, and the pressure on the chain traveling path side is slightly higher than the shield plate. By maintaining the state, it is possible to completely prevent the diffusion of flux droplets. Another embodiment as shown in FIG. 3 will be described. A supporting member (rail) made of aluminum.
1, the chain 4 is circulated horizontally, and at the lower part of the chain 4, a transfer hanger 12 having a clamp claw 17 at the lower end is equally hung down, and between the support member 1 and the lower support 7 '. The hanger 12 is supported by a guide 18 provided so as to move in a predetermined posture. On the upper side of the printed circuit board A held by the clamp claws 17 , an upper jig 15 ′ serving as a shielding plate is fixed downward from the support member 1 directly or indirectly, and is attached to the lower receiving member 7 ′. The facing shield plate 9 is appropriately attached, and a Teflon seal 10 is attached to the upper end portion of the shield plate 9 in contact with the lower surface of the printed circuit board A. Therefore, in the above configuration, since the edge of the printed circuit board A is sandwiched, the printed circuit board A
The end edge upper jig 15 ', strongly contact with a printed board A in order to keep the tip of the air-tight rigid seal 10 of the lower
The printed circuit board even if it acts to prevent the
Since A can be forcibly moved, a reliable operation is possible.

[0008]

As described above, according to the present invention, the edge portions of the printed circuit board on which the terminals are arranged are separated from the flux coating atmosphere by the upper and lower shield plates, and the shield plates prevent the flux coating atmosphere from being exposed. By keeping the air pressure in the chain running path high, the air flow from the flux coating atmosphere to the chain running path is blocked to prevent flux from adhering to the terminals of the printed circuit board. As compared with the case where the flux is prevented from adhering by the masking tape as described above, the troublesome manual work such as the work of peeling and removing the tape after the completion of the tape adhering in advance and the soldering is completely eliminated, and the workability is remarkably improved. Further, since no masking tape is required, it is economical and cost can be reduced. Further, the printed circuit board can be forcibly moved as compared with the second embodiment in which the end edge of the printed circuit board is simply mounted on the protrusion as in the first embodiment, so that the seal portion Since the adhesion can be further strengthened, it is possible to reliably prevent the flux from adhering to the terminal portion.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of a main part of the present invention.

FIG. 2 is a vertical side view of a fluxer.

FIG. 3 is a vertical sectional side view of a main part of another embodiment of FIG.

FIG. 4 is a cutaway plan view of a printed circuit board.

[Explanation of symbols]

 4 Chain 6 pin 6'Protrusion 7 Pin receiver 14 Suppression plate 9,13 Shielding plate 11,16 Air supply nozzle

Claims (1)

(57) [Scope of utility model registration request] 1. A flux made into a mist by spraying.
Through the printed circuit board to be soldered
By applying flux to the soldering surface.
In the automatic soldering device as described above, the edge support portion of the printed circuit board that is conveyed in the endless conveyance belt,
When a shielding plate is provided that contacts the upper and lower surfaces of the printed circuit board
In both cases, air is sent to the endless conveyor belt side partitioned by the shielding plate.
An inlet air nozzle is provided so that the edge of the printed circuit board is
Maintaining a higher atmospheric pressure than the flux coating atmosphere
Prevents flux mist from entering here,
Prevent flux from adhering to the edge of the printed circuit board
Flack in automatic soldering equipment characterized by
Spread prevention device.