JP2024546037A5 - - Google Patents
Info
- Publication number
- JP2024546037A5 JP2024546037A5 JP2024527708A JP2024527708A JP2024546037A5 JP 2024546037 A5 JP2024546037 A5 JP 2024546037A5 JP 2024527708 A JP2024527708 A JP 2024527708A JP 2024527708 A JP2024527708 A JP 2024527708A JP 2024546037 A5 JP2024546037 A5 JP 2024546037A5
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- substrate
- connection assembly
- region
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021129411.8 | 2021-11-11 | ||
| DE102021129411.8A DE102021129411A1 (de) | 2021-11-11 | 2021-11-11 | Hermetisch verbundene Anordnung |
| PCT/EP2022/081460 WO2023083957A1 (de) | 2021-11-11 | 2022-11-10 | Hermetisch verbundene anordnung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024546037A JP2024546037A (ja) | 2024-12-17 |
| JP2024546037A5 true JP2024546037A5 (https=) | 2025-09-30 |
Family
ID=84370285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024527708A Pending JP2024546037A (ja) | 2021-11-11 | 2022-11-10 | 気密接続アセンブリ |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4429999A1 (https=) |
| JP (1) | JP2024546037A (https=) |
| CN (1) | CN118302379A (https=) |
| DE (1) | DE102021129411A1 (https=) |
| WO (1) | WO2023083957A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022116612B4 (de) * | 2022-07-04 | 2025-10-23 | Schott Ag | Hermetisch verschlossene Umhäusung und Verfahren zur Auslegung der Schweißverbindung für eine solche Umhäusung |
| US20240139886A1 (en) * | 2022-10-12 | 2024-05-02 | Corning Incorporated | Laser bonding of glass ceramic to metal foil |
| CN117102667B (zh) * | 2023-08-30 | 2025-10-31 | 瓯江实验室 | 内窥镜激光熔覆-加工成形-选区激光焊接协同密封方法 |
| DE102023125028A1 (de) * | 2023-09-15 | 2025-03-20 | Tdk Electronics Ag | Substrat, Halbbrücke, Vollbrücke, Kommutierungszelle, Ensemble und Mehrkomponentenaufbau |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3374395B2 (ja) | 1997-10-03 | 2003-02-04 | 株式会社大真空 | 電子部品用パッケージ |
| FI125935B (fi) | 2014-09-26 | 2016-04-15 | Primoceler Oy | Menetelmä optisen komponentin suojana käytettävän läpinäkyvän kappaleen valmistamiseksi |
| EP3308897A1 (de) | 2016-10-14 | 2018-04-18 | odelo GmbH | Verfahren zum laserdurchstrahlschweissen zweier fügepartner und zu dessen durchführung geeignet ausgestaltetes fügeteil als einer von zwei fügepartnern |
| EP3633431A1 (en) * | 2018-10-05 | 2020-04-08 | Indigo Diabetes N.V. | Weld protection for hermetic wafer-level sealing |
| GB2583090A (en) | 2019-04-12 | 2020-10-21 | Spi Lasers Uk Ltd | Method for joining a first substrate to a second substrate |
| US12589244B2 (en) | 2019-12-23 | 2026-03-31 | Medtronic, Inc. | Ceramic-to-metal joint for implantable pulse generators |
| DE102020116444A1 (de) | 2020-06-22 | 2021-12-23 | Schott Ag | Wellenleiter und Verfahren zur Herstellung eines Wellenleiters |
| DE102020129380A1 (de) | 2020-11-08 | 2022-05-12 | Schott Ag | Hermetisch verbundene Anordnung |
-
2021
- 2021-11-11 DE DE102021129411.8A patent/DE102021129411A1/de active Pending
-
2022
- 2022-11-10 WO PCT/EP2022/081460 patent/WO2023083957A1/de not_active Ceased
- 2022-11-10 JP JP2024527708A patent/JP2024546037A/ja active Pending
- 2022-11-10 CN CN202280075310.2A patent/CN118302379A/zh active Pending
- 2022-11-10 EP EP22817197.1A patent/EP4429999A1/de active Pending
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