JP2024541349A - ワイヤーボンディングシステム上の超音波特性を較正する方法 - Google Patents

ワイヤーボンディングシステム上の超音波特性を較正する方法 Download PDF

Info

Publication number
JP2024541349A
JP2024541349A JP2024527725A JP2024527725A JP2024541349A JP 2024541349 A JP2024541349 A JP 2024541349A JP 2024527725 A JP2024527725 A JP 2024527725A JP 2024527725 A JP2024527725 A JP 2024527725A JP 2024541349 A JP2024541349 A JP 2024541349A
Authority
JP
Japan
Prior art keywords
ultrasonic
wire
wire bonding
tolerance
characteristic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024527725A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024541349A5 (https=
JPWO2023091429A5 (https=
Inventor
ブルナー、ジョン、ダブリュー．
チン、ウェイ
シャー、アーシシ
シュ、フイ
ヤン、チョン、ホ
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クリック アンド ソッファ インダストリーズ、インク． filed Critical クリック アンド ソッファ インダストリーズ、インク．
Publication of JP2024541349A publication Critical patent/JP2024541349A/ja
Publication of JP2024541349A5 publication Critical patent/JP2024541349A5/ja
Publication of JPWO2023091429A5 publication Critical patent/JPWO2023091429A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07113—Means for calibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
JP2024527725A 2021-11-16 2022-11-15 ワイヤーボンディングシステム上の超音波特性を較正する方法 Pending JP2024541349A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163280107P 2021-11-16 2021-11-16
US63/280,107 2021-11-16
PCT/US2022/049991 WO2023091429A1 (en) 2021-11-16 2022-11-15 Methods of calibrating an ultrasonic characteristic on a wire bonding system

Publications (3)

Publication Number Publication Date
JP2024541349A true JP2024541349A (ja) 2024-11-08
JP2024541349A5 JP2024541349A5 (https=) 2025-11-17
JPWO2023091429A5 JPWO2023091429A5 (https=) 2025-11-17

Family

ID=86324089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024527725A Pending JP2024541349A (ja) 2021-11-16 2022-11-15 ワイヤーボンディングシステム上の超音波特性を較正する方法

Country Status (6)

Country Link
US (2) US12113043B2 (https=)
JP (1) JP2024541349A (https=)
KR (1) KR20240100438A (https=)
CN (1) CN118266071A (https=)
TW (1) TW202333253A (https=)
WO (1) WO2023091429A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1343201A1 (de) * 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung"
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP2010056106A (ja) * 2008-08-26 2010-03-11 Nec Electronics Corp ワイヤボンディング装置、これを用いたワイヤボンディング方法
JP2011066191A (ja) * 2009-09-17 2011-03-31 Renesas Electronics Corp 半導体装置の製造方法およびボンディング装置
EP2833791B1 (en) * 2012-03-26 2022-12-21 Maui Imaging, Inc. Methods for improving ultrasound image quality by applying weighting factors
US9153554B2 (en) * 2012-04-22 2015-10-06 Kulicke And Soffa Industries, Inc. Methods of adjusting ultrasonic bonding energy on wire bonding machines
TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
KR101672510B1 (ko) * 2012-11-16 2016-11-03 가부시키가이샤 신가와 와이어 본딩 장치 및 와이어 본딩 방법
WO2014077026A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
US9620477B2 (en) * 2013-01-25 2017-04-11 Asm Technology Singapore Pte Ltd Wire bonder and method of calibrating a wire bonder
EP3717170B1 (de) * 2017-11-29 2024-01-10 Telsonic Holding AG Ultraschallbearbeitungsvorrichtung, verfahren zur konfiguration einer ultraschallbearbeitungsvorrichtung, system mit solcher ultraschallbearbeitungsvorrichtung
CN112385026B (zh) * 2018-07-11 2024-06-11 株式会社新川 打线接合装置

Also Published As

Publication number Publication date
US12113043B2 (en) 2024-10-08
TW202333253A (zh) 2023-08-16
KR20240100438A (ko) 2024-07-01
US20240404986A1 (en) 2024-12-05
US20230154888A1 (en) 2023-05-18
WO2023091429A1 (en) 2023-05-25
CN118266071A (zh) 2024-06-28

Similar Documents

Publication Publication Date Title
US9620477B2 (en) Wire bonder and method of calibrating a wire bonder
TWI895537B (zh) 引線接合機的操作方法，包括監視引線接合機上的接合力的精確度的方法，以及其相關方法
US9899348B2 (en) Wire bonding apparatus and method of manufacturing semiconductor device
TWI853032B (zh) 引線接合機上的接合引線及接合位置之間的接合檢測方法
CN105655263A (zh) 用于导线键合的拉伸测试的方法和系统
JPH02187286A (ja) 自動ワイヤ接着装置
CN103377959B (zh) 调整导线键合机上的超声键合能量的方法
JP2024541349A (ja) ワイヤーボンディングシステム上の超音波特性を較正する方法
TW202205483A (zh) 將半導體元件壓靠在引線接合機上的支撐結構上的夾持最佳化的方法、及相關方法
JP7612249B2 (ja) ワイヤボンディングシステム、検査装置、ワイヤボンディング方法、および、プログラム
TWI859868B (zh) 打線接合裝置及所述裝置的校準方法
Sun et al. Comprehensive Investigation of Insufficient IMC in SOIC Through Advanced Statistical Analysis
WO2022249243A1 (ja) ワイヤボンディング装置、メンテナンス方法、および、プログラム
Gillotti et al. Optimizing wire bonding processes for maximum factory portability
JP2023121542A (ja) 半導体製造装置及び半導体製造方法
JP2024047176A (ja) 半導体製造装置及び半導体製造方法
Klingert Analysis of wedge tool wear-out by machine data

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251107

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251107