JP2025139676A5 - - Google Patents

Info

Publication number
JP2025139676A5
JP2025139676A5 JP2024038635A JP2024038635A JP2025139676A5 JP 2025139676 A5 JP2025139676 A5 JP 2025139676A5 JP 2024038635 A JP2024038635 A JP 2024038635A JP 2024038635 A JP2024038635 A JP 2024038635A JP 2025139676 A5 JP2025139676 A5 JP 2025139676A5
Authority
JP
Japan
Prior art keywords
resin
layer
substrate according
layers
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024038635A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025139676A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2024038635A priority Critical patent/JP2025139676A/ja
Priority claimed from JP2024038635A external-priority patent/JP2025139676A/ja
Priority to US19/039,804 priority patent/US20250294672A1/en
Priority to CN202510218417.3A priority patent/CN120659222A/zh
Publication of JP2025139676A publication Critical patent/JP2025139676A/ja
Publication of JP2025139676A5 publication Critical patent/JP2025139676A5/ja
Pending legal-status Critical Current

Links

JP2024038635A 2024-03-13 2024-03-13 多層基板、モジュール基板及び電子機器 Pending JP2025139676A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2024038635A JP2025139676A (ja) 2024-03-13 2024-03-13 多層基板、モジュール基板及び電子機器
US19/039,804 US20250294672A1 (en) 2024-03-13 2025-01-29 Multilayer substrate, module substrate, and electronic apparatus
CN202510218417.3A CN120659222A (zh) 2024-03-13 2025-02-26 多层基板、模块基板以及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024038635A JP2025139676A (ja) 2024-03-13 2024-03-13 多層基板、モジュール基板及び電子機器

Publications (2)

Publication Number Publication Date
JP2025139676A JP2025139676A (ja) 2025-09-29
JP2025139676A5 true JP2025139676A5 (enExample) 2025-10-24

Family

ID=97000157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024038635A Pending JP2025139676A (ja) 2024-03-13 2024-03-13 多層基板、モジュール基板及び電子機器

Country Status (3)

Country Link
US (1) US20250294672A1 (enExample)
JP (1) JP2025139676A (enExample)
CN (1) CN120659222A (enExample)

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