JP3220832B2 - Printed wiring board loading machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for performing various processes such as plating and washing on a printed circuit board and arranging the same in a line for continuously manufacturing printed circuit boards. The present invention relates to a loading machine for continuously loading a printed wiring board.

[0002]

2. Description of the Related Art In order to form a printed wiring board by performing various processes such as plating on the printed wiring board, the printed wiring board is continuously placed in various devices such as a plating device, a washing device, and a drying device. Must be supplied to These various devices are often configured alone,
In order to arrange many types of these and form one line, a device for bridging between each device is naturally required. A part of this bridging work is the input machine to which the present invention is applied.

[0003] The loading machine has an important function of loading a printed wiring board to be a printed wiring board one by one on a transport path connected to the next process. Some have been proposed and used.

For example, Japanese Patent Application Laid-Open No. Sho 58-188241 discloses that, as shown in FIG. There has been proposed a plate material carrier having a drive chain for displacing and moving in a horizontal state and a guide device (hereinafter referred to as prior art 1).

As shown in FIG. 6, Japanese Utility Model Laid-Open No. 57-62732 discloses a device for gripping only one of the uppermost sheets of a laminated thin plate, which is supported by a column and is vertically moved. And an arm capable of horizontal movement, a sliding inclined surface which is rotatably supported on the arm via a pivot, and has opposed inner surfaces extending downward, and a terminal end of the inclined surface. An automatic gripper having at least a pair of claws provided with a groove in the same direction and a spring device for urging the claws in a closing direction (hereinafter referred to as prior art 2) has been proposed.

Further, Japanese Utility Model Publication No. Sho 62-16431 discloses, as shown also in FIG.
A plurality of sheet materials 1 are stacked in an inclined position downward in the supply direction, and are stacked on a loading table 2 and a loading table 2 which can be moved up and down. A guide plate 15 which is in contact with the leading end of the thin sheet material 1 and is set up obliquely, and the uppermost thin sheet material 1 ′ of the thin sheet material 1 loaded on the loading table 2 is substantially at the same position as the upper end of the guide plate 15. Sensor 16 for detecting that
And a suction member 4 for vacuum-sucking the vicinity of the upper end of the uppermost thin plate 1 'and lifting the thin plate 1'.
And the thin plate material 1 ′ lifted by the suction member.
A notch-shaped plate 17 having a comb-shaped lower portion is inserted between the sheet material 1 and the other sheet material 1 substantially parallel to the loading sheet material 1, and the sheet material 1 ′ is placed on the plate 17. And a plurality of endless belts 7 inserted into the notches of the plate 17 "(hereinafter referred to as prior art 3).

[0007] These prior arts 1 to 3 are capable of loading printed wiring boards one by one into required places, and in that sense, can be said to be excellent loading machines. However, in recent printed wiring boards, in order to cope with high-mix low-volume production of equipment using the same, various forms of wiring and the like are formed on the surface even if they have a certain size. They differ from each other, and the sizes of the entire printed wiring board are also various. Depending on the above-mentioned prior arts 1 to 3, it may not be possible to insert the printed wiring board within a short time for the following reasons.

First, according to Prior Art 1, as shown in FIG. 5, both upper and lower portions of the printed wiring board must be sucked and lifted by rubber pads for suction. If it is half that shown, the rubber pad must be repositioned. Not only that, but the mounting fixture with both rubber pads attached has one end attached to the drive chain and the other end guided by a guide device.
Even if the printed wiring board becomes half that shown in FIG. 5, the time required for the displacement movement in the horizontal state cannot be reduced.

Further, in the prior art 2 shown in FIG. 6, since the input of the gripped printed wiring board is performed by the rotation and the vertical movement of the arm, even if the shape of the printed wiring board is changed, Although it is not a very important problem to shorten the loading time, the adjustment of the dimension between the claws rotatably supported on the arm via the pivot will cause a change in the shape of the printed wiring board to be loaded. If so, it must be done. Therefore, if the position between the pivots supporting the claws cannot be adjusted, the automatic gripper of the prior art 2 cannot operate at all when the size of the printed wiring board changes. become.

In view of the above, the prior art 3 shown in FIG. 7 does not need to adjust the position of the rubber pad and the gripper, so that it can sufficiently cope with a change in the size of the printed wiring board. However, the following problems remain.

That is, as shown in FIG. 8 and the fifth column of the above-mentioned publication, this "thin sheet material supply apparatus" has a structure in which "the suction member 4 swings counterclockwise to remove the thin sheet material 1 '. Then, the thin plate 1 'is lifted as shown in Fig. 8 (a) while the opposite side of the suction member 4 is in contact with the laminated thin plate 1. Next, the guide shaft 19 is rotated to move the plate 17 to the upper right direction. And insert one side between the lifted sheet material 1 'and the other laminated sheet material 1. The plate 17 is made of Teflon or the like so as not to scratch the surface of the sheet material 1'. Use a material with low friction.
Is inserted below the thin plate 1 ', and the suction of the suction portion 4 is released by a solenoid valve or the like (not shown), and the thin plate 1' is placed on the plate 17 (FIG. 8B). Next, if the plate 17 is moved to the lower left, the notch of the plate 17
The right end of the thin plate 1 ′ rides on the endless belt 7, and the right end of the thin plate 1 ′ slides on the plate 17 while being transferred to the endless belt 7 and conveyed (see FIG. 8 (c)). First, the “plate 17” is a printed wiring board 70 that is a thin plate material.
Must not be damaged. Conversely, since the “plate 17” is inserted between the printed wiring boards 70, the printed wiring board 70 is easily scratched when inserted.

In addition, the "plate 17" in the "thin sheet supply device" retreats with the printed wiring board 70 placed thereon, and the lower end (the left end in FIG. 8) of the printed wiring board 70 is conveyed. It must be able to move to a position where it comes into complete contact with the belt, and this "plate 17" and the conveyor belt must have to intersect somewhere completely, but such a specific configuration Since this is not specified, it cannot be used as it is for an input machine as the object of the present invention.

Further, the greatest difficulty of the prior art 3 is that
Even when the size of the printed wiring board 70 becomes half that shown in FIG. 8, the amount of movement of the “plate 17” does not change. In other words, the end of the printed wiring board 70 sucked by the "suction member 4" must be moved as it is onto the conveyor belt, so that the working time when the shape of the printed wiring board 70 is reduced is reduced. It cannot be shortened . Ma
In recent years, printed wiring boards have a so-called through hole or base.
Various through holes such as semi-holes are often formed.
In this device, air is sucked through the through hole by the suction device.
When sucked, this together with the first printed circuit board
Second through the through holes of the first printed wiring board
There is a possibility that the printed circuit board may be sucked.
More than one printed wiring board is sucked by the suction device
It is possible, but if you do not prevent it
No.

Therefore, the present inventor has proposed a printed circuit board 7.
The input of 0 can be performed without damaging the printed wiring board 70 at all, and when the size of the printed wiring board 70 is reduced, various examinations are repeated on how to shorten the input time. As a result, the present invention has been completed.

[0015]

SUMMARY OF THE INVENTION The present invention has been made in view of the above situation, and the problem to be solved is to increase the efficiency of loading the printed wiring board 70.

It is an object of the present invention that the printed wiring board 70 can be put into the conveyance path for the next step without damaging the printed wiring board 70. Ki de is possible to shorten the working time according to the change in shape, yet handsome
An object of the present invention is to provide a charging machine 100 capable of preventing suction of the printed wiring board 70 by a simple structure.

[0017]

In order to solve the above problems, the means adopted by the present invention will be described with reference to the reference numerals used in the embodiments. A loading machine for loading a large number of printed wiring boards 70 one by one on a substrate transport path 40 connected to the next processing step or the like, and reciprocates between the rack 20 and the start end of the substrate transport path 40. A suction device 50 provided on the starting end side of the board transfer path 40 to suck the printed circuit board 70 on the rack 20 and move it onto the board transfer path 40, and disposed below the suction apparatus 50. The nozzle 60 ejects air toward the back side of the printed wiring board 70 whose lower part has been moved onto the substrate transport path 40, and the front end of the substrate transport path 40 and the rack 20 on the rack transport path 10. Separation placed between And those with and over La 30, this
The separation roller 30 is formed in a drum shape, and is formed at the center thereof.
And a charged machine 100 of the printed circuit board "which is characterized that you have to place the nozzle 60 into the recess.

That is, the injection machine 100 according to the present invention comprises:
Printed circuit board 7 leaning on rack 20
The lower part of the printed circuit board 70 is suctioned by the suction device 50 and is introduced into the substrate transport path 40. At this time, air is ejected from the nozzle 60 to separate the printed wiring board 70 one by one. At the same time, contact of the taken out printed circuit board 70 with another printed circuit board 70 is prevented, whereby the printed circuit boards 70 are loaded one by one without being damaged. .
In addition, in the loading machine 100, the rack transport path 10
And the substrate transport path 40
The separation roller 30 is arranged between the front end of the
The separation roller 30 is sucked by the suction device 50
The lower end of each printed wiring board 70 gets over
Yes, this separation roller 30
Separation work of the second and subsequent printed wiring boards 70
Action.

[0019]

The operation of the charging machine 100 according to the present invention configured as described above will be described with reference to FIGS.
First, as shown in FIG. 1, a rack 20 on which a large number of printed wiring boards 70 are mounted is carried by the rack transport path 10 to the loading machine 100 as shown in FIG. The reception of the printed wiring board 70 to the rack 20 is previously performed by another device (not shown).

The rack 20 is located at a predetermined position, that is, the loading machine 1
00, the limit switch (not shown) is operated to stop the drive of the rack transport path 10, and the suction of the printed wiring board 70 on the rack 20 by the suction device 50 is stopped. stand by. Then, the suction device 50 moves toward the first printed wiring board 70 as shown in FIG.
Then, the suction device 50 starts to move toward the substrate transfer path 40 side.

In the loading machine 100 of the embodiment described below, a separation roller 30 is disposed between the rack 20 and the front end of the substrate transfer path 40 as shown in FIGS.
When the lower end of the printed wiring board 70 moves on the separation roller 30, the printed wiring boards 70 are separated one by one together with the air from the nozzles 60 described below. That often various holes such Tokoroisu Le <br/> Horu or reference hole to each printed circuit board 70 is formed, the air is sucked by the operation of the suction device 50 through the hole, two There is a possibility that the printed wiring board 70 of the eye is also sucked, and two or more printed wiring boards 70 may be sucked by the suction device 50. In such a case, the separation roller 30 is provided so that only one printed wiring board 70 can ride on it.
The next separation of the printed wiring board 70 is positively performed by a certain degree of impact when the first printed wiring board 70 rides.

Now, the first printed wiring board 70 is
When the user gets over the separation roller 30 while being sucked by the suction device 50, this is detected by a limit switch (not shown) or the like, and air is temporarily or continuously jetted from the nozzle 60 as shown in FIG. 3. Thereby, the first printed wiring board 70 is completely separated from the rest, and the upper end of the printed wiring board 70 is temporarily floated as shown in FIG. During this time,
Since the suction device 50 further continues to move toward the substrate transport path 40, the printed wiring board 70 is in a state where its lower end rides on the substrate transport path 40, as shown in FIG. The upper end does not come into contact with the other printed wiring board 70 waiting next.

Further, during this time, the substrate transport path 4
Since 0 is in the transport state, the substrate transport path 40
The printed wiring board 70 whose upper end is in contact with the upper end is conveyed in the direction of the arrow in FIG. And the printed wiring board 7
If 0 is transported as shown in FIG. 4, the upper end of the printed wiring board 70 falls onto the board transport path 40 without contacting another printed wiring board 70.

Here, if the size of the printed wiring board 70 is half that shown in the drawing, the suction device 50 of the present invention uses the suction device 50 to attract the printed wiring board 70 to the printed wiring board 70. Since it is performed at the lower end of the printed wiring board 70, even if the size of the printed wiring board 70 changes, its introduction into the board conveyance path 40 can be performed within a short time regardless of the change in the size of the printed wiring board 70. It is done. That is, even if the type of the printed wiring board 70 changes, the input to the next process is performed efficiently.

In the present embodiment, for example, a sensor using light is disposed between the front end of the substrate transport path 40 and the separation roller 30, and the sensor uses the sensor to move the rear end of the printed wiring board 70 on the substrate transport path 40. When the passage of the second printed circuit board 7 (the right end in FIG. 4) is detected, the suction device 50 is operated to return to the state shown in FIG.
That is, the operation moves toward zero. Therefore, if the size of the printed wiring board 70 is reduced to about half the size shown in FIG. 1 and the like, the detection by the sensor is performed within a short time according to the shape of the printed wiring board 70, The return of the device 50 is immediately made, and the above-described closing operation is performed in a short cycle.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described with reference to the embodiment shown in the drawings. FIG. 1 shows a side view of a charging machine 100 according to the present invention. This is the previous processing step (apparatus), and the left side in the figure is the next processing step (apparatus). That is, this input machine 100
Are arranged at various places in a line where various processing is performed on each printed wiring board 70 to form a printed wiring board.

The loading machine 100 is basically provided at the start end of the board transfer path 40 so as to reciprocate between the rack 20 and the start end of the board transfer path 40. An adsorption device 50 that adsorbs a lower portion of the substrate 70 and moves the substrate 70 onto the substrate transport path 40;
And a nozzle 60 for ejecting air toward the back surface side of the printed wiring board 70 whose lower part has been moved onto the board transfer path 40. Further, the input machine 100 includes a rack transport path 10,
The rack 20 on which a large number of printed wiring boards 70 are placed in a lean state is supplied to a predetermined position by the rack transport path 10.

The rack 20 has a large number of printed circuit boards 7.
0 is supported in a leaning state, so that it is formed as a substantially L-shaped member as shown in FIG. 1 and the like, and the support base 21 is an inclined surface. An opening 22 is provided at the center of the support 21 of the rack 20.
Are formed, and each printed wiring board 70
2 is placed on the support 21 in a state of straddling. The opening 22 is reduced when the printed wiring boards 70 on the support base 21 are sequentially loaded on the board transport path 40, and when the rack transport path 10 is driven little by little to advance the rack 20, This is to prevent interference with the nozzles 60 and the like which are performed.

[0029] In addition, in the projection Iriki 100 of the present invention,
The rack 20 supplied by the rack transport path 10
The separation roller 30 is disposed between the separation roller 30 and a front end of the substrate transfer path 40 described later.
The lower end of each printed wiring board 70 sucked by the suction device 50 gets over the upper part. This separation roller 30 may be a roller that freely rolls,
In this embodiment, the support shaft is disposed at an eccentric position and fixedly disposed. That is, the separation roller 30
Is fixed so that it is not dragged and rotated by a single printed wiring board 70 on which it is mounted, and is eccentrically supported so that the height of the upper surface position can be freely adjusted. It is. In other words, the separation roller 30 performs an auxiliary operation of separating the second and subsequent printed wiring boards 70 that are going to ride over the separation roller 30. The separation roller 30
Is disposed in the vicinity of the nozzle 60. In order to prevent the separation roller 30 from interfering with the nozzle 60, as shown in FIG. It is shaped like a “drum”.

The suction device 50 is the same as the prior art 1 described at the beginning.
And the like, and is provided so as to be swingable with respect to a machine frame (not shown) of the input device 100. Further, since the suction device 50 suctions the printed wiring board 70 by sucking air, an air suction device (not shown) is connected to the suction device 50. Is controlled by a signal from a limit switch, a sensor or the like (not shown). In the present embodiment, the suction device 50 is swingably attached to a machine frame (not shown) that is bridged over the front end of the substrate transfer path 40, and the swing range is shown in FIG. It is within the range that can be retracted from the position shown in FIG. 4 to the position shown in FIG.

As shown in FIG. 1, the nozzle 60 is disposed immediately adjacent to the separation roller 30, and injects air upward at this position in the drawing. This nozzle 60
In this embodiment, air must be supplied from the exhaust port of the air suction device connected to the suction device 50 described above. Of course, the supply of air to the nozzle 60 may be performed by an air supply device separate from the air suction device.

The nozzle 60 is connected to the separation roller 30.
A plurality of missing portions may be formed in the axial direction, and the plurality of missing portions may be arranged in the missing portions. As described above, the separation roller 30 is connected to the printed wiring board 70.
The separation roller 30 itself may be provided with a missing portion as long as the missing portion is within the width of one printed wiring board 70. Without damaging each nozzle 60
Is more closely arranged to the separation roller 30 so that the separation effect of the printed wiring board 70 can be effectively exerted. In addition, if a plurality of nozzles 60 exist below each printed wiring board 70, not only the separation of the printed wiring board 70 by each nozzle 60 but also each printed wiring board 7
This makes it possible to reliably form the printed wiring board 70 when the lower end of the printed wiring board 70 is placed on the board transfer path 40.

The injection of air from each nozzle 60 is as follows:
It may be performed continuously during the operation of the charging machine 100, or alternatively, the printed circuit board 70 may be
May be temporarily performed when the substrate is moved to the front end portion of the substrate transport path 40 by the method. When the injection by each nozzle 60 is performed continuously, it is advantageous in that the configuration of the air supply device for the nozzle 60 can be simplified, and the injection of air by each nozzle 60 is performed intermittently. In this case, it is advantageous in that energy for air supply can be saved, and which one to use may be determined by comparing the merits of the two.

[0034]

As described in detail above, in the present invention,
As exemplified in the above-described embodiment, “a loading machine that loads a large number of printed wiring boards 70 stored in a standing state on the rack 20 one by one on a board transport path 40 that is connected to the next processing step or the like. The rack 20 and the substrate transport path 40
A suction device 50 provided on the start end side of the board transfer path 40 so as to reciprocate between the top ends of the printed circuit boards 40 and sucking a lower portion of the printed wiring board 70 on the rack 20 and moving the same to the board transfer path 40; The printed wiring board 7, which is disposed below the suction device 50 and whose lower part has been moved onto the substrate transport path 40,
0, a nozzle 60 for injecting air toward the back side, a front end of the substrate transport path 40, and a rack 20 on the rack transport path 10.
And a separation roller 30 disposed between the
The separation roller 30 is formed in a drum shape and formed at the center thereof.
The arrangement of the nozzles 60 in the recessed portions "has a feature in its configuration, whereby the introduction of the printed wiring board 70 to the transport path for the next process can be performed without damaging the printed wiring board 70. Of course, the work time can be shortened in accordance with the change in the shape of the printed wiring board 70, and the second printed wiring board 70
Can be provided by a simple structure, which can prevent the suction of air.

That is, according to the loading machine 100 of the present invention, when loading each printed wiring board 70 from the rack 20 onto the board transport path 40, each printed wiring board 70
The printed wiring board 70 can be lifted by blowing air from the nozzle 60 against the printed wiring board 70, thereby preventing the printed wiring board 70 from contacting another printed wiring board 70 or the like. Thus, it is possible to prevent the occurrence of scratches when each printed wiring board 70 is loaded. Moreover,
Nozzles 6 on both front and back sides of each printed wiring board 70
By blowing the air from 0, there is also an effect that the air cleaning for removing the dust adhering to each printed wiring board 70 is secondarily performed.

In addition, according to the loading machine 100, since the suction of the printed wiring board 70 by the suction device 50 is performed at the lower end of the printed wiring board 70, the size of the printed wiring board 70 changes. However, the introduction into the board transfer path 40 side can be performed within a short time almost irrespective of the change in the size of the printed wiring board 70, and even if the type of the printed wiring board 70 changes, It is possible to carry out the input to the efficiently.

[Brief description of the drawings]

FIG. 1 is a schematic side view of a charging machine according to the present invention.

FIG. 2 is a schematic side view of the loading machine when a printed wiring board is about to ride on a separation roller.

FIG. 3 is a schematic side view of the charging machine when a nozzle is operated.

4A and 4B show a state immediately before a printed wiring board is placed on a substrate transport path in the loading machine, wherein FIG. 4A is a schematic side view thereof, and FIG. 4B is a plan view of a separation roller and a nozzle used here. FIG.

FIG. 5 is a side view showing Conventional Technique 1.

FIG. 6 is a side view showing Conventional Technique 2.

FIG. 7 is a side view showing a conventional technique 3.

FIG. 8 is a side view showing the operation of the device shown in FIG. 7 in order.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 Feeder 10 Rack transport path 20 Rack 21 Support base 22 Opening 30 Separation roller 40 Substrate transport path 50 Suction device 60 Nozzle 70 Printed wiring board

Claims (1)

(57) [Claims] 1. A loading machine for loading a plurality of printed wiring boards stored in a standing state on a rack into a board transport path connected to a next processing step and the like, wherein the loading circuit board and the board are transported. A suction device which is provided at the start end of the board transfer path so as to reciprocate between the start ends of the path, sucks the printed circuit board on the rack below the rack, and moves the board onto the board transfer path; A nozzle that is disposed below the apparatus and that injects air toward the back side of the printed wiring board whose lower part has been moved onto the board transfer path, and a front end of the board transfer path and a rack on the rack transfer path. and that a separation roller disposed between, to form the separation roller drum-shaped, is formed at the center thereof
Printed circuit turned machine substrate characterized that you have placed the nozzle in the recess.