JP2668857B2 - Flux coating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux applying apparatus in an automatic soldering process for a circuit board.

[0002]

2. Description of the Related Art There is an automatic soldering device for transferring a circuit board and passing the soldered surface of the circuit board through, for example, a solder bath in which molten solder is jetted.

[0003] The automatic soldering apparatus is provided with a flux applying apparatus for applying a flux to a soldered surface of a conveyed circuit board for the following purpose as a pretreatment for performing the soldering processing.

In general, by applying flux to the soldered surface, the oxide film formed on the soldered portion is removed, and electrical contact failure between the solder after soldering and the soldered portion is prevented.

An oxide film is prevented from being formed again before being transferred to the solder tank. Inclusion of pine or the like improves the adhesion with solder.

[0006] This is for giving a certain effect.

[0007] Conventionally, this flux coating device is arranged in parallel below the circuit board that is transported with the soldering surface facing down toward the solder bath, on the front side in the transport direction of the solder bath via a substrate preheating device. At the position where the soldered surface of the conveyed circuit board passes closely above, a jet port for jetting the flux (overflow) is provided.

Specifically, as shown in FIGS. 3 and 4, for example, a hood 7 is provided in a flux tank containing the flux 2 so as to protrude above the flux liquid level.
A jet port 3 having a width corresponding to the width of the soldered surface 1A is provided at the upper end of the hood 7, and a foam tube 8 is erected in the hood 7.

Accordingly, the flux 2 is foamed by the foaming tube 8 and jetted out of the jet port 3 to be applied in contact with the soldered surface 1A of the circuit board 1 being conveyed.

[0010]

As described above, in the conventional flux coating apparatus, as shown in FIG. 3, the side edges 1 'of the circuit board 1 are held and supported by a large number of transporting pawls 6 juxtaposed in parallel. The transport claw 6 is moved so that the soldered surface 1A is turned downward, and the flux 2 jetted from the jet port 3 is applied to the soldered surface 1A of the circuit board 1 as it passes through the transport. I have to.

Therefore, the width of the conventional jet 3 (jet width)
In order to apply evenly to the soldered surface 1A of the circuit board 1, the circuit board 1 is designed to be longer than the largest width of the circuit board 1 (soldered surface 1A) that can be transported.

For this reason, conventionally, the flux 2 which is jetted out is jetted from both ends of the jet port 3, so that even if the circuit board has the jet port width,
The flux 2 wraps around to the side edge 1 ′ of the circuit board 1 and is applied by contact, so that the flux 2 also adheres to the transport claws 6.

As shown in FIG. 4, when a circuit board 1 having a small width is conveyed, the circuit board 1 may be more severely adhered from the side edge 1 'to the upper surface side.

Since the flux 2 contains the pine cone and the like, the flux 2 also has a viscosity.
Because of or cause trouble in movement, in some cases or Okoshita the trouble in conveyance of the circuit board 1 after deviating from the transport pawl 6,
Conventionally, the flux 2 adhering to the transport claws 6 is periodically removed, which makes maintenance management very troublesome.

The present invention solves such a problem, does not cause a large amount of flux to adhere to unnecessary portions such as the side edges of the circuit board and the transport claws, and does not hinder the automatic soldering process.
It is an object of the present invention to provide a flux coating device in which maintenance is extremely reduced.

[0016]

The gist of the present invention will be described with reference to the accompanying drawings.

A flux applying apparatus in an automatic soldering process of a circuit board for applying flux 2 to a soldering surface 1A of the circuit board 1 as a pretreatment for soldering the circuit board 1 to the circuit board 1 to be transported. Soldering surface 1
A jet port 3 for jetting the flux 2 upward is provided at a position where A passes closely above, and a jet width of a predetermined length is held along the width direction of the circuit board 1 conveyed through the jet port 3. It is formed in the jet long hole, and jet guide projections 4 and 4 are provided at the left and right ends of the jet port 3 in the width direction, and the jet guide projections 4 and 4 face each other from the inside to the outside. The present invention relates to a flux applicator which is characterized in that the inclined guide surfaces 5 that incline downward are formed in a V shape so as to face each other.

Further, at least one of the guide projections 4 is slidable along the longitudinal direction of the jet port 3, and the flux 2 is jetted at a position of the jet port 3 located outside the guide projection 4. The present invention relates to a flux coating apparatus characterized in that the flux coating apparatus is not configured.

[0019]

The jet width of the flux 2 is set to a predetermined length according to the width dimension of the circuit board 1, and the jetted flux 2 is jet guide projections provided at the left and right ends of the jet port 3 in the width direction. The flux 2 is supplied to the jet port 3 by the inclined guide surfaces 5.5 inclined downward from the inside to the outside of the bodies 4.
At the end, since the jet flows while being guided inward along the inclined guide surfaces 5, the side edge 1 ′ of the circuit board 1 is formed.
Is made to pass over the upper end portions of the inclined guide surfaces 5, 5 so that the side edge 1 'of the circuit board 1 which does not need to be coated is formed.
The adhesion of the flux 2 to the transport claws 6 to be held and supported is suppressed.

Further, at least one of the guide projections 4 is slidable along the jet port 3, and a portion of the jet port 3 located outside the guide projection 4 is a flux 2.
If the circuit board 1 is configured so as not to jet, even if the circuit board 1 has a different width dimension, the gap between the jet guide members 4 is adjusted in accordance with this, so that circuit boards having different dimensions can be accommodated.

Further, fine adjustment can be made by observing the degree of adhesion of the circuit board 1 to the side edge 1 '.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present embodiment is shown in FIGS. 1 and 2. The same reference numerals are given to members equivalent to those in the conventional example, and the description thereof will be omitted.

In this embodiment, the opening width of the jet port 3 is made to substantially match the maximum width of the circuit board 1 that can be transported, and the jet guide projections 4, 4 are projected at the left and right ends of the jet port 3 in the width direction. I have set up.

An inclined guide surface 5 which is inclined downward from the inside to the outside on the opposed inner surface portions of the jet guide members 4.
・ 5 is formed to face each other in a V shape.

In this embodiment, claims 1 and 2
In the embodiment of the invention described above, one jet guide projection 4 is fixed to an end portion, and the other jet guide projection 4 is slidable from the end portion toward a predetermined range inside, and is slid. When the jet guide protrusion 4 moves inward,
The outside of the jet guide 4 is simultaneously closed by the slide plate 9.

In this embodiment, the upper edge of the jet guide 4 is inclined upward in the transport direction, and the height of the top edge is set so that the height of the rotating substrate 1 is appropriate. The transport claw guide edge 10 is configured.

The gap between the upper ends of the jet guide protrusions 4 (the upper ends of the inclined guide surfaces 5) and the degree of inclination are determined by the width of the soldering surface 1 A of the rotating substrate 1, the viscosity of the flux 2, and the like. In consideration of the flow rate of the flux 2 and the like, the edge of the soldered surface 1A, the side edge 1 ', and the transport claw 6 which do not need to be applied
As far as possible, the configuration is such that the flux 2 does not contact the jet stream.

[0028]

Since the present invention is constructed as described above, the flux is guided and regulated inward along the inclined guide surface at the end of the jet port, so that, for example, the side edge of the circuit board is inclined at the inclined guide surface. The flux can be prevented from adhering to the side edges of the circuit board that do not need to be applied or to the carrying claws that hold and support it, without impeding the automatic soldering process. It is possible to provide a flux coating device in which management is also extremely reduced.

If at least one of the guide projections is configured to be slidable along the jet port, and a portion of the jet port located outside the guide projection is configured so that the flux does not jet, the circuit board of the circuit board is formed. Even if the width dimension is different, the gap between the jet guide protrusions can be adjusted according to this, it can respond appropriately to circuit boards with different dimensions, and it is also possible to make fine adjustments by checking the degree of adhesion to the side edge of the circuit board It has an excellent effect.

[Brief description of the drawings]

FIG. 1 is a schematic configuration perspective view of the present embodiment.

FIG. 2 is a front view of a usage state of the present embodiment.

FIG. 3 is an explanatory side view of a usage state of a conventional example.

FIG. 4 is a front view of a conventional example in use.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 1A Solder surface 2 Flux 3 Jet outlet 4 Jet guide protrusion 5 Slant guide surface

 ───────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Koichi Arakawa 2-2-234 Higashizao, Nagaoka City, Niigata Prefecture Nihon Seiki Co., Ltd. 5-44371 (JP, U) Actually developed 56-15082 (JP, U)

Claims (2)

(57) [Claims] 1. A flux applicator in an automatic soldering process of a circuit board for applying flux to a soldered surface of the circuit board as a pretreatment for soldering the circuit board. At the position where the surface passes close to the upper side, a jet port for jetting the flux upward is provided, and the jet port is provided at a jet port having a jet width of a predetermined length along the width direction of the circuit board conveyed. Formed,
Jet guide projections are provided at the left and right ends of the jet port in the width direction, and inclined guide surfaces inclined downward from the inside to the outside are formed to face each other at the facing portions of the jet guide projections. A flux applicator characterized by being squeezed. 2. A structure in which at least one of the guide projections is slidable along the longitudinal direction of the jet port, so that flux is not jetted to a location of the jet port located outside the guide projection. The flux applying device according to claim 1, wherein