JP2505070Y2 - コ―ルドプレ―ト伝熱部構造 - Google Patents

コ―ルドプレ―ト伝熱部構造

Info

Publication number
JP2505070Y2
JP2505070Y2 JP1990118442U JP11844290U JP2505070Y2 JP 2505070 Y2 JP2505070 Y2 JP 2505070Y2 JP 1990118442 U JP1990118442 U JP 1990118442U JP 11844290 U JP11844290 U JP 11844290U JP 2505070 Y2 JP2505070 Y2 JP 2505070Y2
Authority
JP
Japan
Prior art keywords
cold plate
heat transfer
base plate
contact surface
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990118442U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0474199U (enrdf_load_stackoverflow
Inventor
肇 坂田
Original Assignee
石川島播磨重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 石川島播磨重工業株式会社 filed Critical 石川島播磨重工業株式会社
Priority to JP1990118442U priority Critical patent/JP2505070Y2/ja
Publication of JPH0474199U publication Critical patent/JPH0474199U/ja
Application granted granted Critical
Publication of JP2505070Y2 publication Critical patent/JP2505070Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990118442U 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造 Expired - Lifetime JP2505070Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990118442U JP2505070Y2 (ja) 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990118442U JP2505070Y2 (ja) 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造

Publications (2)

Publication Number Publication Date
JPH0474199U JPH0474199U (enrdf_load_stackoverflow) 1992-06-29
JP2505070Y2 true JP2505070Y2 (ja) 1996-07-24

Family

ID=31866362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990118442U Expired - Lifetime JP2505070Y2 (ja) 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造

Country Status (1)

Country Link
JP (1) JP2505070Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117090A (ja) * 1983-11-30 1985-06-24 Hitachi Ltd 放熱制御装置

Also Published As

Publication number Publication date
JPH0474199U (enrdf_load_stackoverflow) 1992-06-29

Similar Documents

Publication Publication Date Title
US20170273218A1 (en) Electronic device and method of assembling such a device
US20090073654A1 (en) Compact surface-mount heat exchanger
US6226184B1 (en) Enclosure mounted heat sink
JP2505070Y2 (ja) コ―ルドプレ―ト伝熱部構造
US11006548B2 (en) Method and device to provide uniform cooling in rugged environments
JP3653417B2 (ja) マルチチップモジュールの封止構造
US20080028767A1 (en) Computer cooler
JPH0426549B2 (enrdf_load_stackoverflow)
JP2009059760A (ja) 電子回路基板の放熱構造体
KR200185418Y1 (ko) 무선통신 시스템의 함체 구조
JP2552329Y2 (ja) 宇宙環境下用機器冷却装置
JPS60220954A (ja) 集積回路素子冷却装置
JPH07112033B2 (ja) 冷却モジユ−ル構造
JP2907800B2 (ja) 電子機器
CN114173540A (zh) 一种用于星载在轨信息处理与服务载荷的热控结构及装置
JPS6089946A (ja) 半導体素子の冷却構造
CN214338396U (zh) 一种新型散热器
CN222981875U (zh) 一种路由器散热片
JPH04336500A (ja) 伝導冷却構造
JP3061828U (ja) 冷却フイン
JP2561029B2 (ja) 進行波管固定方法及び進行波管固定用器具
JPH0648869Y2 (ja) 冷却構造
KR100794372B1 (ko) 컴퓨터 부품용 냉각장치
KR100373385B1 (ko) 열전소자를 이용한 냉각장치의 수냉식 방열구조
JPH11251496A (ja) Ｉｃの冷却構造