JP2505798Y2 - 端面型プリントヘッド基板の配線構造 - Google Patents
端面型プリントヘッド基板の配線構造Info
- Publication number
- JP2505798Y2 JP2505798Y2 JP3005790U JP3005790U JP2505798Y2 JP 2505798 Y2 JP2505798 Y2 JP 2505798Y2 JP 3005790 U JP3005790 U JP 3005790U JP 3005790 U JP3005790 U JP 3005790U JP 2505798 Y2 JP2505798 Y2 JP 2505798Y2
- Authority
- JP
- Japan
- Prior art keywords
- head substrate
- common
- print head
- reinforcing
- wiring structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 58
- 230000003014 reinforcing effect Effects 0.000 claims description 70
- 238000010438 heat treatment Methods 0.000 description 38
- 239000004020 conductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Electronic Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3005790U JP2505798Y2 (ja) | 1990-03-22 | 1990-03-22 | 端面型プリントヘッド基板の配線構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3005790U JP2505798Y2 (ja) | 1990-03-22 | 1990-03-22 | 端面型プリントヘッド基板の配線構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03120064U JPH03120064U (enrdf_load_stackoverflow) | 1991-12-10 |
| JP2505798Y2 true JP2505798Y2 (ja) | 1996-07-31 |
Family
ID=31532796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3005790U Expired - Lifetime JP2505798Y2 (ja) | 1990-03-22 | 1990-03-22 | 端面型プリントヘッド基板の配線構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505798Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-03-22 JP JP3005790U patent/JP2505798Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03120064U (enrdf_load_stackoverflow) | 1991-12-10 |
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