JP2506491Y2 - 半導体式熱感知器 - Google Patents
半導体式熱感知器Info
- Publication number
- JP2506491Y2 JP2506491Y2 JP12227889U JP12227889U JP2506491Y2 JP 2506491 Y2 JP2506491 Y2 JP 2506491Y2 JP 12227889 U JP12227889 U JP 12227889U JP 12227889 U JP12227889 U JP 12227889U JP 2506491 Y2 JP2506491 Y2 JP 2506491Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- semiconductor
- heat
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 230000001012 protector Effects 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002999 depolarising effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fire-Detection Mechanisms (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12227889U JP2506491Y2 (ja) | 1989-10-20 | 1989-10-20 | 半導体式熱感知器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12227889U JP2506491Y2 (ja) | 1989-10-20 | 1989-10-20 | 半導体式熱感知器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0363288U JPH0363288U (enrdf_load_stackoverflow) | 1991-06-20 |
JP2506491Y2 true JP2506491Y2 (ja) | 1996-08-07 |
Family
ID=31670284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12227889U Expired - Lifetime JP2506491Y2 (ja) | 1989-10-20 | 1989-10-20 | 半導体式熱感知器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2506491Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5191355B2 (ja) * | 2008-11-13 | 2013-05-08 | 日本フェンオール株式会社 | 火災感知器 |
-
1989
- 1989-10-20 JP JP12227889U patent/JP2506491Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0363288U (enrdf_load_stackoverflow) | 1991-06-20 |
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