JP2505070Y2 - コ―ルドプレ―ト伝熱部構造 - Google Patents
コ―ルドプレ―ト伝熱部構造Info
- Publication number
- JP2505070Y2 JP2505070Y2 JP1990118442U JP11844290U JP2505070Y2 JP 2505070 Y2 JP2505070 Y2 JP 2505070Y2 JP 1990118442 U JP1990118442 U JP 1990118442U JP 11844290 U JP11844290 U JP 11844290U JP 2505070 Y2 JP2505070 Y2 JP 2505070Y2
- Authority
- JP
- Japan
- Prior art keywords
- cold plate
- heat transfer
- base plate
- contact surface
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 25
- 238000010586 diagram Methods 0.000 description 5
- 230000005489 elastic deformation Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118442U JP2505070Y2 (ja) | 1990-11-09 | 1990-11-09 | コ―ルドプレ―ト伝熱部構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118442U JP2505070Y2 (ja) | 1990-11-09 | 1990-11-09 | コ―ルドプレ―ト伝熱部構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0474199U JPH0474199U (enrdf_load_stackoverflow) | 1992-06-29 |
| JP2505070Y2 true JP2505070Y2 (ja) | 1996-07-24 |
Family
ID=31866362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990118442U Expired - Lifetime JP2505070Y2 (ja) | 1990-11-09 | 1990-11-09 | コ―ルドプレ―ト伝熱部構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505070Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60117090A (ja) * | 1983-11-30 | 1985-06-24 | Hitachi Ltd | 放熱制御装置 |
-
1990
- 1990-11-09 JP JP1990118442U patent/JP2505070Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0474199U (enrdf_load_stackoverflow) | 1992-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20170273218A1 (en) | Electronic device and method of assembling such a device | |
| JPH1136981A (ja) | 排熱発電装置 | |
| US20090073654A1 (en) | Compact surface-mount heat exchanger | |
| US6226184B1 (en) | Enclosure mounted heat sink | |
| JP2505070Y2 (ja) | コ―ルドプレ―ト伝熱部構造 | |
| US11006548B2 (en) | Method and device to provide uniform cooling in rugged environments | |
| US20040109301A1 (en) | Cooling device for an integrated circuit | |
| JP3653417B2 (ja) | マルチチップモジュールの封止構造 | |
| US20080028767A1 (en) | Computer cooler | |
| JPH0426549B2 (enrdf_load_stackoverflow) | ||
| KR200185418Y1 (ko) | 무선통신 시스템의 함체 구조 | |
| JP2552329Y2 (ja) | 宇宙環境下用機器冷却装置 | |
| JPS60220954A (ja) | 集積回路素子冷却装置 | |
| JPH07112033B2 (ja) | 冷却モジユ−ル構造 | |
| JPH11121958A (ja) | 電子機器 | |
| CN209232768U (zh) | 一种均热板散热一体化装置 | |
| JPS59217346A (ja) | 沸騰冷却装置 | |
| CN223272857U (zh) | 一种运算板卡散热结构 | |
| JP3560392B2 (ja) | 熱電変換装置 | |
| CN214338396U (zh) | 一种新型散热器 | |
| JP2561029B2 (ja) | 進行波管固定方法及び進行波管固定用器具 | |
| JPH0648869Y2 (ja) | 冷却構造 | |
| KR100794372B1 (ko) | 컴퓨터 부품용 냉각장치 | |
| KR100373385B1 (ko) | 열전소자를 이용한 냉각장치의 수냉식 방열구조 | |
| RU190079U1 (ru) | Корпус блока бортовой аппаратуры |