JPH0641926Y2 - Substrate transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an apparatus for transporting a thin plate-like substrate, and in particular,
The present invention relates to a board transfer device suitable for transferring a printed circuit board to a next step after being immersed in a solder bath.

[Prior Art] An apparatus for immersing a printed circuit board in a solder bath is known, and, for example, Japanese Patent Laid-Open No. 59-226167 (the title of the invention, "Substrate surface treatment apparatus") of the present applicant describes No. 7A. The apparatus shown in Figures and 7B is described. The prior application device is
Substrate holding means (3) is provided on each of four arms (2) that radially project from a rotating vertical axis (1) and that can be moved up and down.
Each substrate holding means (3) is equipped with a base (4), a clamp claw (5) and a taper slider (6), and the clamp claw (5) is depressed by pressing down the taper slider (6). Is closed to hold the printed circuit board (P).

A mounting part (A) for holding the printed circuit board (P) on the clamp claw (5) and a solder bath (7) at four positions along the locus of the holding means (3) that moves with the rotation of the shaft (1). ), Where the substrate is settled and dipped in, the detached part (C) for removing the soldered substrate from the holding means (3), the solder attached to the base (4) and the clamp claw (5). Are disposed by cleaning means such as brush rubbing, and a large number of substrates to be processed are continuously soldered.

An apparatus for transporting the printed circuit board (P) separated from the holding means (3) by the detaching section (C) in the above-mentioned apparatus to the next processing step has heretofore been actually opened by the applicant shown in FIG. Japanese Laid-Open Patent Publication No. 60-183752 (the name of the device, “substrate transfer device”) is applied. The device comprises an endless chain (9) in which a printed circuit board (P) separated from a clamp claw (5) of the holding means (3) is horizontally arranged downward by a concave curved shooter guide (8). It is guided to a position, and the lower end edge is held by a clamp (10) attached to the chain (9) at a required pitch, held in a vertical posture and conveyed, and placed on the conveyor belt (11) of the next stage. It is what makes me. The clamp (10) is closed by a cam device (not shown) so that the lower end edge of the printed circuit board (P) dropped from the shooter guide (8) abuts and the chain (9) is clamped. ) It is designed to open at the end.

[Problems to be Solved by the Invention] In the board transfer device of the above-mentioned prior application, since the lower end edge of the printed circuit board (P) is clamped by the clamp (10), the board is long. Has an inconvenience in that the holding is uncertain, and vibration occurs during the transportation by the chain (9). In particular, the wiring pattern of the substrate to be processed is formed up to a portion close to the edge of the substrate, and the clamp (1
If the area that can be clamped by (0) is small, there is a problem that the substrate may fall off the clamp (10) during transportation.

Further, if the printed circuit board (P) is dropped directly onto the conveyor belt (11) without using the holding means such as the chain and the clamp, the board jumps due to the surplus of the fall and the belt is removed from the belt. Even if the vehicle deviates or is placed on the belt, its posture is not stable, which causes inconvenience in the process of the next step.

An object of the present invention is to provide a substrate transfer device that solves the above problems.

[Means for Solving the Problem] In order to achieve the above object, the present invention is configured as follows.

Installed below the printed circuit board that is suspended and held in the vertical position in a board transfer device that transfers the printed circuit board in the solder bath after changing its posture from the vertical position to the horizontal direction. And a shooter guide having a vertical cross section formed into a concave curved shape for guiding the printed circuit board which is released from the vertical position and falls so as to incline the surface thereof, and is horizontally arranged below the shooter guide. When the lower edge of the printed circuit board is in contact with the lower edge of the printed circuit board, the lower edge of the printed circuit board is driven so as to move in a direction to increase the inclination angle of the printed circuit board. A breathable endless belt having a large number of protrusions for stopping, and the upper and lower regions of the endless belt where the printed circuit board is placed and conveyed. Are arranged, a substrate transfer apparatus and a blowing fan for blowing air toward the printed circuit board on the endless belt.

[Operation] The printed circuit board, which has been dipped in the solder bath and then dropped along the shooter guide having a concave curved vertical section, has a lower end edge formed by a protrusion protruding from an endless belt having air permeability. Is stopped, the lower edge contacts the belt surface, and
Stop with the upper edge supported by the shooter guide,
Then, with the movement of the endless belt, the endless belt is gently placed horizontally on the belt surface and conveyed toward the next step.
At this time, the printed circuit board is supported by the tips of a large number of protrusions provided on the belt surface, and since the surfaces do not directly contact the belt surface, there is no risk of scratches on the board surface.
In addition, air blowers are arranged on both upper and lower sides of the area where the printed circuit board is placed and conveyed on the endless belt, and air is blown toward the printed circuit board on the endless belt. The solder layer is rapidly cooled, completely solidified, and sent to the next step.

[Embodiment] FIG. 1 is a side view showing a schematic configuration of a first embodiment device of the present invention, and FIG. 2 is a perspective view showing a main part of the device.

In FIG. 1, the arm (2), the holding means (3), the base (4), the clamp claw (5), and the taper slider (6) are those of the device shown in FIG. 7, and the board (P).
Shows the state of having moved to the position of (C) in FIG. 7A, that is, the detached part after finishing the immersion treatment in the solder bath (7).

A shooter guide (12) having a concave curved cross section is fixedly installed below the detached portion. As shown in FIG. 2, this is formed by connecting a plurality of curved wires in the vertical direction in parallel.

Below the shooter guide (12), a pair of drive rollers (13) and (14) horizontally mounts a conveyor belt (15), which is driven by a drive device (not shown) in the direction of arrow (a). In this embodiment, as shown in FIGS. 2 and 3, the conveyor belt (15) is in the form of a flat belt provided with a large number of through holes (16) and has a large number of protrusions (17) provided upright on the outer surface thereof. Has been applied.

These protrusions (17) are arranged in the width direction of the conveyor belt (15) so that the lower end edges of the printed circuit board (P) dropped along the shooter guide (12) are locked to the protrusions (17). The belts (15) are arranged in rows and arranged at a required pitch also in the length direction of the belt (15).

A fan (18) that blows air toward the surface of the printed circuit board (P) passing through the front and rear sides of the shooter guide (12).
(19) is arranged, and fans (20) (21) for blowing air toward the surface of the substrate are also arranged above and below the surface of the conveyor belt (15) on which the substrate is placed and conveyed. is there.

Further, the photoelectric device (22) is arranged near the upper end of the shooter guide (12). This photoelectric device (22) is composed of a light emitter and a light receiver, and the printed circuit board (P) held by the holding means (3) descends together with the holding means (3), and the lower end thereof is from the light emitter. When reaching the optical path, the reflected light from the substrate surface is detected by the light receiver, and the taper slider (6) of the holding means (3) is operated by the detection signal to open the clamp claw (5), and the printed circuit board. (P)
Is released from the holding means (3) and dropped.

The operation of the apparatus of the above-described embodiment is as follows.

The holding means that holds the printed circuit board (P) that has been subjected to the solder immersion treatment and that has rotated to the removal section (C) is indicated by the arrow (b).
And the lower end of the printed circuit board (P) is detected by the photoelectric device (22), the clamp claws (5) are opened as described above, and the printed circuit board (P) is moved to the shooter guide (P). 12), fall to the position where the lower edge contacts the upper surface of the conveyor belt (15), and the belt (15)
The lower edge is locked to one of the rows of the protrusions (17) arranged in the width direction of the, and the upper edge is supported by the shooter guide (12) in such a posture that the conveyor belt (15) moves. As a result, it is gently placed on the belt surface.
During this time, the blown air from the fans (18) and (19) cools the solder layer adhering to the surface of the substrate to accelerate its solidification.

Printed circuit board (P) placed on the conveyor belt (15)
Is supported by a large number of protrusions (17) in a state of being floated from the belt surface, only the apex of a small area of each protrusion (17) is in contact with the substrate surface, and is placed on the belt surface as described above. By the time the cooling air is blown, at least the surface portion of the solder layer is solidified, so that the printed circuit board (P)
There is no danger of scratches on the solder layer formed on the circuit pattern.

Next, in the course of conveyance by the conveyor belt (15), the solder layers are further cooled by the air blown by the fans (20) (21) arranged on the upper and lower sides of the belt (15) to be completely solidified and sent to the next step.

The above description is based on the embodiments shown in both the first and second drawings.
The present invention is not limited to the above description, and various modifications and applications are possible.

For example, as the shooter guide (12), in the above embodiment, curved wires are connected in parallel,
This may be formed by stacking thin plates each having a desired concave curved outer edge and stacking them at appropriate intervals.

Further, as the conveyor belt (15), the conveyor belt (15) shown in FIGS.
The fan (20) having air permeability and arranged above and below is not limited to the configuration in which the through hole (16) is provided in the illustrated flat belt.
It is sufficient that the solder layer on the surface of the printed circuit board (P) can be rapidly cooled by the blown air from (21). For example, the wire mesh belt shown in FIGS. 4 to 6 may be used.

FIG. 4 shows a belt formed by braiding a wire (23) in a mesh shape, and a protrusion (24) is provided on a plate (25) which is appropriately engaged with the mesh wire.

In FIG. 5, a> -shaped notch is provided in the center of a plate (26) that is engaged with a wire mesh belt having the same structure, and that portion is bent upward in a triangle to form a protrusion (27).

FIG. 6 shows a wire mesh belt having a similar structure, in which a part of the wire is bent upward without using the plate (25) or (26) as in the previous two examples, and the protrusion (28) is formed. It was done.

The conveyor belt composed of these wire meshes has a third
Since the area of the through holes is larger than that of the flat belt shown in the figure with through holes, the fan (2
There is an advantage that the cooling effect by 1) is high.

[Effects of the Invention] (1) A conveyor belt for a printed circuit board is composed of a breathable endless belt, and the upper and lower sides of this endless belt are immersed in a solder bath to form high-temperature solder layers on both front and back surfaces. Since the blowing fan for blowing air to the attached printed circuit board is arranged, the solder layer on the surface of the printed circuit board can be rapidly cooled in the carrying process and can be sent to the next step in a completely solidified state.

(2) As compared with a conventional device that holds the lower end edge of the printed circuit board and erects the printed circuit board, a stable transfer state can be obtained even with a large-sized board. In particular, this is advantageous in the case of a printed circuit board in which the circuit pattern portion is formed up to the vicinity of the edge portion and the margin for holding is narrow.

(3) The printed circuit board can be reliably transported regardless of changes in its width, length, or thickness.

(4) In the conventional device, when the printed circuit board is distorted such as bending or bending, it cannot be surely mounted in the groove of the clamp. However, the device of the present invention can stably convey the distorted printed circuit board.

(5) In the conventional device, foreign matter such as dust accumulates in the groove of the clamp, and it takes time to remove and clean it, resulting in a decrease in operating rate. Since a belt belt is used, maintenance is easy.

[Brief description of drawings]

FIG. 1 is a side view showing the construction of an apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing the main parts of the apparatus, and FIGS. 3 to 6 are perspective views showing an example of a conveyor belt. FIG. 7A is a plan view showing an outline of a printed circuit board surface treatment apparatus to which the present invention is applied, FIG. 7B is an elevation view of the same, and FIG. 8 is a side view showing a conventional transfer apparatus. (P) ... Printed circuit board, (1) ... Vertical axis, (2) ... Arm, (3) ... Holding means, (4) ... Base, (5) ... Clamping claw, (6) …… Taper slider, (7) …… Solder tank, (8) …… Shooter guide, (9) …… Conveyor belt, (10) …… Clamp, (11) …… Conveyor belt, (12) …… Shooter Guide, (13) (14) …… Drive roller, (15) …… Conveyor belt, (16) …… Through hole, (17) …… Protrusion, (18) to (21) …… Huan, (22) …… Photoelectric device.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location B65H 29/52 9147-3F H05K 3/34 M 7128-4E 13/02 U 8509-4E

Claims (1)

[Scope of utility model registration request] 1. A printed circuit board after being immersed in a solder bath, in which the posture of the printed circuit board is changed from a vertical position to a horizontal direction, and the printed circuit board is suspended and held in a vertical position. A shooter guide, which is installed below the board and guides the printed circuit board that is released from the vertical position and falls to be inclined so that the surface thereof is slightly inclined, and a shooter guide having a vertical cross section formed in a concave curve shape, and a lower part of the shooter guide. When the printed circuit board is in a falling state, it is driven so as to move in a direction to increase its inclination angle when the lower edge of the printed circuit board comes into contact with the lower edge of the printed circuit board, and the printed circuit board falls on the outer peripheral surface. And a printed circuit board in the endless belt is placed and conveyed. It is arranged above and below the region, substrate transfer apparatus and a blowing fan for blowing air toward the printed circuit board on the endless belt.