JP2024546037A - 気密接続アセンブリ - Google Patents

気密接続アセンブリ Download PDF

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Publication number
JP2024546037A
JP2024546037A JP2024527708A JP2024527708A JP2024546037A JP 2024546037 A JP2024546037 A JP 2024546037A JP 2024527708 A JP2024527708 A JP 2024527708A JP 2024527708 A JP2024527708 A JP 2024527708A JP 2024546037 A JP2024546037 A JP 2024546037A
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JP
Japan
Prior art keywords
substrate
metal foil
laser
metal
contact area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024527708A
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English (en)
Japanese (ja)
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JP2024546037A5 (https=
Inventor
ウルリヒ トーマス イェンス
マーテネン アンティ
ホッペ ベアント
ヘットラー ローベアト
オット クリスティアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of JP2024546037A publication Critical patent/JP2024546037A/ja
Publication of JP2024546037A5 publication Critical patent/JP2024546037A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0118—Processes for the planarization of structures
    • B81C2201/0119—Processes for the planarization of structures involving only addition of materials, i.e. additive planarization
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Joining Of Glass To Other Materials (AREA)
JP2024527708A 2021-11-11 2022-11-10 気密接続アセンブリ Pending JP2024546037A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102021129411.8 2021-11-11
DE102021129411.8A DE102021129411A1 (de) 2021-11-11 2021-11-11 Hermetisch verbundene Anordnung
PCT/EP2022/081460 WO2023083957A1 (de) 2021-11-11 2022-11-10 Hermetisch verbundene anordnung

Publications (2)

Publication Number Publication Date
JP2024546037A true JP2024546037A (ja) 2024-12-17
JP2024546037A5 JP2024546037A5 (https=) 2025-09-30

Family

ID=84370285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024527708A Pending JP2024546037A (ja) 2021-11-11 2022-11-10 気密接続アセンブリ

Country Status (5)

Country Link
EP (1) EP4429999A1 (https=)
JP (1) JP2024546037A (https=)
CN (1) CN118302379A (https=)
DE (1) DE102021129411A1 (https=)
WO (1) WO2023083957A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022116612B4 (de) * 2022-07-04 2025-10-23 Schott Ag Hermetisch verschlossene Umhäusung und Verfahren zur Auslegung der Schweißverbindung für eine solche Umhäusung
US20240139886A1 (en) * 2022-10-12 2024-05-02 Corning Incorporated Laser bonding of glass ceramic to metal foil
CN117102667B (zh) * 2023-08-30 2025-10-31 瓯江实验室 内窥镜激光熔覆-加工成形-选区激光焊接协同密封方法
DE102023125028A1 (de) * 2023-09-15 2025-03-20 Tdk Electronics Ag Substrat, Halbbrücke, Vollbrücke, Kommutierungszelle, Ensemble und Mehrkomponentenaufbau

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3374395B2 (ja) 1997-10-03 2003-02-04 株式会社大真空 電子部品用パッケージ
FI125935B (fi) 2014-09-26 2016-04-15 Primoceler Oy Menetelmä optisen komponentin suojana käytettävän läpinäkyvän kappaleen valmistamiseksi
EP3308897A1 (de) 2016-10-14 2018-04-18 odelo GmbH Verfahren zum laserdurchstrahlschweissen zweier fügepartner und zu dessen durchführung geeignet ausgestaltetes fügeteil als einer von zwei fügepartnern
EP3633431A1 (en) * 2018-10-05 2020-04-08 Indigo Diabetes N.V. Weld protection for hermetic wafer-level sealing
GB2583090A (en) 2019-04-12 2020-10-21 Spi Lasers Uk Ltd Method for joining a first substrate to a second substrate
US12589244B2 (en) 2019-12-23 2026-03-31 Medtronic, Inc. Ceramic-to-metal joint for implantable pulse generators
DE102020116444A1 (de) 2020-06-22 2021-12-23 Schott Ag Wellenleiter und Verfahren zur Herstellung eines Wellenleiters
DE102020129380A1 (de) 2020-11-08 2022-05-12 Schott Ag Hermetisch verbundene Anordnung

Also Published As

Publication number Publication date
DE102021129411A1 (de) 2023-05-11
CN118302379A (zh) 2024-07-05
EP4429999A1 (de) 2024-09-18
WO2023083957A1 (de) 2023-05-19

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