JP2025029124A5 - - Google Patents

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Publication number
JP2025029124A5
JP2025029124A5 JP2024211067A JP2024211067A JP2025029124A5 JP 2025029124 A5 JP2025029124 A5 JP 2025029124A5 JP 2024211067 A JP2024211067 A JP 2024211067A JP 2024211067 A JP2024211067 A JP 2024211067A JP 2025029124 A5 JP2025029124 A5 JP 2025029124A5
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JP
Japan
Prior art keywords
measurement
measuring device
manipulator
workpiece
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024211067A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025029124A (ja
Filing date
Publication date
Priority claimed from JP2022539857A external-priority patent/JP7601100B2/ja
Application filed filed Critical
Priority to JP2024211067A priority Critical patent/JP2025029124A/ja
Publication of JP2025029124A publication Critical patent/JP2025029124A/ja
Publication of JP2025029124A5 publication Critical patent/JP2025029124A5/ja
Pending legal-status Critical Current

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JP2024211067A 2020-07-29 2024-12-04 加工システム Pending JP2025029124A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024211067A JP2025029124A (ja) 2020-07-29 2024-12-04 加工システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022539857A JP7601100B2 (ja) 2020-07-29 2020-07-29 加工システム
PCT/JP2020/029000 WO2022024246A1 (ja) 2020-07-29 2020-07-29 加工システム
JP2024211067A JP2025029124A (ja) 2020-07-29 2024-12-04 加工システム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2022539857A Division JP7601100B2 (ja) 2020-07-29 2020-07-29 加工システム

Publications (2)

Publication Number Publication Date
JP2025029124A JP2025029124A (ja) 2025-03-05
JP2025029124A5 true JP2025029124A5 (enExample) 2025-05-15

Family

ID=80035454

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022539857A Active JP7601100B2 (ja) 2020-07-29 2020-07-29 加工システム
JP2024211067A Pending JP2025029124A (ja) 2020-07-29 2024-12-04 加工システム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2022539857A Active JP7601100B2 (ja) 2020-07-29 2020-07-29 加工システム

Country Status (8)

Country Link
US (1) US12459056B2 (enExample)
EP (1) EP4190477A4 (enExample)
JP (2) JP7601100B2 (enExample)
CN (1) CN116133783A (enExample)
AU (1) AU2020460879A1 (enExample)
BR (1) BR112023001423A2 (enExample)
CA (1) CA3189581A1 (enExample)
WO (1) WO2022024246A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023199473A1 (ja) * 2022-04-14 2023-10-19 株式会社ニコン 加工システム及び計測システム
DE102022116927A1 (de) * 2022-07-07 2024-01-18 Trumpf Laser Gmbh Laserbearbeitungsmaschine mit frequenzkammbasiertem Abstandssensor sowie zugehöriges Verfahren mit frequenzkammbasierter Abstandsmessung
DE102023129804A1 (de) * 2023-10-27 2025-04-30 Björn Steiger Stiftung -Stiftung bürgerlichen Rechts- Hangar für mindestens ein unbemanntes Luftfahrzeug

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI75994C (fi) 1986-05-15 1988-09-09 Temet Oy Avstaengningsanordning.
GB2226970B (en) 1989-01-11 1992-10-21 British Aerospace Methods of manufacture and surface treatment using laser radiation
CA2343722A1 (en) 1998-09-09 2000-09-21 Gerald F. Hermann Robotically operated laser head
US7800758B1 (en) 1999-07-23 2010-09-21 Faro Laser Trackers, Llc Laser-based coordinate measuring device and laser-based method for measuring coordinates
EP1407291B1 (en) 2001-04-10 2010-12-15 Faro Technologies Inc. Chopper-stabilized absolute distance meter
JP2005169397A (ja) * 2003-12-05 2005-06-30 Seiko Epson Corp レーザ照射装置、液滴吐出装置、レーザ照射方法、液滴吐出方法及び位置制御装置
JP2005337912A (ja) * 2004-05-27 2005-12-08 Nikon Corp 位置計測装置、露光装置、及びデバイスの製造方法
CA2815094C (en) 2010-10-25 2018-01-16 Nikon Corporation Apparatus, optical assembly, method for inspection or measurement of an object and method for manufacturing a structure
WO2013126927A2 (en) * 2012-02-26 2013-08-29 Solexel, Inc. Systems and methods for laser splitting and device layer transfer
JP2014083562A (ja) * 2012-10-23 2014-05-12 Olympus Corp レーザ照射ユニット及びレーザ加工装置
US9789462B2 (en) 2013-06-25 2017-10-17 The Boeing Company Apparatuses and methods for accurate structure marking and marking-assisted structure locating
WO2015163365A1 (ja) 2014-04-23 2015-10-29 独立行政法人科学技術振興機構 ブレード複合型開放流路装置およびその接合体
DE102014018912A1 (de) * 2014-12-17 2015-06-18 Daimler Ag Vorrichtung und Verfahren zur Positionsermittlung eines Endeffektors eines Roboters
JP2017019072A (ja) 2015-07-14 2017-01-26 トヨタ自動車株式会社 位置計測システム
US9815204B2 (en) 2016-01-22 2017-11-14 The Boeing Company Apparatus and method to optically locate workpiece for robotic operations
JP6464213B2 (ja) * 2017-02-09 2019-02-06 ファナック株式会社 レーザ加工ヘッドおよび撮影装置を備えるレーザ加工システム
WO2018203362A1 (ja) * 2017-05-01 2018-11-08 株式会社ニコン 加工装置及び加工方法
WO2019082312A1 (ja) * 2017-10-25 2019-05-02 株式会社ニコン 加工装置、及び、移動体の製造方法
US20210370444A1 (en) * 2017-10-25 2021-12-02 Nikon Corporation Processing apparatus, painting material, processing method, and manufacturing method of movable body
EP3613544A1 (en) * 2018-08-22 2020-02-26 Hilti Aktiengesellschaft Mobile construction robot

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