DE102021129411A1 - Hermetisch verbundene Anordnung - Google Patents
Hermetisch verbundene Anordnung Download PDFInfo
- Publication number
- DE102021129411A1 DE102021129411A1 DE102021129411.8A DE102021129411A DE102021129411A1 DE 102021129411 A1 DE102021129411 A1 DE 102021129411A1 DE 102021129411 A DE102021129411 A DE 102021129411A DE 102021129411 A1 DE102021129411 A1 DE 102021129411A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- metal foil
- laser
- joining
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 338
- 239000002184 metal Substances 0.000 claims abstract description 338
- 239000000758 substrate Substances 0.000 claims abstract description 278
- 239000011888 foil Substances 0.000 claims abstract description 263
- 238000005304 joining Methods 0.000 claims abstract description 220
- 238000002844 melting Methods 0.000 claims abstract description 9
- 230000008018 melting Effects 0.000 claims abstract description 9
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 58
- 230000008569 process Effects 0.000 claims description 32
- 239000002131 composite material Substances 0.000 claims description 27
- 238000002156 mixing Methods 0.000 claims description 24
- 238000003466 welding Methods 0.000 claims description 23
- 239000011521 glass Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 10
- 230000004308 accommodation Effects 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000002241 glass-ceramic Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000006094 Zerodur Substances 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 2
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000005387 chalcogenide glass Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005355 lead glass Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000011029 spinel Substances 0.000 claims description 2
- 229910052596 spinel Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000012780 transparent material Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 24
- 239000010410 layer Substances 0.000 description 12
- 210000001787 dendrite Anatomy 0.000 description 8
- 239000002346 layers by function Substances 0.000 description 8
- 239000012768 molten material Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000004021 metal welding Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0118—Processes for the planarization of structures
- B81C2201/0119—Processes for the planarization of structures involving only addition of materials, i.e. additive planarization
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Joining Of Glass To Other Materials (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021129411.8A DE102021129411A1 (de) | 2021-11-11 | 2021-11-11 | Hermetisch verbundene Anordnung |
| CN202280075310.2A CN118302379A (zh) | 2021-11-11 | 2022-11-10 | 气密连接的组件 |
| JP2024527708A JP2024546037A (ja) | 2021-11-11 | 2022-11-10 | 気密接続アセンブリ |
| EP22817197.1A EP4429999A1 (de) | 2021-11-11 | 2022-11-10 | Hermetisch verbundene anordnung |
| PCT/EP2022/081460 WO2023083957A1 (de) | 2021-11-11 | 2022-11-10 | Hermetisch verbundene anordnung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021129411.8A DE102021129411A1 (de) | 2021-11-11 | 2021-11-11 | Hermetisch verbundene Anordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102021129411A1 true DE102021129411A1 (de) | 2023-05-11 |
Family
ID=84370285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102021129411.8A Pending DE102021129411A1 (de) | 2021-11-11 | 2021-11-11 | Hermetisch verbundene Anordnung |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4429999A1 (https=) |
| JP (1) | JP2024546037A (https=) |
| CN (1) | CN118302379A (https=) |
| DE (1) | DE102021129411A1 (https=) |
| WO (1) | WO2023083957A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022116612A1 (de) * | 2022-07-04 | 2024-01-04 | Schott Ag | Hermetisch verschlossene Umhäusung und Verfahren zur Auslegung der Schweißverbindung für eine solche Umhäusung |
| DE102023125028A1 (de) * | 2023-09-15 | 2025-03-20 | Tdk Electronics Ag | Substrat, Halbbrücke, Vollbrücke, Kommutierungszelle, Ensemble und Mehrkomponentenaufbau |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240139886A1 (en) * | 2022-10-12 | 2024-05-02 | Corning Incorporated | Laser bonding of glass ceramic to metal foil |
| CN117102667B (zh) * | 2023-08-30 | 2025-10-31 | 瓯江实验室 | 内窥镜激光熔覆-加工成形-选区激光焊接协同密封方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111876A (ja) | 1997-10-03 | 1999-04-23 | Daishinku:Kk | 電子部品用パッケージ |
| EP3012059B1 (en) | 2014-09-26 | 2017-10-18 | Primoceler Oy | Method to produce a transparent piece to be used to protect an optical component |
| EP3308897A1 (de) | 2016-10-14 | 2018-04-18 | odelo GmbH | Verfahren zum laserdurchstrahlschweissen zweier fügepartner und zu dessen durchführung geeignet ausgestaltetes fügeteil als einer von zwei fügepartnern |
| GB2583090A (en) | 2019-04-12 | 2020-10-21 | Spi Lasers Uk Ltd | Method for joining a first substrate to a second substrate |
| US20210187291A1 (en) | 2019-12-23 | 2021-06-24 | Medtronic, Inc. | Ceramic-to-metal joint for implantable pulse generators |
| DE102020129380A1 (de) | 2020-11-08 | 2022-05-12 | Schott Ag | Hermetisch verbundene Anordnung |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3633431A1 (en) * | 2018-10-05 | 2020-04-08 | Indigo Diabetes N.V. | Weld protection for hermetic wafer-level sealing |
| DE102020116444A1 (de) | 2020-06-22 | 2021-12-23 | Schott Ag | Wellenleiter und Verfahren zur Herstellung eines Wellenleiters |
-
2021
- 2021-11-11 DE DE102021129411.8A patent/DE102021129411A1/de active Pending
-
2022
- 2022-11-10 WO PCT/EP2022/081460 patent/WO2023083957A1/de not_active Ceased
- 2022-11-10 JP JP2024527708A patent/JP2024546037A/ja active Pending
- 2022-11-10 CN CN202280075310.2A patent/CN118302379A/zh active Pending
- 2022-11-10 EP EP22817197.1A patent/EP4429999A1/de active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111876A (ja) | 1997-10-03 | 1999-04-23 | Daishinku:Kk | 電子部品用パッケージ |
| EP3012059B1 (en) | 2014-09-26 | 2017-10-18 | Primoceler Oy | Method to produce a transparent piece to be used to protect an optical component |
| EP3308897A1 (de) | 2016-10-14 | 2018-04-18 | odelo GmbH | Verfahren zum laserdurchstrahlschweissen zweier fügepartner und zu dessen durchführung geeignet ausgestaltetes fügeteil als einer von zwei fügepartnern |
| GB2583090A (en) | 2019-04-12 | 2020-10-21 | Spi Lasers Uk Ltd | Method for joining a first substrate to a second substrate |
| US20210187291A1 (en) | 2019-12-23 | 2021-06-24 | Medtronic, Inc. | Ceramic-to-metal joint for implantable pulse generators |
| DE102020129380A1 (de) | 2020-11-08 | 2022-05-12 | Schott Ag | Hermetisch verbundene Anordnung |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022116612A1 (de) * | 2022-07-04 | 2024-01-04 | Schott Ag | Hermetisch verschlossene Umhäusung und Verfahren zur Auslegung der Schweißverbindung für eine solche Umhäusung |
| DE102022116612B4 (de) * | 2022-07-04 | 2025-10-23 | Schott Ag | Hermetisch verschlossene Umhäusung und Verfahren zur Auslegung der Schweißverbindung für eine solche Umhäusung |
| DE102023125028A1 (de) * | 2023-09-15 | 2025-03-20 | Tdk Electronics Ag | Substrat, Halbbrücke, Vollbrücke, Kommutierungszelle, Ensemble und Mehrkomponentenaufbau |
| WO2025056663A1 (de) | 2023-09-15 | 2025-03-20 | Tdk Electronics Ag | Substrat, halbbrücke, vollbrücke, kommutierungszelle, ensemble und mehrkomponentenaufbau |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118302379A (zh) | 2024-07-05 |
| EP4429999A1 (de) | 2024-09-18 |
| WO2023083957A1 (de) | 2023-05-19 |
| JP2024546037A (ja) | 2024-12-17 |
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