JP2505200Y2 - 基板リ―ク試験用治具 - Google Patents

基板リ―ク試験用治具

Info

Publication number
JP2505200Y2
JP2505200Y2 JP1990111622U JP11162290U JP2505200Y2 JP 2505200 Y2 JP2505200 Y2 JP 2505200Y2 JP 1990111622 U JP1990111622 U JP 1990111622U JP 11162290 U JP11162290 U JP 11162290U JP 2505200 Y2 JP2505200 Y2 JP 2505200Y2
Authority
JP
Japan
Prior art keywords
substrate
jig
flange
vacuum
leak test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990111622U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468550U (online.php
Inventor
努 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1990111622U priority Critical patent/JP2505200Y2/ja
Publication of JPH0468550U publication Critical patent/JPH0468550U/ja
Application granted granted Critical
Publication of JP2505200Y2 publication Critical patent/JP2505200Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990111622U 1990-10-26 1990-10-26 基板リ―ク試験用治具 Expired - Lifetime JP2505200Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990111622U JP2505200Y2 (ja) 1990-10-26 1990-10-26 基板リ―ク試験用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990111622U JP2505200Y2 (ja) 1990-10-26 1990-10-26 基板リ―ク試験用治具

Publications (2)

Publication Number Publication Date
JPH0468550U JPH0468550U (online.php) 1992-06-17
JP2505200Y2 true JP2505200Y2 (ja) 1996-07-24

Family

ID=31859090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990111622U Expired - Lifetime JP2505200Y2 (ja) 1990-10-26 1990-10-26 基板リ―ク試験用治具

Country Status (1)

Country Link
JP (1) JP2505200Y2 (online.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101380429B1 (ko) * 2012-12-17 2014-04-01 한국항공우주연구원 포트플레이트 기밀시험용 치구 및 포트플레이트 기밀시험방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101380429B1 (ko) * 2012-12-17 2014-04-01 한국항공우주연구원 포트플레이트 기밀시험용 치구 및 포트플레이트 기밀시험방법

Also Published As

Publication number Publication date
JPH0468550U (online.php) 1992-06-17

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